JPH0311635B2 - - Google Patents
Info
- Publication number
- JPH0311635B2 JPH0311635B2 JP27024284A JP27024284A JPH0311635B2 JP H0311635 B2 JPH0311635 B2 JP H0311635B2 JP 27024284 A JP27024284 A JP 27024284A JP 27024284 A JP27024284 A JP 27024284A JP H0311635 B2 JPH0311635 B2 JP H0311635B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- less
- treatment
- temperature
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007639 printing Methods 0.000 claims description 74
- 229910000838 Al alloy Inorganic materials 0.000 claims description 28
- 238000000137 annealing Methods 0.000 claims description 27
- 238000001816 cooling Methods 0.000 claims description 10
- 238000002791 soaking Methods 0.000 claims description 10
- 239000012535 impurity Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000011282 treatment Methods 0.000 description 51
- 238000000034 method Methods 0.000 description 26
- 238000007788 roughening Methods 0.000 description 21
- 229910052782 aluminium Inorganic materials 0.000 description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 18
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- 239000007864 aqueous solution Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 10
- 238000010186 staining Methods 0.000 description 8
- 238000005097 cold rolling Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 238000005098 hot rolling Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- -1 hexafluorophosphate Chemical compound 0.000 description 5
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 206010016807 Fluid retention Diseases 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
- 239000004115 Sodium Silicate Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000010407 anodic oxide Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 229910017604 nitric acid Inorganic materials 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 4
- 229910052911 sodium silicate Inorganic materials 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 238000007743 anodising Methods 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000007670 refining Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 150000008049 diazo compounds Chemical class 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910018191 Al—Fe—Si Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 1
- ANBBXQWFNXMHLD-UHFFFAOYSA-N aluminum;sodium;oxygen(2-) Chemical compound [O-2].[O-2].[Na+].[Al+3] ANBBXQWFNXMHLD-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229940114081 cinnamate Drugs 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000008262 pumice Substances 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 229910001388 sodium aluminate Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/04—Printing plates or foils; Materials therefor metallic
- B41N1/08—Printing plates or foils; Materials therefor metallic for lithographic printing
- B41N1/083—Printing plates or foils; Materials therefor metallic for lithographic printing made of aluminium or aluminium alloys or having such surface layers
Landscapes
- Printing Plates And Materials Therefor (AREA)
Description
〔産業上の利用分野〕
本発明は粗面化したアルミニウム合金板表面
に、陽極酸化皮膜処理を施し、更に感光性物質を
塗布して形成される平版印刷版に使用される支持
体にかかわるものであつて、電気化学的粗面化処
理によつて均一な粗面が得られ、疲労強度と熱軟
化特性と印刷適性に優れた平版印刷版用支持体と
その製造方法に関するものである。
〔従来の技術〕
従来、平版印刷版として広く用いられているも
のは、粗面化処理、陽極酸化皮膜処理などの表面
処理を施したアルミニウム板上に感光性物質を塗
布し、乾燥させた所謂PS版に画像露光、現象、
水洗ラツカー盛り等の製版処理を施して得られた
印刷板である。この現像処理による未溶解の感光
層は画像部を形成し、感光層が除去されてその下
のアルミニウム表面が露出した部分は親水性の
為、水受容部となり、非画像部を形成することは
よく知られている事実である。
かかる平版印刷版用支持体としては、一般に軽
量で表面処理性、加工性、耐食性に優れたアルミ
ニウム板が使われており、この目的に供される従
来材としては、JIS1050(純度99.5重量%以上の純
Al)、JIS1100(Al−0.05〜0.20重量%Cu合金)、
JIS3003(Al−0.05〜0.20重量%Cu−1.5重量%Mn
合金)等の厚さ0.1〜0.8mmのアルミニウム合金板
であり、この表面を機械的方法、化学的方法、電
気化学的方法のいずれかの一、あるいは二以上組
み合わされた工程による粗面化法により粗面化
し、その後好ましくは陽極酸化処理を施したもの
である。
具体的には特開昭48−49501号公報に記載され
ている機械的粗面化処理、化学的エツチング処
理、陽極酸化皮膜処理を順に施したアルミニウム
平版印刷版、あるいは特開昭51−61304号公報に
記載されている化学的エツチング処理、陽極酸化
皮膜処理を順に施したアルミニウム平版印刷版、
特開昭54−146234号公報に記載されている電気化
学的処理、後処理、陽極酸化皮膜処理を施したア
ルミニム平版印刷版、特公昭48−28123号公報に
記載されている電気化学的処理、化学的エツチン
グ処理、陽極酸化皮膜処理を順に施したアルミニ
ウム平版印刷版、あるいは機械的粗面化処理後に
特公昭48−28123号公報に記載されている処理を
施したアルミニウム平版印刷版が知らている。こ
のような支持体の上に塗布された感光層を適当に
選ぶことにより10万枚にも及び鮮明な印刷物を得
ることが可能である。
しかし一枚の印刷版からそれ以上多数枚の印刷
物を得たいという要望(耐刷力の向上)がある。
このような場合アルミニウム合金板を支持体とす
るPS版を通常の方法で露光、現像処理した後、
高温で加熱処理(いわゆるバーニング処理)する
ことにより画像部を強化する方法が有効であり、
この方法については、特公昭44−27243号公報及
び特公昭44−27244号公報に詳細に記載されてい
る。このようなバーニング処理の加熱温度及び時
間は画像を形成している樹脂の種類にもよるが、
200〜280℃の範囲で3〜7分の範囲が通例であつ
た。
〔発明が解決しようとする問題点〕
近年バーニング処理に関して耐刷力向上とバー
ニング処理時間の短縮の理由から、より高い温度
でかつ短時間のバーニング処理が望まれている。
しかしながら従来から使用されてきたアルミ合金
板は280℃以上の高温で加熱した場合、アルミニ
ウムの再結晶現象を起し強度が極度に低下し、版
の腰がなくなるために版の取扱いが非常にむずか
しくなり、印刷機への版のセツトが不能になつた
り多色刷りにおける版の色の見当合わせができな
いなどの欠点が生じ、耐熱性に富む安定なアルミ
ニウム合金板が望まれている。
一方、印刷技術の進歩に伴ない印刷速度が上昇
した今日、印刷機の版胴の両端に機械的に固定さ
れる印刷版に加わる応力が増えたため強度が不足
する場合には、この固定部分が変形または破損し
て印刷ずれ等の障害を発したり、印刷板の折り曲
げ部に受ける繰返し応力により版が切れ(くわえ
切れ)、印刷不能となることが度々ある。
従来のJIS1050アルミニウム合金板は電気化学
的粗面化処理において均一な粗面や適切な表面粗
さが得られ、印刷中の非画像部の汚れが生じにく
いが耐疲労強度及び耐熱軟化特性が劣る。また従
来のJIS3003アルミニウム合金板は充分な耐疲労
強度、耐熱軟化特性を有するが、電気化学的粗面
化処理によつて均一な粗面や適切な表面粗さが得
られず、さらに印刷中に非画像部の汚れも生じや
すいという欠点があつた。
本発明者は特開昭58−42745号公報に記載され
ているように、粗面化処理により均一た粗面が得
られ、かつ耐疲労強度の優れた印刷版用アルミニ
ウム合金板とその製造方法を開発し、Mg0.05〜
0.30重量%、Si0.03〜0.30重量%、Fe0.15〜0.40重
量%、残部がAlと通常の不純物からなるアルミ
ニウム合金鋳塊を均熱処理して熱間圧延し、これ
に減面率70%以上の冷間圧延を加え、しかる後
150〜250℃の温度で1時間以上の低温焼鈍を行な
うことを特徴とする印刷版用アルミニウム合金板
の製造方法を提案した。
しかしながら近年印刷版に対する要求品質が向
上し、具体的には印刷中に非画像部の汚れが生じ
にくいことが望まれ、この点を更に改善すること
が要求されている。印刷中に非画像部の汚れを生
じにくくするためには非画像部の保水性の向上す
ることが重要であり、そのためには粗面化処理、
特に電気化学的粗面化処理により従来よりも優れ
た粗面の均一性を得る必要がある。
〔問題点を解決しようとするための手段〕
従つて本発明の目的は印刷版として充分な耐疲
労強度と耐熱軟化特性を有し、粗面化処理特に電
気化学的粗面処理により均一な粗面と適切な表面
粗さが得られ、印刷中に非画像部の汚れを生じに
くい平版印刷版用支持体を提供することである。
これについて本発明者等は種々研究の結果、
Mg0.05〜0.3重量%、Si0.02〜0.3重量%、Fe0.1〜
0.4重量%、Cu0.05重量%以下、残部がAlと通常
の不順物からなり、しかも内部に分布する単体Si
の存在量が0.005重量%以下とすることにより、
上記目的を達成する性能を有していることを見出
した。
上記支持体はMg0.05〜0.3重量%、Si0.02〜0.3
重量%、Fe0.1〜0.4重量%以下、Cu0.05重量%以
下、残部Alと通常の不純物からなるアルミニウ
ム合金鋳塊を均熱処理した後430℃以下の温度ま
で50℃/時以下の平均冷却速度で冷却するか又
は、350〜450℃の温度で30分以上保持してから、
熱間圧延又は熱間圧延後冷間圧延と中間焼鈍を行
ない、これに減面率70%以上の最終冷間圧延を加
え、しかる後連続焼鈍炉において250〜400℃の温
度で120秒以下調質焼鈍することによつて造られ
る。
〔作用〕
本発明において支持体の組成を上記のごとく限
定したのは下記の理由によるものである。
Mgは版面の粗面化処理及び印刷適性に悪影響
を与えることなく強度及び耐熱疲労強度を向上さ
せる目的で添加したものでAlに大部分固溶して
強度及び耐疲労度を向造するも、含有量が0.05重
量%未満(以下重量%を単に%と記す)では効果
が小さく、0.3%を越えると粗面化処理における
粗面の均一性が悪くなるためである。Feは耐疲
労強度を更に向上させる目的で添加したもので金
属間化合物を形成し、結晶粒を微細化して組織を
均一化するが0.1%未満では効果が小さく、0.4%
を越えると粗面化処理における粗面の均一性及び
印刷適性が悪くなるためである。Siを0.02〜0.3%
に限定したのは0.02%未満では強度が低下するか
らであり、0.3%を越えると電気化学的粗面化後
の粗面の均一性が悪くなるとともに単体Siが析出
し易くなるためである。
Cuを0.05%以下に限定したのは、不純物として
Cuが0.05%を越えると電気化学的粗面化処理によ
つて生成する凹部(ピツト)が粗大になりやす
く、又、印刷版として非画像部の耐汚れ性が低下
するからである。また単体Siの存在量を0.005%
以下と限定したのは、単体Siが陽極酸化処理によ
り陽極酸化皮膜中に残存し、印刷中に非画像部の
汚れ発生の起点となるためであり、単体Siの存在
量を0.005%以下に規制することにより、非画像
部の汚れが発生しにくい、印刷適性の極めて優れ
た印刷版とすることができる。
本発明における平版印刷版用支持体を構成する
アルミニウム合金中に含まれる不純物としては、
通常市販されているAl地金に含まれる不純物程
度あれば本発明の目的を損なうものではない。即
ちMn0.05%以下、Cr0.05%以下、Zn0.05%以下
ならば特に問題はない。
又鋳塊の製造に際し、結晶微細化剤として通常
使用されているTi、BはTi0.03%以下、B0.01%
以下の添加であれば合金組織の均一微細化に有効
である。
このように本発明における平版印刷版用支持体
はその製造において前記組成のアルミニウム合金
鋳塊を均熱処理して、Mg及び不純物を固溶させ
るとともにFeの一部を固溶させ、一部のFeの金
属間化合物を均一微細に分散させる。この均熱処
理は500〜620℃の温度で3時間以上行なうことが
望ましい。次にこれを430℃以下の温度に達する
まで50℃/時以下の平均冷却速度で冷却するか、
又は350〜450℃の温度で30分以上保持することに
より鋳塊中に含まれるSi原子をAl−Fe−Si系の
金属間化合物として析出させ、続く工程での単体
Si析出量を減じる。しかる後通常の方法で熱間圧
延し、又は熱間圧延後冷間圧延と中間焼鈍を行な
う。熱間圧延温度は450〜200℃で行なうのが適当
であり又必要に応じて行なう熱間圧延後の中間焼
鈍は300〜450℃で2〜5時間あるいは連続焼鈍炉
において400〜550℃で120秒以下行なうことが望
ましい。
このようにして得られた板は減面率が70%以上
となるように最終冷間圧延される。この最終冷間
圧延において金属間化合物が分散し、結晶組織が
均一となる。この減面率が70%未満では、金属間
化合物の分散が不充分で結晶組織が不均一とな
り、粗面化処理において均一な粗面が得られな
い。このようにして得られた圧延板を連続焼鈍炉
において250〜400℃好ましくは270〜350℃の温度
で120秒以下急速調質焼鈍する。このような条件
で調質焼鈍するのは圧延板に適度の機械的性質、
即ち適度の強度と伸びを与え、耐熱軟化特性をも
向上させると同時に単体Siの析出を極力おさえる
ことによつて粗面化によるピツト形状が均一で表
面粗さも適切なものが得られ、その結果印刷中の
非画像部の保水性と耐汚れ性を向上させるためで
ある。謂質焼鈍条件が250℃未満もしくは400℃を
越えた場合、または処理時間が120秒を越えた場
合は充分な耐疲労強度と耐熱軟化特性が得られず
単体Siの析出により粗面化によるピツト形状も不
均一になり、非画像部の保水性と耐汚れ性が低下
する。このようにして製造した本発明平版印刷版
用支持体は粗面化処理により、JIS1050アルミニ
ウム合金よりもさらに均一なピツト形状と適切な
表面粗さが得られ、非画像部の保水性と耐汚れ性
が向上するだけでなく、耐疲労強度、耐熱軟化特
性に優れたものが得られる。
次に本発明による平版印刷版用支持体の表面処
理方法について詳細に説明する。
本発明における砂目立て方法は塩酸又は硝酸電
解液中で電気化学的に砂目立てする電気化学的砂
目立て法、及びアルミニウム表面を金属ワイヤー
でひつかくワイヤーブラシグレイン法、研摩球と
研摩剤でアルミニウム表面を砂立てするボールグ
レイン法、ナイロンブラシと研摩剤で表面を砂立
てするブラシグレイン法のような機械的砂目立て
法を用いることができ、上記のいずれの砂目立て
方法を単独あるいは組合せて用いることもでき
る。
このように砂目立て処理したアルミニウムは、
酸又はアルカリにより化学的にエツチングされ
る。酸をエツチング剤として用いた場合は、微細
構造を破壊するのに非常に時間がかかり、工業的
に本発明を適用するに際しては不利であるが、ア
ルカリをエツチング剤として用りることにより改
善できる。
本発明において好適に用いられるアルカリ剤
は、苛性ソーダ、炭酸ソーダ、アルミン酸ソー
ダ、メタ珪酸ソーダ、燐酸ソーダ、水酸化カリウ
ム、水酸化リチウム等を用い、濃度と温度の好ま
しい範囲はそれぞれ1〜50%、20〜100℃であり
Alの溶解量が5〜20g/m2となるような条件が
好ましい。
エツチングのあと表面に残留する汚れ(スマツ
ト)を除去するために酸洗いが行なわれる。用い
られる酸は硝酸、硫酸、リン酸、クロム酸、ふつ
酸、ほうふつ化水素酸等が用いられる。特に電気
化学的粗面化処理後のスマツト除去処理には好ま
しくは特開昭33−12739号公報に記載されている
ような50〜90℃の温度の15〜65重量%の硫酸と接
触させる方法及び特公昭48−28123号公報に記載
されているアルカリエツチングする方法である。
以上のようにして処理されたアルミニウム板は
平版印刷版用支持体として使用することができる
が、更に必要に応じて陽極酸化皮膜処理、化成処
理などの処理を施すことが好ましい。
陽極酸化処理はこの分野で従来より行なわれて
いる方法で行なうことができる。具体的には硫
酸、リン酸、クロム酸、修酸、スミフアルミン
酸、ベンゼンスルホン酸等あるいはこれらの二種
類以上を組み合わせた水溶液又は非水溶液中でア
ルミニウムに直流または交流の電流を流すとアル
ミニウム支持体表面に陽極酸化皮膜を形成するこ
とができる。
陽極酸化の処理条件は使用される電解液によつ
て種々変化するので一概には決定され得ないが、
一般的には電解液の濃度が1〜80%、液温5〜70
℃、電流密度0.5〜60アンペア/dm2、電圧1〜
100V、電解時間10〜100秒の範囲が適当である。
これらの陽極酸化皮膜処理の内でも特に英国特
許第1412768号明細書に記載されている発明で使
用されている、硫酸中で高電流密度で陽極酸化す
る方法及び米国特許第3511661号明細書に記載さ
れているリン酸を電解浴として陽極酸化する方法
が好ましい。
陽極酸化されたアルミニウム板は更に米国特許
第2714066号及び同第3181461号の各明細書に記さ
れている様にアルカリ金属シリケート、例えば珪
酸ナトリウムの水溶液で浸漬などの方法により処
理したり、米国特許第3860426号明細書に記載さ
れているように、水溶性金属塩(例えば酢酸亜鉛
など)を含む親水性セルロース(例えば、カルボ
キシメチルセルロースなど)の下塗り層を設ける
こともできる。
本発明による平版印刷版用支持体の上には、
PS版の感光層として従来より知られている感光
層の設けて感光性平版印刷版を得ることができ、
これを製版処理して得た平版印刷版はすぐれた性
能を有している。
上記感光層の組成物としては次のようなもが含
まれる。
ジアゾ樹脂とバインダーとからなる感光層
米国特許第2063631号及び同第1667415号の各
明細書に開示されているジアゾニウム塩とアル
ドールやアセタールのような反応性カルボニル
基を含有する有機縮合剤との反応生成物である
ジフエニルアミン−p−ジアゾニウム塩とホル
ムアルデヒドとの縮合性成物(所謂感光性ジア
ゾ樹脂)が好適に用いられる。この他の有用な
縮合ジアゾ化合物は特公昭49−48001号、同49
−45322号、同49−45323号の各公報等に開示さ
れている。
これらの型の感光性ジアソ化合物は通常水溶
性無機塩の型で得られ、従つて水溶液から塗布
することができる。又はこれらの水溶性ジアゾ
化合物を特公昭47−1167号公報に開示された方
法により1個又はそれ以上のフエノール性水酸
基、スルホン酸基又はその両者を有する芳香族
又は脂肪族化合物と反応させ、その反応生成物
である実質的に水不溶性の感光性ジアゾ樹脂を
使用することもできる。また、特開昭56−
121031号公報に記載されているようにヘキサフ
ルオロ燐酸塩またはテトラフルオロ硼酸塩との
反応生成物として使用することもできる。その
ほか英国特許第1312925号明細書に記載されて
いるジアゾ樹脂も好ましい。
O−キノンジアジド化合物からなる感光層
特に好ましいO−キノンジアジド化合物はO
−ナフトキノンジアジド化合物であり例えば米
国特許第2766118号、同第2767092号、同第
2772972号、同第2859112号、同第2907665号、
同第3046110号、同第3046111号、同第3046115
号、同第3046118号、同第3046119号、同第
3046120号、同第3046121号、同第3046122号、
同第3046123号、同第3061430号、同第3102809
号、同第3106465号、同第3635709号、同第
3647443号の各明細書をはじめ多数の刊行物に
記されており、これらは好適に使用することが
できる。
アジド化合物のバインダー(高分子化合物か
らなる感光層)
例えば英国特許第1235281号、同第1495861号
の各明細書及び特開昭51〜32331号公報、同51
−36128号公報に記載されているアジド化合物
と水溶液またはアルカリ可溶性高分子化合物か
らなる組成物の他、特開昭50−5102号、同50−
84302号、同50−84303号、同53−12984号の各
公報に記されているアジド基を含むポリマーと
バインダーとしての高分子化合物からなる組成
物が含まれる。
その他の感光性樹脂層
例えば特開昭52−96696号公報に開示されて
いるポリエステル化合物、英国特許第112277
号、同第1313309号公報、同第1341004号公報、
同第1377747号等の各明細書に記載のポリビニ
ルシンナメート系樹脂、米国特許第4072528号
及び同第4072527号の各明細書などのに記され
ている光重合型フオトポリマー組成物が含まれ
る。
支持体上に設けられる感光層の量は、約0.1
〜約7g/m2、好ましくは0.5〜4g/m2の範
囲である。
PS版は画像露出されたのち、常法により現
像を含む処理によつて樹脂画像が形成される。
例えばジアゾ樹脂とバインダーとからなる前記
感光層を有するPS版の場合には画像露出後、
未露光部分の感光層が現象により除去されて平
版印刷版が得られる。また感光層を有する
PS版の場合には画像露光後、アルカリ水溶液
で現像することにより露光部分が除去されて平
版印刷版が得られる。
現像処理後、印刷版は所望により適宜後処理
が施される。
後処理において、最も関連のある処理は画像
部分の強化のためのバーニングである。バーニ
ングについては、たとえば特開昭52−6205号、
特開昭51−34001号、特公昭55−28062公報、特
公開昭57−3938号公報及び米国特許第4191570
号明細書などに記載されているが、基本的には
バーニングは温度150〜350℃の雰囲気中に現像
済みの印刷版を置き、版面の画像部分を焼結、
硬化させることである。
この場合、バーニングの前あるいは後にたと
えばほう酸やほう酸塩、アニオン性界面活性剤
あるいは他の特定化学構造式を有する化合物の
水溶液を版画に供給させることが好ましい。
これにより、バーニングによる種々の弊害を
防ぐことができる。バーニング温度は処理時間
と共にバーニング効果に関連し、処理時間3〜
10分程度あれば180〜300℃の温度で行なうこと
ができる。
以下実施例により本発明を更に詳しく説明す
る。なお、%は他に指定のない限り重量%を示
すものとする。
実施例 1
第1表に示す組成のアルミニウム合金No.1〜No.
12を溶解鋳造し、両面を面削して圧さ350mm、長
さ2000mmの鋳塊とし、これを560℃の温度で10時
間均熱処理した。これを420℃の温度で3時間加
熱処理してから420〜250℃の温度で熱間圧延し板
厚4.5mmとした後、更に板厚0.3mmまで令間厚延
(減面率93.3%)した。これらを連続的に焼鈍炉
を通して300℃で30秒間の調質焼鈍を施し、平版
印刷版用アルミニウム合金板を製造した。
次にNo.1〜No.12のアルミニウム合金圧延板及び
No.13(板厚0.30mmJIS1050−H18アルミニウム合
金)、No.14(板厚0.30mmJIS1100−H16アルミニウ
ム合金)、No.15(板厚0.30mmJIS3003−H14アルミ
ニウム合金)をパミストンと水の懸濁液中で回転
ナイロンブラシで砂目立て処理したのち、苛性ソ
ーダ20%水溶液を用いてアルミニウムの溶解量が
5g/m2となるようにエツチングした。流水で充
分に洗つたのち25%硝酸水溶液で酸洗し、水洗し
て基板を用意した。このように用意した基板を特
開昭54−146234号公報に記載されているように、
硝酸0.5〜2.5%を含む電解浴中で電流密度20A/
dm2以上で交流電解した。ひきつづき15%硫酸の
50℃水溶液に3分間浸漬して表面を清浄化したの
ち20%の硫酸を主成分とする電解液中で浴温30℃
で3g/m2の酸化皮膜を設けた。
このようにして作成したサンプルに下記の感光
層を乾燥時の塗布量が2.5g/m2となるように設
けた。
ナフトキノン−1,2−ジアジド−5−スルホニ
ルクロライドとピロガロール、アセトン樹脂との
エステル化合物(米国特許3635709号明細書実施
例に記載されているもの)
クレゾールノボラツク樹脂 2.00g
オイルブルー#603(オリエント化学製) 0.04g
エチレンジクロライド 16g
2−メトキシエチルアセテート 12g
かくして得られた感光性平版印刷版を透明陽画
に密着させて1mの距離からPSライト〔東芝メ
タルハライドランプMU2000−2−OL型3KWの
光源を有し、富士写真フイルム(株)より販売されて
いるもの〕で30秒間露光を行なつた後珪酸ナトリ
ウム5%水溶液に約1分間浸漬して現像し、水
洗、乾燥し試料No.1〜No.15を作成した。
このようにして作成した試料No.1〜No.15の電解
エツチング粗面の均一性、非画像部の汚れ、疲労
強度、熱軟化特性について試験を実施し、その結
果を第1表に示す。
(試験方法)
(1) 電解エツチング粗面の均一性
表面状態を走査型電子顕微鏡にて観察し、ピ
ツトの均一性を評価し優れたもの○印、良好な
もの△印、劣るもの×印で表わした。
(2) 非画像部の汚れ
オフセツト印刷機KORにて非画像部の汚れ
を評価し、特に優れたもの◎印、優れたもの○
印、良好なもの△印、劣るもの×印で表わし
た。
(3) 疲労強度
それぞれの試料から巾20mm、長さ100mmの試
験片を切り出し、一端を治具に固定し、他端を
上方に30°の角度に曲げ、これを元の位置に戻
し、これを1回として破断までの回数を測定し
た。
(4) 熱軟化特性
バーニグプロセツサー1300[12KWの熱源を
有する富士写真フイルム(株)製バーニグプロセツ
サー]中で試料を300℃、7分間加熱した。冷
却後JIS5号試験片を作成し、引張試験による
0.2%耐力値を測定した。尚、単体Si量は分析
化学便覧記載の分析方法により定量分析した。
[Industrial Application Field] The present invention relates to a support used in a lithographic printing plate formed by subjecting the surface of a roughened aluminum alloy plate to an anodic oxidation film treatment and further coating a photosensitive substance. The present invention relates to a support for a lithographic printing plate that can obtain a uniformly roughened surface by electrochemical surface roughening treatment and has excellent fatigue strength, thermal softening properties, and printability, and a method for producing the same. [Prior Art] Conventionally, planographic printing plates widely used are so-called aluminum plates that have been subjected to surface treatments such as roughening treatment and anodic oxidation coating, on which a photosensitive substance is applied and dried. Image exposure, phenomena,
This is a printing plate obtained by performing a plate-making process such as washing and lacquering. The undissolved photosensitive layer resulting from this development process forms an image area, and the area where the photosensitive layer is removed and the underlying aluminum surface is exposed is hydrophilic, so it becomes a water receiving area and does not form a non-image area. This is a well-known fact. Generally, aluminum plates are used as supports for lithographic printing plates, which are lightweight and have excellent surface treatment properties, workability, and corrosion resistance. pure
Al), JIS1100 (Al-0.05~0.20 wt% Cu alloy),
JIS3003 (Al-0.05~0.20wt%Cu-1.5wt%Mn
This is an aluminum alloy plate with a thickness of 0.1 to 0.8 mm, such as aluminum alloy), and the surface is roughened by one or a combination of mechanical, chemical, and electrochemical methods. The surface is roughened, and then preferably subjected to anodic oxidation treatment. Specifically, an aluminum lithographic printing plate subjected to mechanical roughening treatment, chemical etching treatment, and anodized film treatment described in JP-A-48-49501, or JP-A-51-61304. An aluminum lithographic printing plate that has been subjected to chemical etching treatment and anodized film treatment as described in the publication,
Aluminum lithographic printing plates subjected to electrochemical treatment, post-treatment, and anodic oxide film treatment described in JP-A-54-146234, electrochemical treatment described in JP-A-48-28123, Aluminum lithographic printing plates that have been subjected to chemical etching treatment and anodic oxidation film treatment, or aluminum lithographic printing plates that have been subjected to the treatment described in Japanese Patent Publication No. 48-28123 after mechanical roughening treatment are known. . By appropriately selecting the photosensitive layer coated on such a support, it is possible to obtain up to 100,000 sheets of clear printed matter. However, there is a desire to obtain more printed matter from one printing plate (improvement of printing durability).
In such cases, after exposing and developing the PS plate using an aluminum alloy plate as a support in the usual way,
An effective method is to strengthen the image area by heat treatment at high temperatures (so-called burning treatment).
This method is described in detail in Japanese Patent Publication No. 44-27243 and Japanese Patent Publication No. 44-27244. The heating temperature and time for such a burning process depend on the type of resin forming the image, but
The usual range was 3 to 7 minutes at a temperature of 200 to 280°C. [Problems to be Solved by the Invention] In recent years, there has been a desire for a burning treatment at a higher temperature and for a shorter time in order to improve printing durability and shorten the burning treatment time.
However, when the conventionally used aluminum alloy plates are heated to a high temperature of 280°C or higher, the aluminum recrystallizes, resulting in an extremely low strength and a loss of stiffness, making the plates extremely difficult to handle. This results in disadvantages such as the inability to set the plate on the printing machine and the inability to register the colors of the plate in multicolor printing, and therefore a stable aluminum alloy plate with high heat resistance is desired. On the other hand, today, as printing speeds have increased due to advances in printing technology, the stress applied to the printing plate, which is mechanically fixed to both ends of the plate cylinder of the printing press, has increased, so if the strength is insufficient, this fixed part may be It often becomes deformed or damaged, causing problems such as printing misalignment, or the plate breaks (grip breakage) due to repeated stress applied to the folded portion of the printing plate, making printing impossible. Conventional JIS1050 aluminum alloy plates can obtain uniform roughness and appropriate surface roughness through electrochemical roughening treatment, and stains in non-image areas during printing are less likely to occur, but fatigue resistance and heat softening resistance are inferior. . In addition, conventional JIS3003 aluminum alloy plates have sufficient fatigue strength and heat softening resistance, but electrochemical roughening treatment does not provide a uniform or appropriate surface roughness, and furthermore, during printing, A drawback was that non-image areas were easily smeared. The present inventor has developed an aluminum alloy plate for printing plates which can obtain a uniform rough surface by roughening treatment and has excellent fatigue strength, and a method for manufacturing the same, as described in Japanese Patent Application Laid-open No. 58-42745. developed, Mg0.05~
An aluminum alloy ingot consisting of 0.30% by weight, 0.03 to 0.30% by weight of Si, 0.15 to 0.40% by weight of Fe, and the balance being Al and normal impurities is soaked and hot rolled to give an area reduction of 70%. After applying the above cold rolling,
A method for manufacturing an aluminum alloy plate for printing plates was proposed, which is characterized by performing low-temperature annealing at a temperature of 150 to 250°C for one hour or more. However, in recent years, the quality required for printing plates has improved, and specifically, it is desired that non-image areas become less stained during printing, and further improvements in this respect are required. In order to prevent stains in non-image areas during printing, it is important to improve the water retention of non-image areas, and for this purpose roughening treatment,
In particular, it is necessary to obtain better uniformity of the roughened surface than in the past by electrochemical surface roughening treatment. [Means for Solving the Problems] Accordingly, the object of the present invention is to provide a printing plate with sufficient fatigue strength and heat softening resistance, and to provide a uniform roughness by surface roughening treatment, particularly electrochemical surface roughening treatment. It is an object of the present invention to provide a support for a lithographic printing plate, which has a suitable surface roughness and is less likely to cause stains in non-image areas during printing.
As a result of various studies regarding this, the present inventors found that
Mg0.05~0.3wt%, Si0.02~0.3wt%, Fe0.1~
0.4% by weight, less than 0.05% by weight of Cu, and the remainder consists of Al and normal impurities, and single Si distributed inside.
By setting the amount of 0.005% by weight or less,
It has been found that this product has the ability to achieve the above objectives. The above support has Mg0.05-0.3% by weight and Si0.02-0.3
After soaking an aluminum alloy ingot consisting of 0.1 to 0.4 wt% Fe, 0.05 wt% or less Cu, and the balance Al and normal impurities, the average cooling rate is 50°C/hour or less to a temperature of 430°C or less. After cooling at a high speed or holding at a temperature of 350-450℃ for more than 30 minutes,
Hot rolling or hot rolling followed by cold rolling and intermediate annealing, followed by final cold rolling with an area reduction of 70% or more, followed by tempering in a continuous annealing furnace at a temperature of 250 to 400°C for 120 seconds or less. Made by tempering. [Function] The reason why the composition of the support is limited as described above in the present invention is as follows. Mg is added for the purpose of improving the strength and thermal fatigue resistance without adversely affecting plate surface roughening treatment and printing suitability, and Mg is mostly dissolved in Al to improve strength and fatigue resistance. This is because if the content is less than 0.05% by weight (hereinafter, % by weight is simply referred to as %), the effect will be small, and if it exceeds 0.3%, the uniformity of the roughened surface in the surface roughening treatment will deteriorate. Fe is added to further improve fatigue strength, forming intermetallic compounds, refining crystal grains, and making the structure uniform, but if it is less than 0.1%, the effect is small, and if it is less than 0.4%
This is because if it exceeds this, the uniformity of the rough surface in the roughening treatment and the printability will deteriorate. Si 0.02~0.3%
The reason for this limitation is that if it is less than 0.02%, the strength will decrease, and if it exceeds 0.3%, the uniformity of the roughened surface after electrochemical roughening will deteriorate and elemental Si will be likely to precipitate. The reason for limiting Cu to 0.05% or less is that it is considered an impurity.
This is because if the Cu content exceeds 0.05%, pits formed by electrochemical surface roughening treatment tend to become coarse, and the stain resistance of non-image areas of the printing plate decreases. In addition, the amount of elemental Si was reduced to 0.005%.
The reason for limiting the amount of elemental Si to the following is that elemental Si remains in the anodic oxide film due to anodizing treatment and becomes the starting point for staining in non-image areas during printing, so the amount of elemental Si present is restricted to 0.005% or less. By doing so, it is possible to obtain a printing plate that is less likely to be smudged in non-image areas and has extremely excellent printability. Impurities contained in the aluminum alloy constituting the lithographic printing plate support in the present invention include:
The purpose of the present invention will not be impaired if the impurities are contained in Al ingots that are usually commercially available. That is, there is no particular problem if Mn is 0.05% or less, Cr is 0.05% or less, and Zn is 0.05% or less. In addition, when manufacturing ingots, Ti and B, which are usually used as crystal refining agents, contain less than 0.03% of Ti and 0.01% of B.
The following additions are effective in uniformly refining the alloy structure. As described above, in manufacturing the lithographic printing plate support of the present invention, an aluminum alloy ingot having the above composition is subjected to soaking treatment to dissolve Mg and impurities in solid solution, as well as a part of Fe. The intermetallic compounds are uniformly and finely dispersed. This soaking treatment is preferably carried out at a temperature of 500 to 620°C for 3 hours or more. This is then cooled at an average cooling rate of 50°C/hour or less until it reaches a temperature of 430°C or less, or
Alternatively, by holding the ingot at a temperature of 350 to 450°C for 30 minutes or more, the Si atoms contained in the ingot are precipitated as an Al-Fe-Si intermetallic compound, and then used as a single substance in the subsequent process.
Reduces the amount of Si precipitation. Thereafter, hot rolling is carried out in a conventional manner, or cold rolling and intermediate annealing are performed after hot rolling. It is appropriate to carry out hot rolling at a temperature of 450 to 200°C, and if necessary, intermediate annealing after hot rolling is performed at 300 to 450°C for 2 to 5 hours or in a continuous annealing furnace at 400 to 550°C for 120 hours. It is desirable to do this in less than a second. The plate thus obtained is finally cold rolled so that the reduction in area is 70% or more. In this final cold rolling, intermetallic compounds are dispersed and the crystal structure becomes uniform. If the area reduction rate is less than 70%, the intermetallic compound will not be sufficiently dispersed and the crystal structure will be non-uniform, making it impossible to obtain a uniformly roughened surface in the surface roughening treatment. The thus obtained rolled plate is rapidly annealed in a continuous annealing furnace at a temperature of 250 to 400°C, preferably 270 to 350°C for 120 seconds or less. Temper annealing under these conditions gives the rolled plate appropriate mechanical properties.
In other words, by providing appropriate strength and elongation and improving heat softening resistance, and at the same time suppressing the precipitation of elemental Si as much as possible, a uniform pit shape and appropriate surface roughness can be obtained by roughening the surface. This is to improve water retention and stain resistance of non-image areas during printing. If the so-called quality annealing conditions are lower than 250℃ or higher than 400℃, or if the treatment time exceeds 120 seconds, sufficient fatigue resistance and heat softening resistance will not be obtained, and pits will occur due to surface roughening due to precipitation of elemental Si. The shape also becomes non-uniform, and the water retention and stain resistance of non-image areas decrease. The support for the lithographic printing plate of the present invention produced in this way has a more uniform pit shape and appropriate surface roughness than JIS1050 aluminum alloy due to the surface roughening treatment, and has good water retention and stain resistance in non-image areas. In addition to improved properties, products with excellent fatigue resistance and heat softening resistance can be obtained. Next, a method for surface treating a lithographic printing plate support according to the present invention will be explained in detail. The graining methods used in the present invention include an electrochemical graining method that electrochemically grains the grain in a hydrochloric acid or nitric acid electrolyte, a wire brush graining method that scratches the aluminum surface with a metal wire, and an abrasive ball and abrasive agent that polishes the aluminum surface. Mechanical graining methods such as the ball grain method, which sands the surface, and the brush grain method, which sands the surface using a nylon brush and abrasive, can be used, and any of the above graining methods can be used alone or in combination. You can also do it. Aluminum grained in this way is
Chemically etched with acid or alkali. When an acid is used as an etching agent, it takes a very long time to destroy the microstructure, which is disadvantageous when applying the present invention industrially, but this can be improved by using an alkali as an etching agent. . The alkaline agents preferably used in the present invention include caustic soda, soda carbonate, sodium aluminate, sodium metasilicate, sodium phosphate, potassium hydroxide, lithium hydroxide, etc., and the preferred ranges of concentration and temperature are 1 to 50% for each. , 20~100℃
Conditions are preferable such that the amount of Al dissolved is 5 to 20 g/m 2 . After etching, pickling is performed to remove any dirt (smut) remaining on the surface. The acids used include nitric acid, sulfuric acid, phosphoric acid, chromic acid, hydrofluoric acid, and hydrofluoric acid. In particular, for smut removal treatment after electrochemical surface roughening treatment, it is preferable to contact with 15 to 65% by weight sulfuric acid at a temperature of 50 to 90°C as described in JP-A-33-12739. and the alkali etching method described in Japanese Patent Publication No. 48-28123. The aluminum plate treated as described above can be used as a support for a lithographic printing plate, but it is preferable to further perform treatments such as anodization coating treatment and chemical conversion treatment as necessary. The anodic oxidation treatment can be performed by a method conventionally used in this field. Specifically, when a direct current or alternating current is passed through aluminum in an aqueous or non-aqueous solution such as sulfuric acid, phosphoric acid, chromic acid, oxalic acid, sumiphalic acid, benzenesulfonic acid, etc. or a combination of two or more of these, aluminum supports. An anodic oxide film can be formed on the surface. The treatment conditions for anodic oxidation vary depending on the electrolyte used, so they cannot be determined unconditionally.
Generally, the concentration of electrolyte is 1~80%, and the temperature of the electrolyte is 5~70%.
°C, current density 0.5~60 ampere/ dm2 , voltage 1~
A range of 100V and electrolysis time of 10 to 100 seconds is appropriate. Among these anodic oxide film treatments, the method of anodizing at high current density in sulfuric acid used in the invention described in British Patent No. 1412768 and the method described in U.S. Patent No. 3511661 are particularly A method of anodizing using phosphoric acid as an electrolytic bath is preferred. The anodized aluminum plate may be further treated by dipping in an aqueous solution of an alkali metal silicate, such as sodium silicate, as described in U.S. Pat. As described in US Pat. No. 3,860,426, a subbing layer of hydrophilic cellulose (such as carboxymethylcellulose) containing a water-soluble metal salt (such as zinc acetate) may also be provided. On the lithographic printing plate support according to the present invention,
A photosensitive lithographic printing plate can be obtained by providing a photosensitive layer conventionally known as a photosensitive layer of a PS plate,
The lithographic printing plate obtained by plate-making this has excellent performance. The composition of the photosensitive layer includes the following. Photosensitive layer consisting of a diazo resin and a binder Reaction of a diazonium salt disclosed in the specifications of U.S. Pat. A condensable compound of the product diphenylamine-p-diazonium salt and formaldehyde (so-called photosensitive diazo resin) is preferably used. Other useful condensed diazo compounds are listed in Japanese Patent Publication No. 49-48001 and Japanese Patent Publication No. 49-49.
-45322, 49-45323, etc. These types of photosensitive diaso compounds are usually obtained in the form of water-soluble inorganic salts and can therefore be coated from an aqueous solution. Alternatively, these water-soluble diazo compounds can be reacted with an aromatic or aliphatic compound having one or more phenolic hydroxyl groups, sulfonic acid groups, or both, by the method disclosed in Japanese Patent Publication No. 1167/1983. It is also possible to use substantially water-insoluble photosensitive diazo resins which are reaction products. Also, JP-A-56-
It can also be used as a reaction product with hexafluorophosphate or tetrafluoroborate as described in JP 121031. In addition, diazo resins described in British Patent No. 1312925 are also preferred. Photosensitive layer made of O-quinonediazide compound Particularly preferred O-quinonediazide compound is O-quinonediazide compound.
- naphthoquinone diazide compounds, such as U.S. Patent Nos. 2766118, 2767092,
No. 2772972, No. 2859112, No. 2907665,
Same No. 3046110, Same No. 3046111, Same No. 3046115
No. 3046118, No. 3046119, No. 3046119, No. 3046118, No. 3046119, No.
No. 3046120, No. 3046121, No. 3046122,
Same No. 3046123, Same No. 3061430, Same No. 3102809
No. 3106465, No. 3635709, No. 3635709, No. 3106465, No. 3635709, No.
It is described in numerous publications including the specifications of No. 3647443, and these can be suitably used. Binder of azide compound (photosensitive layer made of a polymer compound) For example, the specifications of British Patent No. 1235281 and British Patent No. 1495861, and Japanese Patent Application Laid-Open No. 1983-32331, British Patent No.
In addition to the composition comprising an azide compound and an aqueous solution or an alkali-soluble polymer compound described in Japanese Patent Application Laid-open No. 50-5102 and Japanese Patent Application Laid-open No. 50-50-
Included are compositions comprising an azide group-containing polymer and a polymer compound as a binder, as described in Publications No. 84302, No. 50-84303, and No. 53-12984. Other photosensitive resin layers For example, polyester compounds disclosed in JP-A-52-96696, British Patent No. 112277
No. 1313309, No. 1341004,
Included are polyvinyl cinnamate resins described in U.S. Pat. No. 1,377,747 and other specifications, and photopolymerizable photopolymer compositions described in U.S. Pat. The amount of photosensitive layer provided on the support is approximately 0.1
to about 7 g/m 2 , preferably from 0.5 to 4 g/m 2 . After the PS plate is image exposed, a resin image is formed by processing including development using conventional methods.
For example, in the case of a PS plate having the photosensitive layer made of a diazo resin and a binder, after image exposure,
The unexposed portions of the photosensitive layer are removed by a phenomenon to obtain a lithographic printing plate. Also has a photosensitive layer
In the case of a PS plate, after image exposure, the exposed portion is removed by developing with an alkaline aqueous solution to obtain a lithographic printing plate. After the development treatment, the printing plate is subjected to appropriate post-treatment as desired. In post-processing, the most relevant process is burning for enhancement of image parts. Regarding burning, for example, JP-A No. 52-6205,
JP 51-34001, JP 55-28062, JP 57-3938, and U.S. Patent No. 4191570
Although it is described in the specification of the issue, basically, burning is a process in which a developed printing plate is placed in an atmosphere with a temperature of 150 to 350°C, and the image part of the plate is sintered.
It is to harden. In this case, it is preferable to supply the print with an aqueous solution of, for example, boric acid, a borate salt, an anionic surfactant, or another compound having a specific chemical structure, before or after burning. Thereby, various harmful effects caused by burning can be prevented. The burning temperature is related to the burning effect along with the processing time, and the processing time is 3~
It can be carried out at a temperature of 180 to 300°C for about 10 minutes. The present invention will be explained in more detail with reference to Examples below. Note that % indicates weight % unless otherwise specified. Example 1 Aluminum alloys No. 1 to No. 1 with the compositions shown in Table 1.
No. 12 was melted and cast, and both sides were face-milled to obtain an ingot with a pressure of 350 mm and a length of 2000 mm, which was soaked at a temperature of 560°C for 10 hours. This was heat treated at a temperature of 420℃ for 3 hours, then hot rolled at a temperature of 420 to 250℃ to a thickness of 4.5mm, and then further thick-rolled to a thickness of 0.3mm (area reduction rate of 93.3%). did. These were continuously passed through an annealing furnace and subjected to temper annealing at 300°C for 30 seconds to produce an aluminum alloy plate for lithographic printing plates. Next, No. 1 to No. 12 aluminum alloy rolled plates and
No. 13 (plate thickness 0.30mm JIS1050-H18 aluminum alloy), No. 14 (plate thickness 0.30mm JIS1100-H16 aluminum alloy), No. 15 (plate thickness 0.30mm JIS3003-H14 aluminum alloy) in a suspension of pumice stone and water. After graining with a rotating nylon brush, etching was performed using a 20% aqueous solution of caustic soda so that the amount of aluminum dissolved was 5 g/m 2 . After thoroughly washing with running water, pickling was carried out with a 25% nitric acid aqueous solution, and the substrate was prepared by washing with water. The substrate prepared in this way was processed as described in Japanese Patent Application Laid-open No. 146234/1983.
Current density 20A/in an electrolytic bath containing 0.5-2.5% nitric acid
AC electrolysis was carried out at dm 2 or more. Continued with 15% sulfuric acid
After cleaning the surface by immersing it in a 50℃ aqueous solution for 3 minutes, it was placed in an electrolytic solution containing 20% sulfuric acid as a main component at a bath temperature of 30℃.
An oxide film of 3 g/m 2 was provided. The following photosensitive layer was provided on the sample prepared in this manner so that the dry coating amount was 2.5 g/m 2 . Ester compound of naphthoquinone-1,2-diazido-5-sulfonyl chloride, pyrogallol, and acetone resin (described in the Examples of US Pat. No. 3,635,709) Cresol novolak resin 2.00 g Oil Blue #603 (Orient Chemical 0.04g ethylene dichloride 16g 2-methoxyethyl acetate 12g The photosensitive lithographic printing plate thus obtained was brought into close contact with the transparent positive and exposed to a PS light [equipped with a Toshiba metal halide lamp MU2000-2-OL type 3KW light source] from a distance of 1m. After exposure for 30 seconds with a 5% sodium silicate aqueous solution (sold by Fuji Photo Film Co., Ltd.), the samples were developed by immersing them in a 5% sodium silicate aqueous solution for about 1 minute, washed with water, and dried. Created 15. Tests were conducted on the uniformity of the electrolytically etched rough surfaces, stains in non-image areas, fatigue strength, and thermal softening properties of Samples No. 1 to No. 15 prepared in this way, and the results are shown in Table 1. (Test method) (1) Uniformity of electrolytically etched rough surface The surface condition was observed with a scanning electron microscope and the uniformity of pits was evaluated. expressed. (2) Dirt in non-image areas The stains in non-image areas were evaluated using the offset printing machine KOR, and those with particularly excellent marks are ◎, and those with excellent marks are ○.
Good results are indicated by △ marks, and poor results are indicated by × marks. (3) Fatigue strength Cut out a test piece with a width of 20 mm and a length of 100 mm from each sample, fix one end to a jig, bend the other end upward at an angle of 30°, return it to its original position, and The number of times until breakage was measured, with 1 time being counted as one time. (4) Thermal Softening Properties The sample was heated at 300° C. for 7 minutes in a Burnig Processor 1300 [Burnig Processor manufactured by Fuji Photo Film Co., Ltd. with a 12 KW heat source]. After cooling, a JIS No. 5 test piece was created and subjected to a tensile test.
The 0.2% proof stress value was measured. The amount of elemental Si was quantitatively analyzed using the analysis method described in the Analytical Chemistry Handbook.
【表】
版用板
JIS1100−H16 14 0.01 0.13 0.53
0.12 〃 〃 0.025 ×
JIS3003−H14 15 0.00 0.24 0.59
0.13 0.99 〃 0.038 ×
[Table] Plate board
JIS1100−H16 14 0.01 0.13 0.53
0.12 〃 〃 0.025 ×
JIS3003−H14 15 0.00 0.24 0.59
0.13 0.99 〃 0.038 ×
【表】
版用板
JIS1100−H16 14 ×
230 190 15.2 7.0
JIS3003−H14 15 ×
680 490 14.8 13.5
第1表から明らかなように本発明方法により得
られた印刷版用アルミニウム合金板No.1〜No.7は
何れも内部に分布する単体Si量が0.005%如何で
電解エツチング粗面の均一性、印刷中の非画像部
の耐汚れ性、耐疲労強度、耐熱軟化特性の点にお
いていずれの特性も満足し、従来のJIS1050、
1100及び3003よりもすぐれていることがわかる。
これに対し本発明法におけるアルミニウム合金板
の組成範囲より外ける比較合金成分のアルミニウ
ム合金板No.8〜12では内部に分布する単体Si量が
0.005%以下であつても粗面の均一性、印刷中の
非画像部の汚れ、疲労強度、耐熱軟化特性のいず
れかの特性が劣ることがわかる。即ちMg含有量
の少ないNo.8では粗面の均一性、印刷中の非画像
部の汚れは良好なるも、疲労強度、耐熱性が劣
り、Mg、Si、Fe含有量の多いNo.9〜No.11では疲
労強度、耐熱性は良好なるも粗面の均一性、印刷
中の非画像部の汚れが劣つている。又Cuの多い
No.12は粗面の均一性及び印刷中の非画像部の耐汚
れ性が劣つている。
実施例 2
実施例1における第1表のNo.2の合金鋳塊を用
いて600℃の温度で8時間の均熱処理を行ない、
次に410℃の温度まで平均冷却速度20℃/時で冷
却した。これを400〜300℃で板厚3.0〜8.5mmまで
熱間圧延したのち、第2表に示す種々の条件で冷
間圧延(表中○印は中間焼鈍を示す)後調質焼鈍
して印刷版用アルミニウム合金板を製造した。
このようにして製造した印刷版用アルミニウム
合金板について、実施例1と同様に表面処理し、
同条件で製版を行ない、試料No.16〜27を作成し
た。
又比較のため従来のJIS1050(第1表のNo.13の成
分)についても第2表に示す条件で板を作り上記
と同様に製版を行ない、試料No.28を作成した。
これら試料について実施例1と同様の試験を行
ないその結果を第2表に示した。[Table] Plate board
JIS1100−H16 14 ×
230 190 15.2 7.0
JIS3003−H14 15 ×
680 490 14.8 13.5
As is clear from Table 1, the aluminum alloy plates No. 1 to No. 7 for printing plates obtained by the method of the present invention all have a uniformity of the electrolytically etched rough surface depending on the amount of elemental Si distributed inside them at 0.005%. , satisfies all characteristics in terms of stain resistance of non-image areas during printing, fatigue resistance strength, and heat softening resistance, and exceeds conventional JIS1050,
It can be seen that it is superior to 1100 and 3003.
On the other hand, in aluminum alloy plates No. 8 to 12 with comparative alloy compositions outside the composition range of aluminum alloy plates in the method of the present invention, the amount of elemental Si distributed inside was
It can be seen that even if the content is 0.005% or less, the uniformity of the rough surface, staining of non-image areas during printing, fatigue strength, and heat softening resistance are poor. That is, No. 8, which has a low Mg content, has good rough surface uniformity and good staining in non-image areas during printing, but has poor fatigue strength and heat resistance, and No. 9, which has a high Mg, Si, and Fe content. No. 11 had good fatigue strength and heat resistance, but was poor in the uniformity of the rough surface and in the staining of non-image areas during printing. Also contains a lot of Cu
No. 12 had poor uniformity of the rough surface and poor stain resistance in non-image areas during printing. Example 2 Using the alloy ingot No. 2 in Table 1 in Example 1, soaking treatment was performed at a temperature of 600°C for 8 hours,
It was then cooled to a temperature of 410°C at an average cooling rate of 20°C/hour. This was hot rolled at 400 to 300°C to a thickness of 3.0 to 8.5 mm, then cold rolled under various conditions shown in Table 2 (○ marks in the table indicate intermediate annealing), followed by temper annealing and printing. An aluminum alloy plate for plates was manufactured. The aluminum alloy plate for printing plates produced in this way was subjected to surface treatment in the same manner as in Example 1,
Plate making was performed under the same conditions to create samples Nos. 16 to 27. For comparison, a plate was made using the conventional JIS1050 (component No. 13 in Table 1) under the conditions shown in Table 2, and plate making was performed in the same manner as above to prepare sample No. 28. These samples were subjected to the same tests as in Example 1, and the results are shown in Table 2.
【表】【table】
【表】
第2表から明らかなよう熱間加工後、減面率70
%以上の最終冷間加工を行ない、しかる後に連続
焼鈍炉で250〜400℃の温度で、120秒間以下の調
質焼鈍して単体Si量が0.005%以下になるように
調質した本発明による印刷版No.16〜No.21は粗面の
均一性、印刷中の非画像部と汚れとも、従来の調
質焼鈍条件(バツチ炉による焼鈍)で製造した印
刷版(No.26、No.27)及び従来組成であり従来の調
質焼鈍条件で製造したJIS1050印刷版(No.28)よ
りもさらに良好であり、疲労強度も6万回以上で
そのうえ300℃、7分バーニング後の熱軟化特性
に入ついてもいずれも耐力で12Kg/mm2以上であつ
た。なおNo.16〜No.19は中間焼鈍のない場合であり
No.20、No.21は中間焼鈍を入れた場合であるが、い
ずれの場合も良好であつた。
これに対し減面率の低いNo.22は内部に分布する
単体Si量が0.005%を越え疲労強度、耐熱性は良
好なるも粗面の均一性、印刷中の非画像部の汚れ
が劣り、調質焼鈍条件の温度、時間が本発明法の
範囲からはずれているNo.23〜No.25では何れも内部
に分布する単体Si量が、0.005%を越え粗面の均
一性、印刷中の非画像部の汚れは従来印刷版
JIS1050と同等であるが疲労強度、耐熱性の何れ
がが劣る。
実施例 3
実施例1における第1表のNo.2の公金鋳塊を、
550℃の温度で8時間の均熱処理を行ない、これ
を第3表に示す種々の冷却条件で冷却した後、板
圧4.5mmまで熱間圧延し、更に板厚3.0mmまで冷間
圧延した後、連続焼鈍炉により480℃の温度で20
秒間中間焼鈍してから板厚0.3cmまで冷間圧延し
た。これを連続焼鈍炉により300℃の温度で15秒
間最終鈍を施して印刷版用アルミニウム合金板を
製造した。
これ等について実施例1と同様に表面処理し、
同一条件で製版を行ない、試料No.29〜40を作成し
た。また比較のため従来のJIS1050(第1表のNo.13
の成分)についても第3表に示す条件で板を作
り、上記と同様に製版を行ない試料No.41を作成し
た。
これ等の試料について実施例1と同様の試験を
行ない、その結果ろ第3表に示した。[Table] As is clear from Table 2, after hot working, the area reduction rate is 70
% or more, and then tempered in a continuous annealing furnace at a temperature of 250 to 400°C for 120 seconds or less so that the amount of elemental Si is 0.005% or less. Printing plates No. 16 to No. 21 were manufactured under conventional temper annealing conditions (annealing in a batch furnace) in terms of rough surface uniformity, non-image areas and stains during printing (No. 26, No. 21). 27) and the JIS1050 printing plate (No. 28), which has a conventional composition and was manufactured under conventional temper annealing conditions, and has a fatigue strength of more than 60,000 cycles, and also has excellent thermal softening after burning at 300℃ for 7 minutes. Looking at the characteristics, all had a yield strength of 12 kg/mm 2 or more. Note that No. 16 to No. 19 are cases without intermediate annealing.
No. 20 and No. 21 are cases in which intermediate annealing was applied, and the results were good in both cases. On the other hand, in No. 22, which has a low area reduction rate, the amount of elemental Si distributed inside exceeds 0.005%, and although the fatigue strength and heat resistance are good, the uniformity of the rough surface and the staining of non-image areas during printing are poor. In No. 23 to No. 25, in which the temperature and time of the temper annealing conditions are outside the range of the present invention, the amount of elemental Si distributed inside exceeds 0.005%, causing problems with the uniformity of the rough surface and during printing. The stains in the non-image area are caused by the conventional printing plate.
Equivalent to JIS1050, but inferior in both fatigue strength and heat resistance. Example 3 The public gold ingot No. 2 in Table 1 in Example 1 was
After soaking at a temperature of 550°C for 8 hours and cooling under various cooling conditions shown in Table 3, hot rolling to a plate thickness of 4.5 mm, and further cold rolling to a plate thickness of 3.0 mm. , 20 at a temperature of 480℃ by continuous annealing furnace
It was intermediately annealed for seconds and then cold rolled to a thickness of 0.3 cm. This was subjected to final annealing at a temperature of 300° C. for 15 seconds in a continuous annealing furnace to produce an aluminum alloy plate for printing plates. These were subjected to surface treatment in the same manner as in Example 1,
Plate making was performed under the same conditions to create samples Nos. 29 to 40. For comparison, the conventional JIS1050 (No.13 in Table 1)
A plate was also made under the conditions shown in Table 3 for (components), and plate making was performed in the same manner as above to prepare sample No. 41. The same tests as in Example 1 were conducted on these samples, and the results are shown in Table 3.
【表】
第3表から明らかなように鋳塊を均熱処理した
後、430℃以下の温度まで50℃/時以下の平均冷
却速度で冷却し、しかる後熱間圧延、冷間圧延、
中間焼鈍、冷間圧延、連続焼鈍した本発明による
印刷版No.29〜35は内部に分布する単体Si量が
0.005%以下で、粗面の均一性画像部の汚れ、疲
労強度が優れていることが判る。
これに対し、内部に分布する単体Si量が0.005
%を越える比較印刷判No.36〜40、即ち均熱処理後
の冷却条件が外れる印刷版用アルミニウム合金板
では画像部の汚れが改善されないことが判る。
実施例 4
実施例1における第1表のNo.2の合金鋳塊を用
い、これを均熱処理した後、第4表に示す条件で
保持しれから、熱間圧延し、しかる後、実施例3
と同様にして板厚0.3mm、最終焼鈍(300℃・15
秒)を施し、これに実施例1と同様に表面処理し
て試料No.42〜50を作成した。また比較のため従来
のJIS1050(第1表のNo.13の成分)についても第4
表に示す条件で板を造り同様に製版を行なつて試
料No.51を作成した。
これ等について実施例1と同様の試験を行な
い、その結果を第4表に示した。[Table] As is clear from Table 3, after soaking the ingot, it is cooled to a temperature of 430°C or less at an average cooling rate of 50°C/hour or less, and then hot rolled, cold rolled,
Printing plates No. 29 to 35 according to the present invention, which were subjected to intermediate annealing, cold rolling, and continuous annealing, had a large amount of elemental Si distributed inside.
It can be seen that at 0.005% or less, the uniformity of the rough surface, staining of the image area, and fatigue strength are excellent. In contrast, the amount of elemental Si distributed inside is 0.005
It can be seen that stains in the image area are not improved in comparative printing formats No. 36 to 40, in which the cooling conditions after the soaking treatment are outside the range. Example 4 Using the alloy ingot of No. 2 in Table 1 in Example 1, it was soaked, held under the conditions shown in Table 4, hot rolled, and then prepared in Example 3.
In the same manner as above, the plate thickness was 0.3 mm, and the final annealing (300℃・15
2), and surface treated in the same manner as in Example 1 to prepare samples Nos. 42 to 50. For comparison, the conventional JIS1050 (component No. 13 in Table 1) is also
A plate was made under the conditions shown in the table and plate-making was performed in the same manner to prepare sample No. 51. The same tests as in Example 1 were conducted on these, and the results are shown in Table 4.
【表】
第4表から明らかなように、均熱処理後350〜
450℃の温度で30分以上保持した本発明による印
刷版No.42〜46は何れも単体Si量が0.005%以下で、
粗面の均一性、非画像部の汚れ、疲労強度が優れ
ていることが判る。
これに対し、均熱処理後の鋳塊保持条件が外れ
る比較印刷版No.47〜50では何れも内部に分布する
単体Siが0.005%を越え、非画像部の汚れが改善
されないことが判る。
このように本発明平版印刷版用支持体は従来の
1050アルミニウム板と同等もしくはそれ以上のす
ぐれた粗面の均一性をもち、印刷物の非画像部の
汚れも生じにくく疲労強度及び熱軟化特性も十分
であり、いずれの特性もかねそなえた平版印刷版
として顕著な効果を有するものである。[Table] As is clear from Table 4, after soaking treatment 350 ~
All of the printing plates No. 42 to 46 according to the present invention, which were held at a temperature of 450°C for 30 minutes or more, had an elemental Si content of 0.005% or less,
It can be seen that the uniformity of the rough surface, the staining of non-image areas, and the fatigue strength are excellent. On the other hand, in comparative printing plates Nos. 47 to 50, in which the ingot retention conditions after the soaking treatment were not met, the amount of elemental Si distributed inside exceeded 0.005%, indicating that stains in non-image areas were not improved. In this way, the lithographic printing plate support of the present invention is different from the conventional one.
A lithographic printing plate that has excellent rough surface uniformity equivalent to or better than 1050 aluminum plate, and is resistant to staining of non-image areas of printed matter and has sufficient fatigue strength and heat softening properties. It has a remarkable effect.
Claims (1)
Fe0.1〜0.4重量%、Cu0.05重量%以下、残部Alと
通常の不純物からなり、内部に分布する単体Siの
存在量が0.005重量%以下であることを特徴とす
る平版印刷版用支持体。 2 Mg0.05〜0.3重量%、Si0.02〜0.3重量%、
Fe0.1〜0.4重量%、Cu0.05重量%以下、残部Alと
通常の不純物からなるアルミニウム合金鋳塊を均
熱処理した後、430℃以下の温度まで50℃/時以
下の平均冷却速度で冷却するか、又は350〜450℃
の温度で30分以上保持してから熱間圧延又は熱間
圧延後冷間圧延と中間焼鈍を行ない、これに減面
率70%以上の最終冷間圧延を加え、しかる後連続
焼鈍炉において250〜400℃の温度で120秒以下調
質焼鈍することにより内部に分布する単体Siの存
在量を0.005重量%以下とすることを特徴とする
平版印刷版用支持体の製造方法。[Claims] 1 Mg0.05-0.3% by weight, Si0.02-0.3% by weight,
A lithographic printing plate support comprising 0.1 to 0.4% by weight of Fe, 0.05% by weight or less of Cu, the balance Al and normal impurities, and the amount of elemental Si distributed inside is 0.005% by weight or less. body. 2 Mg0.05-0.3% by weight, Si0.02-0.3% by weight,
After soaking an aluminum alloy ingot consisting of 0.1 to 0.4% Fe, 0.05% Cu or less, and the balance Al and normal impurities, it is cooled to a temperature of 430℃ or less at an average cooling rate of 50℃/hour or less. or 350-450℃
After holding at the temperature of 1. A method for producing a support for a lithographic printing plate, characterized in that the amount of elemental Si distributed inside is reduced to 0.005% by weight or less by thermal annealing at a temperature of ~400°C for 120 seconds or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27024284A JPS61146598A (en) | 1984-12-20 | 1984-12-20 | Supporter for lithographic printing plate and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27024284A JPS61146598A (en) | 1984-12-20 | 1984-12-20 | Supporter for lithographic printing plate and its manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61146598A JPS61146598A (en) | 1986-07-04 |
JPH0311635B2 true JPH0311635B2 (en) | 1991-02-18 |
Family
ID=17483528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27024284A Granted JPS61146598A (en) | 1984-12-20 | 1984-12-20 | Supporter for lithographic printing plate and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61146598A (en) |
Cited By (5)
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EP1625944A1 (en) | 2004-08-13 | 2006-02-15 | Fuji Photo Film Co., Ltd. | Method of manufacturing lithographic printing plate support |
US7037635B2 (en) | 2001-02-09 | 2006-05-02 | Fuji Photo Film Co., Ltd. | Presensitized plate |
EP1712368A1 (en) | 2005-04-13 | 2006-10-18 | Fuji Photo Film Co., Ltd. | Method of manufacturing a support for a lithographic printing plate |
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-
1984
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7037635B2 (en) | 2001-02-09 | 2006-05-02 | Fuji Photo Film Co., Ltd. | Presensitized plate |
EP1625944A1 (en) | 2004-08-13 | 2006-02-15 | Fuji Photo Film Co., Ltd. | Method of manufacturing lithographic printing plate support |
EP1712368A1 (en) | 2005-04-13 | 2006-10-18 | Fuji Photo Film Co., Ltd. | Method of manufacturing a support for a lithographic printing plate |
WO2010150810A1 (en) | 2009-06-26 | 2010-12-29 | 富士フイルム株式会社 | Light reflecting substrate and process for manufacture thereof |
WO2011078010A1 (en) | 2009-12-25 | 2011-06-30 | 富士フイルム株式会社 | Insulated substrate, process for production of insulated substrate, process for formation of wiring line, wiring substrate, and light-emitting element |
Also Published As
Publication number | Publication date |
---|---|
JPS61146598A (en) | 1986-07-04 |
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