JPH03110885U - - Google Patents
Info
- Publication number
- JPH03110885U JPH03110885U JP1990019671U JP1967190U JPH03110885U JP H03110885 U JPH03110885 U JP H03110885U JP 1990019671 U JP1990019671 U JP 1990019671U JP 1967190 U JP1967190 U JP 1967190U JP H03110885 U JPH03110885 U JP H03110885U
- Authority
- JP
- Japan
- Prior art keywords
- lsi package
- heat dissipation
- dissipation structure
- cover
- leaf spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/877—
-
- H10W90/724—
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990019671U JPH03110885U (enExample) | 1990-02-27 | 1990-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990019671U JPH03110885U (enExample) | 1990-02-27 | 1990-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03110885U true JPH03110885U (enExample) | 1991-11-13 |
Family
ID=31522776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990019671U Pending JPH03110885U (enExample) | 1990-02-27 | 1990-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03110885U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020087971A (ja) * | 2018-11-15 | 2020-06-04 | 株式会社デンソー | 半導体部品の放熱構造 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62219598A (ja) * | 1986-03-19 | 1987-09-26 | 富士通株式会社 | 素子の放熱方法 |
-
1990
- 1990-02-27 JP JP1990019671U patent/JPH03110885U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62219598A (ja) * | 1986-03-19 | 1987-09-26 | 富士通株式会社 | 素子の放熱方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020087971A (ja) * | 2018-11-15 | 2020-06-04 | 株式会社デンソー | 半導体部品の放熱構造 |