JPH03116048U - - Google Patents

Info

Publication number
JPH03116048U
JPH03116048U JP1990025245U JP2524590U JPH03116048U JP H03116048 U JPH03116048 U JP H03116048U JP 1990025245 U JP1990025245 U JP 1990025245U JP 2524590 U JP2524590 U JP 2524590U JP H03116048 U JPH03116048 U JP H03116048U
Authority
JP
Japan
Prior art keywords
electrode
semiconductor device
power semiconductor
output
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990025245U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990025245U priority Critical patent/JPH03116048U/ja
Publication of JPH03116048U publication Critical patent/JPH03116048U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49112—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting a common bonding area on the semiconductor or solid-state body to different bonding areas outside the body, e.g. diverging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Emergency Protection Circuit Devices (AREA)
  • Protection Of Static Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例ａおよび過電流保護
回路との接続ｂを示す図、第２図は別の実施例で
ａは平面図、ｂは半導体素子の等価回路、第３図
ａは従来例、ｂは過電流保護回路との接続を示す
図である。 ３Ａ……ドレインリード、３Ｂ……ドレインワ
イヤ、５Ａ……ソースリード、５Ｂ……ソースワ
イヤ、５Ｃ……ソースパツド、１２Ａ……ソース
電位検出リード、１２Ｂ……ソース電位検出ワイ
ヤ、１４Ａ……ドレイン電位検出リード、１４Ｂ
……ドレイン電位検出ワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 出力電極と接地電極との間を流れる出力電流が
    制御電極によつて変動的に制御される電力用半導
    体素子において、出力電極または接地電極の少な
    くともいずれか一方の電極は、外部リードとの間
    でワイヤ接続がなされるとともに、該電極の電位
    検出のための設けた外部リードとの接続がとられ
    ていることを特徴とする電力用半導体素子。
JP1990025245U 1990-03-12 1990-03-12 Pending JPH03116048U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990025245U JPH03116048U (ja) 1990-03-12 1990-03-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990025245U JPH03116048U (ja) 1990-03-12 1990-03-12

Publications (1)

Publication Number Publication Date
JPH03116048U true JPH03116048U (ja) 1991-12-02

Family

ID=31528183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990025245U Pending JPH03116048U (ja) 1990-03-12 1990-03-12

Country Status (1)

Country Link
JP (1) JPH03116048U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4856273B1 (ja) * 2010-11-29 2012-01-18 智江 加藤 靴擦れ防止パッド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4856273B1 (ja) * 2010-11-29 2012-01-18 智江 加藤 靴擦れ防止パッド

Similar Documents

Publication Publication Date Title
JPH03116048U (ja)
JPH0363217U (ja)
JPH0279137U (ja)
JPS6197771U (ja)
JPH02110940U (ja)
JPH01128181U (ja)
JPS6149527U (ja)
JPH01135811U (ja)
JPH02116311U (ja)
JPS6327882U (ja)
JPS62103267U (ja)
JPS63195754U (ja)
JPH0345657U (ja)
JPS62204347U (ja)
JPS6351441U (ja)
JPH0260317U (ja)
JPH0480237U (ja)
JPS6228452U (ja)
JPS6249261U (ja)
JPH04759U (ja)
JPS6233682U (ja)
JPS6228451U (ja)
JPH048450U (ja)
JPS6412438U (ja)
JPH0210786U (ja)