JPH03115349A - Hydrogenated vinyl arom. hydrocarbon polymer composition, and optical disc board - Google Patents
Hydrogenated vinyl arom. hydrocarbon polymer composition, and optical disc boardInfo
- Publication number
- JPH03115349A JPH03115349A JP1253388A JP25338889A JPH03115349A JP H03115349 A JPH03115349 A JP H03115349A JP 1253388 A JP1253388 A JP 1253388A JP 25338889 A JP25338889 A JP 25338889A JP H03115349 A JPH03115349 A JP H03115349A
- Authority
- JP
- Japan
- Prior art keywords
- hydrogenated
- vinyl aromatic
- aromatic hydrocarbon
- polymer
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 title claims abstract description 53
- 230000003287 optical effect Effects 0.000 title claims abstract description 43
- 239000000203 mixture Substances 0.000 title claims description 23
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 title abstract description 8
- 239000004215 Carbon black (E152) Substances 0.000 title abstract description 6
- 229930195733 hydrocarbon Natural products 0.000 title abstract description 6
- 150000002430 hydrocarbons Chemical class 0.000 title abstract description 6
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 20
- 150000001993 dienes Chemical class 0.000 claims abstract description 15
- 229920001400 block copolymer Polymers 0.000 claims abstract description 13
- 239000013032 Hydrocarbon resin Substances 0.000 claims abstract description 6
- 229920006270 hydrocarbon resin Polymers 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 40
- -1 vinyl aromatic hydrocarbon Chemical class 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 229930195734 saturated hydrocarbon Natural products 0.000 claims description 6
- 238000013329 compounding Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 50
- 239000011347 resin Substances 0.000 description 50
- 238000005984 hydrogenation reaction Methods 0.000 description 29
- 238000004519 manufacturing process Methods 0.000 description 27
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 12
- 238000004544 sputter deposition Methods 0.000 description 11
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 10
- 239000012760 heat stabilizer Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 8
- 238000001746 injection moulding Methods 0.000 description 7
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000004417 polycarbonate Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 238000005453 pelletization Methods 0.000 description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 5
- 239000004926 polymethyl methacrylate Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 229920003048 styrene butadiene rubber Polymers 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QIVUCLWGARAQIO-OLIXTKCUSA-N (3s)-n-[(3s,5s,6r)-6-methyl-2-oxo-1-(2,2,2-trifluoroethyl)-5-(2,3,6-trifluorophenyl)piperidin-3-yl]-2-oxospiro[1h-pyrrolo[2,3-b]pyridine-3,6'-5,7-dihydrocyclopenta[b]pyridine]-3'-carboxamide Chemical compound C1([C@H]2[C@H](N(C(=O)[C@@H](NC(=O)C=3C=C4C[C@]5(CC4=NC=3)C3=CC=CN=C3NC5=O)C2)CC(F)(F)F)C)=C(F)C=CC(F)=C1F QIVUCLWGARAQIO-OLIXTKCUSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- XULSCZPZVQIMFM-IPZQJPLYSA-N odevixibat Chemical compound C12=CC(SC)=C(OCC(=O)N[C@@H](C(=O)N[C@@H](CC)C(O)=O)C=3C=CC(O)=CC=3)C=C2S(=O)(=O)NC(CCCC)(CCCC)CN1C1=CC=CC=C1 XULSCZPZVQIMFM-IPZQJPLYSA-N 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 3
- SDJHPPZKZZWAKF-UHFFFAOYSA-N 2,3-dimethylbuta-1,3-diene Chemical compound CC(=C)C(C)=C SDJHPPZKZZWAKF-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229910002546 FeCo Inorganic materials 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 239000012994 photoredox catalyst Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- AHAREKHAZNPPMI-AATRIKPKSA-N (3e)-hexa-1,3-diene Chemical compound CC\C=C\C=C AHAREKHAZNPPMI-AATRIKPKSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical class C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 241000156978 Erebia Species 0.000 description 1
- 101150000419 GPC gene Proteins 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 239000007868 Raney catalyst Substances 0.000 description 1
- 229910000564 Raney nickel Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920007962 Styrene Methyl Methacrylate Polymers 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 229920006125 amorphous polymer Polymers 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002642 lithium compounds Chemical class 0.000 description 1
- 238000010551 living anionic polymerization reaction Methods 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- AYOOGWWGECJQPI-NSHDSACASA-N n-[(1s)-1-(5-fluoropyrimidin-2-yl)ethyl]-3-(3-propan-2-yloxy-1h-pyrazol-5-yl)imidazo[4,5-b]pyridin-5-amine Chemical compound N1C(OC(C)C)=CC(N2C3=NC(N[C@@H](C)C=4N=CC(F)=CN=4)=CC=C3N=C2)=N1 AYOOGWWGECJQPI-NSHDSACASA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- UCUUFSAXZMGPGH-UHFFFAOYSA-N penta-1,4-dien-3-one Chemical class C=CC(=O)C=C UCUUFSAXZMGPGH-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は透明性、耐熱性、金属等との接着性に優れた、
水素化ビニル芳香族炭化水素樹脂組成物に関わり、更に
はこの様な水素化ビニル芳香族炭化水素樹脂組成物を用
いて得られる光ディスク基板に関する。[Detailed Description of the Invention] [Industrial Field of Application] The present invention provides a method for producing a material having excellent transparency, heat resistance, and adhesion to metals, etc.
The present invention relates to a hydrogenated vinyl aromatic hydrocarbon resin composition, and more particularly to an optical disc substrate obtained using such a hydrogenated vinyl aromatic hydrocarbon resin composition.
[従来の技術〕
レーザーを用いた光学記録は高密度の情報記録、保存、
及び再生が可能であるため、近年その開発が積極的に行
なわれている。この様な光学記録の一例として光ディス
クを挙げることが出来る。[Conventional technology] Optical recording using lasers enables high-density information recording, storage,
Since it can be recycled and regenerated, its development has been actively carried out in recent years. An optical disk can be cited as an example of such optical recording.
般に光ディスクは、透明な基板とその上にコートされた
種々の記録媒体とから基本的に構成される。In general, optical discs basically consist of a transparent substrate and various recording media coated thereon.
光ディスクの透明基板には無色透明な合成樹脂が用いら
れるケースが多く、その代表的なものとしてポリカーボ
ネート(以下、rPcJと略称する。)又はポリメチル
メタクリレート(以下、rP、MMAJと略称する。)
を挙げることができる。これらの樹脂は無色透明性に秀
いでる他、夫夫に固有の優れた性質を有するものではあ
るが、光学材料、特に光ディスク基板としての要件を全
て備えている訳ではなく、解決すべき問題点を有してい
る。例えば、PCにおいてはその芳香族環に起因する複
屈折性の問題があり、また、吸水性或いは透水性におい
ても問題がある。一方、PMMAにおいては、耐熱性、
吸水性、靭性の面における問題点がかねてより指摘され
ている。Colorless and transparent synthetic resins are often used for the transparent substrates of optical discs, and typical examples include polycarbonate (hereinafter abbreviated as rPcJ) or polymethyl methacrylate (hereinafter abbreviated as rP, MMAJ).
can be mentioned. Although these resins are colorless and transparent and have other excellent properties, they do not meet all the requirements for optical materials, especially optical disk substrates, and there are problems that need to be solved. It has points. For example, PC has a problem with birefringence due to its aromatic ring, and also has problems with water absorption or water permeability. On the other hand, PMMA has heat resistance,
Problems with water absorption and toughness have been pointed out for some time.
このように、これらの樹脂は夫々固有の問題点を内在さ
せつつ使用に供されているのであるが、実際には更に、
これらの樹脂よりなる透明基板の上にコートされる記録
媒体との関係において、後述のような新たな問題が生じ
ている。In this way, these resins are used with their own inherent problems, but in reality, there are also
In relation to recording media coated on transparent substrates made of these resins, new problems have arisen as described below.
一方、記録媒体については、従来より光ディスクの用途
に応じて多岐にわたる開発が行なわれている。例えば、
ライト・ワンス型と呼ばれる記録−再生専用のものでは
穴あけタイプのものが、またイレーザブル型と呼ばれる
、記録−再生一消去一再記録用のものでは、結晶転移現
象を利用した相転移タイプのもの、光磁気効果を利用し
た光磁気タイプのもの等が知られている。これらの記録
媒体用材料は、ライト・ワンス型ではテルル又はその酸
化物、合金化合物等、イレーザブル型では、GdFe、
TbFe、GdFeCo、TbFeC。On the other hand, regarding recording media, a wide variety of developments have been carried out in response to the uses of optical discs. for example,
The write-once type is a hole-drilling type that is only for recording and playback, and the erasable type is a phase change type that uses a crystal transition phenomenon, and the type that is for recording, playback, erasing, and rewriting is the write-once type. Magneto-optical types that utilize magnetic effects are known. These recording media materials include tellurium or its oxide, alloy compound, etc. for the write-once type, and GdFe, GdFe, etc. for the erasable type.
TbFe, GdFeCo, TbFeC.
といった希土類−遷移金属のアモルファス合金化合物等
、無機系材料が主流とされており、一般に高真空下での
スパッタリング等の乾式処決により、透明基板上に成膜
することにより形成されている。Inorganic materials such as rare earth-transition metal amorphous alloy compounds are mainstream, and are generally formed by forming a film on a transparent substrate by a dry process such as sputtering under a high vacuum.
ところで、PC,PMMAの吸湿性及び透水性は、一方
では基板自身の吸湿時の膨張によるソリの問題を引き起
こすものであるが、他方、基板を通しての水分の透過に
より記録媒体の腐蝕を引き起こし、光ディスクの寿命を
縮める原因となっている。By the way, the hygroscopicity and water permeability of PC and PMMA, on the one hand, cause the problem of warpage due to the expansion of the substrate itself when it absorbs moisture, but on the other hand, the permeation of moisture through the substrate causes corrosion of the recording medium, and the optical disc This causes a shortened lifespan.
また、基板用樹脂の耐熱性について更に言及すれば、次
のような問題がある。即ち、光ディスク、特にライト・
ワンス型、イレーザブル型等の光ディスクにおいては、
記録の書き込み、消去時の記録媒体の温度は200℃以
上にもなる。このため、ディスク基板にこの熱が直接か
かることは無いにしても、記録の書き込み、消去時には
基板が相当高温になることが予想され、耐熱性の低い樹
脂では、基板の変形成いはグループの変形等の問題が起
こり得る。Further, regarding the heat resistance of the substrate resin, there are the following problems. That is, optical discs, especially light discs,
For optical discs such as once type and erasable type,
The temperature of the recording medium during writing and erasing of records reaches 200° C. or higher. For this reason, even though this heat is not directly applied to the disk substrate, it is expected that the substrate will reach a considerably high temperature when writing and erasing records, and resins with low heat resistance may cause deformation of the substrate or group formation. Problems such as deformation may occur.
一方、光ディスクの生産工程においては、基板或いは記
録媒体の経時変化防止等の目的で、熱処理工程を取り入
れることが多いが、生産性の向上のためには、できるだ
け高い処理温度で処理することにより処理時間を短縮す
ることが望まれる。On the other hand, in the production process of optical discs, a heat treatment process is often incorporated in order to prevent aging of the substrate or recording medium. It is desirable to shorten the time.
この様な観点からも、樹脂の耐熱性が低いと高い処理温
度を採用することができず、生産性を上げることができ
ないという不具合がある。From this point of view as well, if the heat resistance of the resin is low, a high treatment temperature cannot be used and productivity cannot be increased.
このようなことから、光ディスクの生産工程或いは使用
状況の高温度に耐えるには、耐熱性の低いPMMAでは
全(不十分であり、従来においては専ら、より耐熱性の
高いPCが透明基板材料として検討されている。しかし
ながら、PCでも必ずしも耐熱性が十分であるという評
価を受けているわけではなく、より高い耐熱性を備える
樹脂材料の出現が望まれている。For these reasons, PMMA, which has low heat resistance, is insufficient to withstand the high temperatures of the optical disc production process and usage conditions, and conventionally, PC, which has higher heat resistance, has been used exclusively as a transparent substrate material. However, even PC is not necessarily evaluated as having sufficient heat resistance, and the emergence of resin materials with higher heat resistance is desired.
PC,PMMA等の従来の樹脂の欠点を補うものとして
主に炭素、水素よりなり、かつ軟化点の高い透明性の樹
脂を用いる方法があり、本発明者等も先に特願昭63−
149845等において、水素化ビニル芳香族炭化水素
重合体について提案している。In order to compensate for the drawbacks of conventional resins such as PC and PMMA, there is a method of using transparent resins that are mainly composed of carbon and hydrogen and have a high softening point.
No. 149,845 and others have proposed hydrogenated vinyl aromatic hydrocarbon polymers.
〔発明が解決しようとしている問題点]しかしながら、
上述の水素化ビニル芳香族炭化水素重合体はいわゆるポ
リオレフィンの低接着性の例に洩れず、記録膜との密着
性が悪く、光ディスクとしての十分な寿命が得られない
という問題があった。[Problem that the invention is trying to solve] However,
The above-mentioned hydrogenated vinyl aromatic hydrocarbon polymer has the same problem as the low adhesion of so-called polyolefins, in that it has poor adhesion to the recording film and cannot have a sufficient lifespan as an optical disc.
〔問題点を解決するための手段]
そこで、本発明者等は、上述の記録膜層との密着性を向
上させる為の樹脂の改良について鋭意検討した結果、水
素化ビニル芳香族炭化水素重合体として、水添率を特定
の値としたビニル芳香族炭化水素−共役ジエンブロック
共重合体水素化物を用いるか、又は、ビニル芳香族炭化
水素重合体水素化物と水添率を特定の値としたビニル芳
香族炭化水素−共役ジエンブロック共重合体水素化物を
混合して用い、更に、場合によってこれに数平均分子量
5000未満、軟化点40℃以上の飽和炭化水素樹脂を
配合して得られる水素化ビニル芳香族炭化水素重合体組
成物を用いる事により、本来水素化ビニル芳香族炭化水
素重合体が持つ高い耐熱性を保ったまま、記録膜層との
密着性に優れた光ディスク基板が得られる事を見出し本
発明に到達した。[Means for Solving the Problems] Therefore, the inventors of the present invention conducted extensive studies on improving the resin to improve the adhesion with the recording film layer described above, and as a result, the present inventors developed a hydrogenated vinyl aromatic hydrocarbon polymer. As a method, a hydrogenated vinyl aromatic hydrocarbon-conjugated diene block copolymer with a specific hydrogenation rate is used, or a hydrogenated vinyl aromatic hydrocarbon polymer and a hydrogenation rate with a specific value are used. Hydrogenation obtained by mixing a hydrogenated vinyl aromatic hydrocarbon-conjugated diene block copolymer and optionally adding a saturated hydrocarbon resin with a number average molecular weight of less than 5000 and a softening point of 40°C or higher. By using a vinyl aromatic hydrocarbon polymer composition, it is possible to obtain an optical disc substrate that has excellent adhesion to the recording film layer while maintaining the high heat resistance originally possessed by hydrogenated vinyl aromatic hydrocarbon polymers. This discovery led to the present invention.
即ち、本発明の要旨は、
(a) ビニル芳香族炭化水素−共役ジエンブロック
共重合体中の全二重結合及び芳香核の75mol〜98
mol%を水素化して得られる重合体1〜1、 OO重
量%未満と
ら)ビニル芳香族炭化水素重合体中の芳香核の80mo
lfi%以上を水素化して得られる重合体0〜95重量
%及び/又は
(c) 数平均分子量500〜5,000、軟化点4
0℃以上の飽和炭化水素樹脂0〜20重量%(ただし、
(b)成分と(c)成分の合計は0重量%を超える)
の二ないし三成分からなる水素化ビニル芳香族炭化水素
重合体組成物に存し、この様な組成物は金属、金属酸化
物、極性基含有高分子化合物との接着性に優れ、特に記
録膜層との密着性に優れた光ディスク基板として用いら
れる。That is, the gist of the present invention is as follows: (a) 75 mol to 98 mol of all double bonds and aromatic nuclei in the vinyl aromatic hydrocarbon-conjugated diene block copolymer;
Polymer 1-1 obtained by hydrogenating mol%, less than OO% by weight) 80 mo of aromatic nuclei in vinyl aromatic hydrocarbon polymer
0 to 95% by weight of a polymer obtained by hydrogenating lfi% or more and/or (c) number average molecular weight of 500 to 5,000, softening point of 4
0 to 20% by weight of saturated hydrocarbon resin at 0°C or higher (however,
The total of components (b) and (c) exceeds 0% by weight). It is used as an optical disc substrate that has excellent adhesion to materials and polar group-containing polymer compounds, and particularly excellent adhesion to recording film layers.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明における組成物の(a)成分は水素化ビニル芳香
族炭化水素−共役ジエンプロ・ンク共重合体である。Component (a) of the composition of the present invention is a hydrogenated vinyl aromatic hydrocarbon-conjugated dienepro-link copolymer.
原料であるビニル芳香族炭化水素−共役ジエンブロック
共重合体中のビニル芳香族炭化水素重合体セグメント中
のビニル芳香族炭化水素モノマーとしては、スチレン、
P−メチルスチレン、α−メチルスチレン等を挙げるこ
とができ、特に代表的なものとしてスチレンが挙げられ
る。The vinyl aromatic hydrocarbon monomer in the vinyl aromatic hydrocarbon polymer segment in the raw material vinyl aromatic hydrocarbon-conjugated diene block copolymer includes styrene,
Examples include P-methylstyrene and α-methylstyrene, with styrene being a particularly representative example.
ビニル芳香族炭化水素重合体セグメントとしては、これ
らのビニル芳香族炭化水素1種よりなる単独重合体或い
は2種以上の共重合体が挙げられる。また上記ビニル芳
香族炭化水素と共重合可能な他のモノマーを、ビニル芳
香族炭化水素重合体の特性が失なわれない範囲で含有し
ても良い。このようなモノマーとしては、アクリル酸、
アクリル酸エステル、メタクリル酸、メタクリル酸エス
テル、マレイン酸、無水マレイン酸、アクロレイン、ビ
ニルエステル類、ビニルエーテル類、ビニルケトン類、
アクリロニトリル等が上げられる。Examples of the vinyl aromatic hydrocarbon polymer segment include a homopolymer or a copolymer of two or more of these vinyl aromatic hydrocarbons. Further, other monomers copolymerizable with the above-mentioned vinyl aromatic hydrocarbon may be contained within a range such that the characteristics of the vinyl aromatic hydrocarbon polymer are not lost. Such monomers include acrylic acid,
Acrylic esters, methacrylic acid, methacrylic esters, maleic acid, maleic anhydride, acrolein, vinyl esters, vinyl ethers, vinyl ketones,
Examples include acrylonitrile.
また共役ジエン重合体セグメント中の共役ジエンとして
は、1.3−ブタジェン、イソプレン、2.3−ジメチ
ル−1,3−ブタジェン、1.3ペンタジエン、1,3
−へキサジエン等が挙げラレ、特に、1,3−ブタジェ
ン、イソプレンが一般的である。これら2種以上のセグ
メントからなるブロック共重合体は、いわゆるリビング
アニオン重合と称せられる公知の方法、例えば有機リチ
ウム化合物を開始剤とし、ヘキサン、ヘプタンの様な炭
化水素溶媒中で重合する方法等により容易に得ることが
できる。The conjugated dienes in the conjugated diene polymer segment include 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, 1.3pentadiene, 1,3
-hexadiene, etc., and 1,3-butadiene and isoprene are particularly common. A block copolymer consisting of two or more types of segments can be produced by a known method called living anionic polymerization, such as a method in which polymerization is performed using an organic lithium compound as an initiator in a hydrocarbon solvent such as hexane or heptane. can be obtained easily.
この様なブロック共重合体中のビニル芳香族炭化水素重
合体セグメントの含有量は20重量%以上、好ましくは
40重量%以上、更に好ましくは60重量%以上である
。また共役ジエン重合体セグメントの含有量は本発明の
全組成物の20重量%以下である。The content of the vinyl aromatic hydrocarbon polymer segment in such a block copolymer is 20% by weight or more, preferably 40% by weight or more, and more preferably 60% by weight or more. Further, the content of the conjugated diene polymer segment is 20% by weight or less of the total composition of the present invention.
組成物中に共役ジエン重合体セグメントの含有量が多過
ぎる場合は組成物の耐熱性、剛性が低下し光ディスク基
板として不適なものとなる。If the content of the conjugated diene polymer segment is too large in the composition, the heat resistance and rigidity of the composition will decrease, making it unsuitable for use as an optical disc substrate.
この様な原料ビニル芳香族炭化水素−共役ジエンプロッ
タ共重合体の分子量は数平均分子量で3万〜40万、好
ましくは5万〜40万である。The number average molecular weight of such raw material vinyl aromatic hydrocarbon-conjugated diene plotter copolymer is 30,000 to 400,000, preferably 50,000 to 400,000.
本発明の組成物の(a)成分である水素化ビニル芳香族
−共役ジエンブロック共重合体はこのようなブロック共
重合体を芳香族水素化能を有する水素化触媒の存在下で
、水添して得ることができる。The hydrogenated vinyl aromatic-conjugated diene block copolymer, which is the component (a) of the composition of the present invention, is prepared by hydrogenating such a block copolymer in the presence of a hydrogenation catalyst capable of hydrogenating aromatics. You can get it.
ここで使用される水素化触媒としては、例えばニッケル
、コバルト、ルテニウム、ロジウム、白金、パラジウム
等の金属又はその酸化物、塩、錯体及びこれらの活性炭
、ケイソウ土、アルミナ等の担体に担持したもの等が挙
げられる。これらの中でも特にラネーニッケル、ラネー
コバルト、安定化ニッケル及びルテニウム、ロジウム又
は白金のカーボン又はアルミナ担持触媒が、反応性の面
から好ましい。Examples of hydrogenation catalysts used here include metals such as nickel, cobalt, ruthenium, rhodium, platinum, and palladium, or their oxides, salts, and complexes, and those supported on carriers such as activated carbon, diatomaceous earth, and alumina. etc. Among these, Raney nickel, Raney cobalt, stabilized nickel and ruthenium, rhodium or platinum supported catalysts on carbon or alumina are particularly preferred from the viewpoint of reactivity.
水添反応は、50〜250kg/aflの圧力、100
〜200℃の温度下にて、溶媒としてシクロヘキサン、
メチルシクロヘキサン、n−オクタン、デカリン、テト
ラリン、ナフサ等の飽和炭化水素系溶媒或いは、THF
等のエーテル系溶媒を用いて行なうのが好ましい。水添
率に関して、共役ジエンセグメントに由来する二重結合
の水添率は実質的に100%である。芳香核の水添率に
関して98mol%以下、好ましくは95mol%以下
、更に好ましくは90mol%以下である。芳香核の水
添率の下限は75mol%、好ましくは80mo1%で
ある。核水添率が上記値より高い場合は記録膜との密着
性が不十分であり、低い場合は、耐熱性の低下、複屈折
率の増大、(b)成分との相溶性の低下等の問題がある
。The hydrogenation reaction is carried out at a pressure of 50 to 250 kg/afl, 100
At a temperature of ~200°C, cyclohexane as a solvent,
Saturated hydrocarbon solvents such as methylcyclohexane, n-octane, decalin, tetralin, naphtha, or THF
It is preferable to use an ether solvent such as . Regarding the hydrogenation rate, the hydrogenation rate of the double bonds originating from the conjugated diene segment is substantially 100%. The hydrogenation rate of aromatic nuclei is 98 mol% or less, preferably 95 mol% or less, more preferably 90 mol% or less. The lower limit of the hydrogenation rate of aromatic nuclei is 75 mol%, preferably 80 mol%. If the nuclear hydrogenation rate is higher than the above value, the adhesion with the recording film is insufficient, and if it is lower, it may cause a decrease in heat resistance, an increase in birefringence, a decrease in compatibility with component (b), etc. There's a problem.
以上の様にして得られた(a)成分の水素化ビニル芳香
族炭化水素−共役ジエンブロック共重合体の分子量は数
平均分子量で2万〜30万、好ましくは5万〜20万で
ある。分子量が低すぎると強度が不足し、高すぎると成
型性、光学的均一性が低下する。The number average molecular weight of the hydrogenated vinyl aromatic hydrocarbon-conjugated diene block copolymer of component (a) obtained as described above is 20,000 to 300,000, preferably 50,000 to 200,000. If the molecular weight is too low, the strength will be insufficient, and if the molecular weight is too high, the moldability and optical uniformity will deteriorate.
本発明における組成物の(b)成分は水素化ビニル芳香
族炭化水素重合体である。Component (b) of the composition in the present invention is a hydrogenated vinyl aromatic hydrocarbon polymer.
原料であるビニル芳香族炭化水素重合体は上述の(a)
成分の原料中のビニル芳香族炭化水素重合体セグメント
と同様な重合体が挙げられる。重合法としては非晶質重
合体が得られるものであれば特に制限はないが、通常は
ラジカル重合、アニオン重合等が用いられる。この原料
ビニル芳香族炭化水素重合体の分子量は数平均分子量で
50,000以上であることが好ましい。分子量が低過
ぎると、水素付加後得られる樹脂の耐熱性、靭性が低下
する。The raw material vinyl aromatic hydrocarbon polymer is the above-mentioned (a)
Examples include polymers similar to the vinyl aromatic hydrocarbon polymer segments in the raw materials for the components. The polymerization method is not particularly limited as long as an amorphous polymer can be obtained, but radical polymerization, anionic polymerization, etc. are usually used. The molecular weight of this raw material vinyl aromatic hydrocarbon polymer is preferably 50,000 or more in terms of number average molecular weight. If the molecular weight is too low, the heat resistance and toughness of the resin obtained after hydrogenation will decrease.
一方、分子量の上限については特に制限はないが、通常
の場合、400,000以下であることが好ましい。On the other hand, there is no particular restriction on the upper limit of the molecular weight, but it is usually preferably 400,000 or less.
このようなビニル芳香族炭化水素重合体を上述の(a)
成分の水添と同様な方法で核水添する。Such a vinyl aromatic hydrocarbon polymer may be used as described in (a) above.
Nuclear hydrogenation is carried out in a manner similar to the hydrogenation of components.
核水添反応による芳香核の核水添率は80mojl!%
以上である。水添率が低いと耐熱性が低下し、また光学
材料としての複屈折率が高くなり好ましくない。本成分
の核水添率は好ましくは90moA%以上さらに好まし
くは95mol%以上である。The nuclear hydrogenation rate of aromatic nuclei due to nuclear hydrogenation reaction is 80 mojl! %
That's all. If the hydrogenation rate is low, the heat resistance will decrease and the birefringence as an optical material will increase, which is not preferable. The nuclear hydrogenation rate of this component is preferably 90 moA% or more, more preferably 95 mol% or more.
以上の様にして得られた水素化ビニル芳香族炭化水素重
合体の分子量は数平均分子量で5万〜30万、好ましく
は6万〜25万である。数平均分子量が5万未満だと強
度が不足するので好ましくなく、30万を超えると成型
性、光学的均一性が損なわれるので好ましくない。The number average molecular weight of the hydrogenated vinyl aromatic hydrocarbon polymer obtained as described above is from 50,000 to 300,000, preferably from 60,000 to 250,000. If the number average molecular weight is less than 50,000, the strength will be insufficient, which is undesirable, and if it exceeds 300,000, moldability and optical uniformity will be impaired, which is not preferred.
本発明の(c)成分は数平均分子量500〜5000、
軟化点40’C以上の飽和炭化水素樹脂である。Component (c) of the present invention has a number average molecular weight of 500 to 5000,
It is a saturated hydrocarbon resin with a softening point of 40'C or higher.
好ましくは数平均分子量は500〜2000、軟化点は
、60〜200℃である。(c)成分は接着性の向上に
寄与する成分である。(c)成分の分子量が高過ぎる場
合には接着性の向上効果は不十分である。低過ぎる場合
は成型時の飛散、ブリード等の問題があり使用に耐えな
い。また軟化点が低過ぎるばあいは組成物の耐熱性が低
下する。(c)成分の樹脂の水添率は95%以上、好ま
しくは98%以上である。この様な飽和炭化水素樹脂と
しては、水添石油樹脂、水添ジシクロペンタジェン樹脂
、低分子量ポリビニルシクロヘキサン等の樹脂が上げら
れる。Preferably, the number average molecular weight is 500 to 2000 and the softening point is 60 to 200°C. Component (c) is a component that contributes to improving adhesiveness. If the molecular weight of component (c) is too high, the effect of improving adhesion is insufficient. If it is too low, there will be problems such as scattering and bleeding during molding, making it unusable. Moreover, if the softening point is too low, the heat resistance of the composition will decrease. The hydrogenation rate of the resin component (c) is 95% or more, preferably 98% or more. Examples of such saturated hydrocarbon resins include hydrogenated petroleum resins, hydrogenated dicyclopentadiene resins, and low molecular weight polyvinylcyclohexane resins.
組成物中の各成分の含有量は(a)成分が1〜100重
量%未満、好ましくは10〜99重量%である。(b)
成分の量は0〜95重量%、好ましくは0〜90重量%
である。(c)成分の含有量は0〜20重量%、好まし
くは0〜10重量%である。(ただしくハ)成分と(c
)成分の合計は0重量%を超える。)上述の成分の混合
に関しては特に制限されるものではないが、通常は上述
の成分を溶媒に溶解した後、貧溶媒に投入する、あるい
は溶媒を留去する等によって共析出させる方法、押出機
、ブラベンダープラストグラフ、バンバリーミキサ−等
の混練機により溶融混合する方法等の方法を用いる事が
出来る。The content of each component in the composition is 1 to less than 100% by weight, preferably 10 to 99% by weight of component (a). (b)
The amount of components is 0-95% by weight, preferably 0-90% by weight
It is. The content of component (c) is 0 to 20% by weight, preferably 0 to 10% by weight. (just c) component and (c
) The sum of the components exceeds 0% by weight. ) There are no particular restrictions on the mixing of the above components, but usually the above components are dissolved in a solvent and then put into a poor solvent or co-precipitated by distilling off the solvent, etc., or an extruder. , Brabender Plastograph, Banbury mixer, or other kneading machines may be used.
また、溶液混合の後、溶融混練する方法も好ましい。Furthermore, a method of melting and kneading after solution mixing is also preferred.
本発明においては以上の様にして得られた樹脂に通常は
熱安定剤を配合し成型を行う。In the present invention, a heat stabilizer is usually added to the resin obtained as described above and then molded.
熱安定剤としては、ヒンダードフェノール系熱安定剤、
イオウ系熱安定剤、リン系熱安定剤等が挙げられる。ヒ
ンダードフェノール系熱安定剤とリン系熱安定剤の併用
が耐熱劣化性の向上という観点から好ましい。As heat stabilizers, hindered phenol heat stabilizers,
Examples include sulfur-based heat stabilizers and phosphorus-based heat stabilizers. A combination of a hindered phenol heat stabilizer and a phosphorus heat stabilizer is preferred from the viewpoint of improving heat deterioration resistance.
本発明で採用されるヒンダードフェノール系熱安定剤と
しては、テトラキス〔メチレン−5(3,5−ジ−t−
ブチル−4−ヒドロキシフェニル)プロピオネートメタ
ン、3.9−ビス〔1゜1−ジメチル−2−(β−(3
−t−ブチル−4−ヒドロキシ−5−メチルフェニル)
プロピオニルオキシ)エチル)−2,4,8,10−テ
トラオキサスピロ(5,5)ウンデカン、1,3.5ト
リス(3,5−ジーL−ブチルー4−ヒドロキシベンジ
ル−5−t−リアジン−2,4,6(IH,3H,5H
)−)リオン、1.3.5−トリメチル−2,4,6−
)リス(3,5−ジーL−ブチルー4−ヒドロキシベン
ジル)ベンゼン等が挙げられる。The hindered phenol heat stabilizer employed in the present invention includes tetrakis[methylene-5(3,5-di-t-
Butyl-4-hydroxyphenyl)propionate methane, 3.9-bis[1゜1-dimethyl-2-(β-(3
-t-butyl-4-hydroxy-5-methylphenyl)
propionyloxy)ethyl)-2,4,8,10-tetraoxaspiro(5,5)undecane, 1,3.5 tris(3,5-di-L-butyl-4-hydroxybenzyl-5-t-lyazine- 2,4,6(IH,3H,5H
)-) ion, 1.3.5-trimethyl-2,4,6-
) lis(3,5-di-L-butyl-4-hydroxybenzyl)benzene and the like.
また、リン系熱安定剤としては、テトラキス(2,4−
ジーも一ブチルフェニル)−4,4’−ビフェニレンホ
スフォナイト、ビス(2,6ジーも一ブチルー4−メチ
ルフェニル)ペンタエリスリトール−ジ−ホスファイト
等が挙げられる。In addition, as a phosphorus-based heat stabilizer, tetrakis (2,4-
Examples thereof include di-butylphenyl)-4,4'-biphenylene phosphonite, bis(2,6-butyl-4-methylphenyl)pentaerythritol-di-phosphite, and the like.
これら安定剤の好適な添加量は、各々0.01〜1重量
部である。A suitable amount of each of these stabilizers added is 0.01 to 1 part by weight.
これらの安定剤と本発明の樹脂組成物との混合方法につ
いては特に制限はないが、通常は樹脂と安定剤とをリボ
ンブレンダー、タンブラープレンダー、ヘンシェルミキ
サー等で混合し、その後、バンバリーミキサ−−軸押出
機、二軸押出機等で溶融混練し、ペレット形状とするこ
とにより混合する。このようにして得られたベレットを
用い、例えば光ディスク基板を得るには成形温度270
〜350℃1特に280〜340℃で射出成形すること
により、透明性、耐熱性等に優れ、着色もなく光学歪の
著しく小さい光ディスク基板を得ることができる。There are no particular restrictions on the method of mixing these stabilizers with the resin composition of the present invention, but usually the resin and stabilizer are mixed using a ribbon blender, tumbler blender, Henschel mixer, etc., and then a Banbury mixer is used. - Mix by melt-kneading using a screw extruder, twin-screw extruder, etc. to form pellets. Using the pellet thus obtained, for example, to obtain an optical disc substrate, the molding temperature is 270.
By injection molding at ~350°C, especially at 280~340°C, it is possible to obtain an optical disk substrate that has excellent transparency, heat resistance, etc., is free from coloring, and has extremely low optical distortion.
本発明の水素化ビニル芳香族炭化水素重合体組成物より
得られる光ディスク基板を用いて光ディスクを製造する
際には、該基板表面にスパッタリング、或いは蒸着等の
方法によりSN、、Tag。When manufacturing an optical disk using an optical disk substrate obtained from the hydrogenated vinyl aromatic hydrocarbon polymer composition of the present invention, SN, Tag is applied to the surface of the substrate by a method such as sputtering or vapor deposition.
等の皮膜を形成し更にその上にTbFeCo等の記録層
を形成、最後に保護膜で覆う等の方法を採用する事が出
来る。It is possible to adopt a method such as forming a film such as the above film, further forming a recording layer such as TbFeCo on the film, and finally covering the film with a protective film.
本発明の重合体組成物による光ディスク基板は、記録層
との接着性に優れている為、光ディスクとしての十分な
寿命を得る事が出来る。Since the optical disc substrate made of the polymer composition of the present invention has excellent adhesion to the recording layer, it can have a sufficient life as an optical disc.
また本発明の重合体組成物はその優れた耐熱性、光学特
性を生かして光ディスク以外に光学用レンズ、光カード
の材料等の成型材料としても用いる事が出来る。その場
合においても本発明の重合体組成物の優れた接着性は有
効である。Further, the polymer composition of the present invention can be used as a molding material for optical lenses, optical cards, etc. in addition to optical discs by taking advantage of its excellent heat resistance and optical properties. Even in that case, the excellent adhesive properties of the polymer composition of the present invention are effective.
以下に実施例及び比較例を挙げて本発明をより具体的に
説明するが、本発明はその要旨を超えない限り、以下の
実施例に限定されるものではない。EXAMPLES The present invention will be described in more detail below with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples unless it exceeds the gist thereof.
なお、以下の実施例及び比較例における各種物性は、次
の方法によって測定したものである。In addition, various physical properties in the following Examples and Comparative Examples were measured by the following methods.
■ 数平均分子量ニ
ゲル・パーミェーション・クロマトグラフィー (GP
C)により、THFを溶媒としてポリスチレンと同様に
測定し、ポリスチレン換算の数平均分子量を求めた。■ Number average molecular weight Nigel permeation chromatography (GP
C), the number average molecular weight in terms of polystyrene was determined by measuring in the same manner as polystyrene using THF as a solvent.
■ 核水添率(%):
ポリビニルシクロヘキサン系樹脂をテトラヒドロフラン
(THF)に溶解し、Uv吸収により測定した。(2) Nuclear hydrogenation rate (%): Polyvinylcyclohexane resin was dissolved in tetrahydrofuran (THF) and measured by UV absorption.
■ 軟化温度C”C):
D u p On を社製サーモメカニカルアナライザ
ーを用いて、針入モード用プローブを用い荷重5g、5
℃/分の昇温速度で軟化温度を測定した。試験片の厚み
は3Mとした。■ Softening temperature C''C): Dup On was measured using a thermomechanical analyzer manufactured by Thermo Mechanical Analyzer and a load of 5g using a probe for needle insertion mode.
The softening temperature was measured at a heating rate of °C/min. The thickness of the test piece was 3M.
樹脂製造例−1
スチレン単独重合体(三菱モンサイト化成社製HH−1
02数平均分子N10万)をテトラヒドロフランに溶解
し触媒として5%Pd/Cを加え、温度 170℃1水
素圧 100kg/c−jで6時間水素化反応を行なっ
た。数平均分子量6.8万、核水添率99.0%の水素
化ポリスチレンを得た。Resin production example-1 Styrene homopolymer (HH-1 manufactured by Mitsubishi Monsite Kasei Co., Ltd.
02 number average molecular weight (N100,000) was dissolved in tetrahydrofuran, 5% Pd/C was added as a catalyst, and a hydrogenation reaction was carried out at a temperature of 170° C. and a hydrogen pressure of 100 kg/c-j for 6 hours. Hydrogenated polystyrene with a number average molecular weight of 68,000 and a nuclear hydrogenation rate of 99.0% was obtained.
樹脂製造例−2
アニオン重合法により得られたスチレン−ブタジェンブ
ロック共重合体(数平均分子量10,0万ブタジ工ン含
有量20重量%)を水素圧を70kg / c己とした
以外は樹脂製造例−1と同様の方法で水素化し、数平均
分子量8.7万、水添率87.5%の水素化スチレン−
ブタジェンブロック共重合体を得た。Resin production example-2 Resin except that a styrene-butadiene block copolymer (number average molecular weight 10,000,000 butadiene content 20% by weight) obtained by an anionic polymerization method was used at a hydrogen pressure of 70 kg/cm. Hydrogenated styrene with a number average molecular weight of 87,000 and a hydrogenation rate of 87.5% was hydrogenated in the same manner as in Production Example-1.
A butadiene block copolymer was obtained.
樹脂製造例−3
アニオン重合法により得られたスチレン−ブタジェンブ
ロック共重合体(数平均分子量10.5万ブタジ工ン含
有量5重量%)を樹脂製造例−1と同様の方法で水素化
し数平均分子量8.9万、水添率93.5%の水素化ス
チレン−ブタジェンブロック共重合体を得た。Resin Production Example-3 A styrene-butadiene block copolymer (number average molecular weight: 105,000 butadiene content: 5% by weight) obtained by anionic polymerization was hydrogenated in the same manner as in Resin Production Example-1. A hydrogenated styrene-butadiene block copolymer having a number average molecular weight of 89,000 and a hydrogenation rate of 93.5% was obtained.
樹脂製造例−4
アニオン重合法により得られたスチレン−ブタジェンブ
ロック共重合体(数平均分子量12万ブタジ工ン含有量
40重量%)を樹脂製造例−2と同様の方法で水素化し
数平均分子量9.5万、水添率85.5%の水素化スチ
レン−ブタジェンブロック共重合体を得た。Resin Production Example-4 A styrene-butadiene block copolymer (number average molecular weight: 120,000 butadiene content: 40% by weight) obtained by an anionic polymerization method was hydrogenated in the same manner as in Resin Production Example-2 to obtain a number-average A hydrogenated styrene-butadiene block copolymer with a molecular weight of 95,000 and a hydrogenation rate of 85.5% was obtained.
樹脂製造例−5
ラジカル重合により得られたスチレン−メチルメタクリ
レート共重合体(スチレン含有量85重量% 数平均分
子量18.4万)を樹脂製造例−1と同様の方法で水素
化した。その結果水添率100%、数平均分子量14.
4万の水素化重合体が得られた。エステル基は水素化さ
れなかった。Resin Production Example-5 A styrene-methyl methacrylate copolymer (styrene content: 85% by weight, number average molecular weight: 184,000) obtained by radical polymerization was hydrogenated in the same manner as in Resin Production Example-1. As a result, the hydrogenation rate was 100% and the number average molecular weight was 14.
40,000 hydrogenated polymers were obtained. Ester groups were not hydrogenated.
樹脂製造例−6
スチレン単独重合体(三菱モンサイト化成社製HH−1
02数平均分子ff113万)をテトラヒドロフランに
溶解し触媒として5%Pd/Cを加え、温度 170℃
1水素圧 60 kg/ciテロ時間水素化反応を行な
った。数平均分子量7,5万、核水添率so、2%の水
素化ポリスチレンを得た。Resin production example-6 Styrene homopolymer (HH-1 manufactured by Mitsubishi Monsite Kasei Co., Ltd.
02 number average molecule ff 1,130,000) was dissolved in tetrahydrofuran, 5% Pd/C was added as a catalyst, and the temperature was 170°C.
A hydrogenation reaction was carried out at a hydrogen pressure of 60 kg/ci for one hour. Hydrogenated polystyrene with a number average molecular weight of 75,000 and a nuclear hydrogenation rate of 2% was obtained.
実施例−1
樹脂製造例−1で得−られた重合体3.75kg、樹脂
製造例−2で得られた重合体1.25 kg、及び水添
石油樹脂(荒用化学社製 アルコンP−100)250
gをテトラヒドロフランに溶解し、次いでメタノール中
に共析出させた。ここに得られたウエントパウダーに添
加剤として、1.35−トリメチル−2,4,6−)リ
ス−(3,5−ジt−ブチルー4−ヒドロキシベンジル
)ベンゼン(日本チバガイギー社製Nrganoχ13
30」)および(2,6−ジーも一ブチルー4−メチル
フェニル)ペンタエリスリトール−シフオスファイト)
(アデカアーガス社製rMARKPEP−36J)各0
.05重量部を添加した後、乾燥した。ついで押出機を
用いて260 ’Cで溶融混練を行ないベレット化した
。Example-1 3.75 kg of the polymer obtained in Resin Production Example-1, 1.25 kg of the polymer obtained in Resin Production Example-2, and hydrogenated petroleum resin (Aruyo Kagaku Co., Ltd. Alcon P- 100) 250
g was dissolved in tetrahydrofuran and then co-precipitated into methanol. As an additive, 1,35-trimethyl-2,4,6-)lis-(3,5-di-t-butyl-4-hydroxybenzyl)benzene (Nrgano
30'') and (2,6-di-butyl-4-methylphenyl)pentaerythritol-siphosphite)
(rMARKPEP-36J manufactured by Adeka Argus) 0 each
.. After adding 05 parts by weight, the mixture was dried. Then, the mixture was melt-kneaded using an extruder at 260'C to form pellets.
このペレットを射出成型機(多機社製「M140A」)
を用いて、可動金型側にグループつきスタンバ−を取り
付け、樹脂温度300℃で厚さ1゜2mm、直径130
mmの円盤状光ディスク基板を成型した。This pellet is molded into an injection molding machine (“M140A” manufactured by Takisha Co., Ltd.)
Attach a stand bar with a group to the movable mold side using
A disc-shaped optical disk substrate of mm was molded.
基板樹脂の軟化温度は163℃1曲弾性率は2B、 O
OOkg/cIINであった。The softening temperature of the substrate resin is 163℃, the single flexural modulus is 2B, O
It was OOkg/cIIN.
得られた基板をスパッタリング装置に装入し、まず8
X 10−’torr以下まで排気し、Arと0□との
混合ガスを用いてTaターゲットの反応性スパッタを行
ないTa、O,からなる干渉層(厚さ800人)を形成
した。次いで、Tbターゲット及びFeCoターゲット
を用いたArガスによる2元同時スパッタにより、Tb
FeCoの記録層(厚さ300人)を設けた。更に、T
iチップを配置したA2ターゲットをArガス中でスパ
ッタして厚さ300人の反射層を形成した。この皮膜を
設けた基板の鏡面となっている部分に1cmX11の範
囲で各10本の線を引き得られた基盤目状部分に寺岡社
製粘着テープ(イミドフィルムベース)を貼りつけ、こ
れを引きはがす事により、基板と酸化タンタル膜の密着
強度を評価した。The obtained substrate is loaded into a sputtering device, and first 8
The atmosphere was evacuated to below X 10-'torr, and a Ta target was reactively sputtered using a mixed gas of Ar and 0□ to form an interference layer (thickness: 800 mm) consisting of Ta and O. Next, by simultaneous binary sputtering with Ar gas using a Tb target and a FeCo target, Tb
A FeCo recording layer (300 layers thick) was provided. Furthermore, T
The A2 target on which the i-chip was placed was sputtered in Ar gas to form a reflective layer with a thickness of 300 mm. On the mirror surface of the substrate on which this film is provided, draw 10 lines each in an area of 1 cm x 11. Apply Teraoka's adhesive tape (imide film base) to the resulting substrate grating area, and then pull it. The adhesion strength between the substrate and the tantalum oxide film was evaluated by peeling it off.
結果はlmmX1mm角の基盤目状試験片100枚のう
ちはがれたものは1枚もなかった。As a result, not one of the 100 test pieces in the shape of a substrate measuring 1 mm x 1 mm square was peeled off.
実施例−2
樹脂製造例−3で得られた水素化重合体5kgに、低分
子量ポリビニルシクロヘキサン(荒用化学社製ア/l/
17P−125軟化点125 ’C1分子量820)1
50gを加え、添加剤等も含め実施例−1と同様にペレ
ット化、射出成型、スパッタリングを行なった。基板樹
脂の軟化温度は168℃1弾性率は29. OOOk
g/cfflであった。実施例−1と同様にしてテープ
剥離試験をした結果、剥離は100枚中1枚もなかった
。Example-2 5 kg of the hydrogenated polymer obtained in Resin Production Example-3 was added with low molecular weight polyvinylcyclohexane (A/L/
17P-125 Softening point 125'C1 Molecular weight 820) 1
50 g was added, and pelletization, injection molding, and sputtering were performed in the same manner as in Example 1, including additives and the like. The softening temperature of the substrate resin is 168°C and the elastic modulus is 29. OOOk
g/cffl. As a result of performing a tape peeling test in the same manner as in Example 1, not one out of 100 sheets peeled off.
実施例〜3
樹脂製造例−1で得られた水素化重合体2.5 kg、
及び樹脂製造例−2で得られた水素化重合体2.5kg
を実施例−2と同様にペレット化、射出成型、スパッタ
リングを行なった。基板樹脂の軟化温度は158℃1弾
性率は23 、 000 kg/ciであった。テープ
剥離試験の結果、剥離は100枚中1枚もなかった。Example-3 2.5 kg of hydrogenated polymer obtained in Resin Production Example-1,
and 2.5 kg of hydrogenated polymer obtained in Resin Production Example-2
Pelletization, injection molding, and sputtering were performed in the same manner as in Example-2. The softening temperature of the substrate resin was 158° C., and the elastic modulus was 23,000 kg/ci. As a result of the tape peel test, not one out of 100 tapes peeled off.
実施例−4
樹脂製造例−1で得られた重合体の代わりに樹脂製造例
−5で得られた重合体を用いる以外は実施例−1と同様
にして光ディスク基板を得、スパッターリングを行なっ
た。Example-4 An optical disk substrate was obtained in the same manner as in Example-1 except that the polymer obtained in Resin Production Example-5 was used instead of the polymer obtained in Resin Production Example-1, and sputtering was performed. Ta.
基板樹脂の軟化温度は161℃1弾性率は28゜000
kg/adであった。テープ剥離試験の結果、剥離は1
00枚中1枚もなかった。The softening temperature of the substrate resin is 161°C, and the elastic modulus is 28°000.
kg/ad. As a result of tape peeling test, peeling was 1
There wasn't even one out of 00.
実施例−5
樹脂製造例−1で得られた重合体4.25kg、樹脂製
造例−4で得られた重合体0.75kg、及び実施例−
1で用いたアルコンP−100250gを用いる以外は
実施例−1と同様にして光ディスク基板を得、スパッタ
リングを行なった。Example-5 4.25 kg of the polymer obtained in Resin Production Example-1, 0.75 kg of the polymer obtained in Resin Production Example-4, and Example-
An optical disc substrate was obtained in the same manner as in Example 1 except that 250 g of Alcon P-100 used in Example 1 was used, and sputtering was performed.
基板樹脂の軟化温度は160℃1弾性率は27000k
g/csllであった。テープ剥離試験の結果、剥離は
100枚中1枚もなかった。The softening temperature of the substrate resin is 160℃, and the elastic modulus is 27000k.
g/csll. As a result of the tape peel test, not one out of 100 tapes peeled off.
比較例−1
樹脂製造例−1で得られた重合体5.0 kgに実施例
−1と同様の添加剤を加え、同様にペレット化、射出成
型、スパッタリングを行なった。基板樹脂の軟化温度は
172℃1弾性率は32,000kg/ ciであった
。Comparative Example 1 Additives similar to those in Example 1 were added to 5.0 kg of the polymer obtained in Resin Production Example 1, and pelletization, injection molding, and sputtering were performed in the same manner. The softening temperature of the substrate resin was 172°C, and the elastic modulus was 32,000 kg/ci.
テープ剥離試験の結果、剥離は100枚中工〇〇枚すべ
て剥離した。As a result of the tape peel test, all of the 100 pieces were peeled off.
比較例−2
実施例−1において、樹脂製造例−2で得られた水素化
重合体を用いる代わりに、樹脂製造例−2において水添
率を99.5%とした水素化重合体を用いる以外は実施
例−1と同様にペレット化、射出成型、スパッタリング
を行なった。Comparative Example-2 In Example-1, instead of using the hydrogenated polymer obtained in Resin Production Example-2, a hydrogenated polymer with a hydrogenation rate of 99.5% in Resin Production Example-2 was used. Pelletization, injection molding, and sputtering were performed in the same manner as in Example-1 except for this.
基板樹脂の軟化温度は163 ”C1弾性率は28゜0
00 kg/C1flであった。テープ剥離試験の結果
、剥離は100枚中98枚であった。The softening temperature of the substrate resin is 163" and the C1 elastic modulus is 28°0.
00 kg/C1fl. As a result of the tape peel test, 98 out of 100 tapes were peeled off.
比較例−3
樹脂製造例−6で得られた重合体5.0 kgに実施例
−1と同様の添加剤を加え、同様にペレット化、射出成
型、スパッタリングを行なった。基板樹脂の軟化温度は
150°c1弾性率は32,000kg/dであった。Comparative Example 3 The same additives as in Example 1 were added to 5.0 kg of the polymer obtained in Resin Production Example 6, and pelletization, injection molding, and sputtering were performed in the same manner. The softening temperature of the substrate resin was 150°c1, and the elastic modulus was 32,000 kg/d.
テープ剥離試験の結果、剥離は100枚中5枚あり、耐
熱性が大巾に低下しており、接着力も依然不十分であっ
た。As a result of the tape peel test, 5 out of 100 tapes peeled off, indicating that the heat resistance was significantly reduced and the adhesive strength was still insufficient.
実施例、比較例の結果を第1表にまとめる。The results of Examples and Comparative Examples are summarized in Table 1.
第 1 表
〔発明の効果〕
本発明の組成物は耐熱性、光学特性及び記録膜層との接
着性に優れており、光ディスク基板及びその他の光学用
材料に利用できる。Table 1 [Effects of the Invention] The composition of the present invention has excellent heat resistance, optical properties, and adhesion to recording film layers, and can be used for optical disc substrates and other optical materials.
Claims (3)
ク共重合体中の全二重結合及び芳香核の 75mol〜98mol%を水素化して得られる重合体
1〜100重量%未満と (b)ビニル芳香族炭化水素重合体中の芳香核の80m
ol%以上を水素化して得られる重合体0〜95重量%
及び/又は (c)数平均分子量500〜5,000、軟化点40℃
以上の飽和炭化水素樹脂0〜20 重量%(ただし、(b)成分と(c)成分の合計は0重
量%を超える) の二ないし三成分からなる水素化ビニル芳 香族炭化水素重合体組成物。(1) (a) 1 to less than 100% by weight of a polymer obtained by hydrogenating 75 mol to 98 mol% of all double bonds and aromatic nuclei in the vinyl aromatic hydrocarbon-conjugated diene block copolymer; and (b) 80m of aromatic nuclei in vinyl aromatic hydrocarbon polymer
0 to 95% by weight of polymer obtained by hydrogenating ol% or more
and/or (c) number average molecular weight 500-5,000, softening point 40°C
A hydrogenated vinyl aromatic hydrocarbon polymer composition comprising two or three components of the above saturated hydrocarbon resins from 0 to 20% by weight (however, the total of components (b) and (c) exceeds 0% by weight). .
請求の範囲第1項記載の水素化ビニ ル芳香族炭化水素重合体組成物。(2) The hydrogenated vinyl aromatic hydrocarbon polymer composition according to claim 1, which is used as an optical material.
炭化水素重合体組成物よりなる事を 特徴とする光ディスク基板。(3) An optical disc substrate comprising the hydrogenated vinyl aromatic hydrocarbon polymer composition according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1253388A JP2725402B2 (en) | 1989-09-28 | 1989-09-28 | Hydrogenated vinyl aromatic hydrocarbon polymer composition and optical disk substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1253388A JP2725402B2 (en) | 1989-09-28 | 1989-09-28 | Hydrogenated vinyl aromatic hydrocarbon polymer composition and optical disk substrate |
Publications (2)
Publication Number | Publication Date |
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JPH03115349A true JPH03115349A (en) | 1991-05-16 |
JP2725402B2 JP2725402B2 (en) | 1998-03-11 |
Family
ID=17250674
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Application Number | Title | Priority Date | Filing Date |
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JP1253388A Expired - Lifetime JP2725402B2 (en) | 1989-09-28 | 1989-09-28 | Hydrogenated vinyl aromatic hydrocarbon polymer composition and optical disk substrate |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2000070607A1 (en) * | 1999-05-12 | 2000-11-23 | Bayer Aktiengesellschaft | Substrates for optical storage media |
WO2001016950A1 (en) * | 1999-08-27 | 2001-03-08 | The Dow Chemical Company | High data density optical media discs |
WO2002020662A1 (en) * | 2000-09-07 | 2002-03-14 | Teijin Limited | Hydrogenated styrene block copolymer composition and optical disk substrate obtained therefrom |
US6429260B1 (en) | 2000-05-31 | 2002-08-06 | The Dow Chemical Company | Olefinic polymer compositions |
JP2003506513A (en) * | 1999-07-28 | 2003-02-18 | ザ ダウ ケミカル カンパニー | Hydrogenated block polymer having elasticity and articles obtained therefrom |
JPWO2003029347A1 (en) * | 2001-09-27 | 2005-01-13 | 帝人株式会社 | Hydrogenated styrene polymer resin composition and optical component |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US20020061982A1 (en) | 1999-06-11 | 2002-05-23 | Donald Robert J. | Compositions comprising hydrogenated block copolymers and end-use applications thereof |
US20020061981A1 (en) | 1999-06-11 | 2002-05-23 | Donald Robert J. | Compositions comprising hydrogenated block copolymers and end-use applications thereof |
TWI396701B (en) | 2006-02-27 | 2013-05-21 | Mitsubishi Gas Chemical Co | Manufacturing method of hydrogenated polymer |
US8575277B2 (en) | 2007-08-06 | 2013-11-05 | Mitsubishi Gas Chemical Company, Inc. | Process for production of nucleus-hydrogenated aromatic vinyl/(meth)acrylate copolymers |
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1989
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000070607A1 (en) * | 1999-05-12 | 2000-11-23 | Bayer Aktiengesellschaft | Substrates for optical storage media |
JP2003506513A (en) * | 1999-07-28 | 2003-02-18 | ザ ダウ ケミカル カンパニー | Hydrogenated block polymer having elasticity and articles obtained therefrom |
WO2001016950A1 (en) * | 1999-08-27 | 2001-03-08 | The Dow Chemical Company | High data density optical media discs |
JP2003535418A (en) * | 1999-08-27 | 2003-11-25 | ザ ダウ ケミカル カンパニー | High data density optical media disk |
US6429260B1 (en) | 2000-05-31 | 2002-08-06 | The Dow Chemical Company | Olefinic polymer compositions |
WO2002020662A1 (en) * | 2000-09-07 | 2002-03-14 | Teijin Limited | Hydrogenated styrene block copolymer composition and optical disk substrate obtained therefrom |
JPWO2003029347A1 (en) * | 2001-09-27 | 2005-01-13 | 帝人株式会社 | Hydrogenated styrene polymer resin composition and optical component |
Also Published As
Publication number | Publication date |
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JP2725402B2 (en) | 1998-03-11 |
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