JPH03110847U - - Google Patents

Info

Publication number
JPH03110847U
JPH03110847U JP2030390U JP2030390U JPH03110847U JP H03110847 U JPH03110847 U JP H03110847U JP 2030390 U JP2030390 U JP 2030390U JP 2030390 U JP2030390 U JP 2030390U JP H03110847 U JPH03110847 U JP H03110847U
Authority
JP
Japan
Prior art keywords
package
lead pins
integrated circuit
exposed portion
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2030390U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2030390U priority Critical patent/JPH03110847U/ja
Publication of JPH03110847U publication Critical patent/JPH03110847U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2030390U 1990-02-28 1990-02-28 Pending JPH03110847U (US07655688-20100202-C00109.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2030390U JPH03110847U (US07655688-20100202-C00109.png) 1990-02-28 1990-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2030390U JPH03110847U (US07655688-20100202-C00109.png) 1990-02-28 1990-02-28

Publications (1)

Publication Number Publication Date
JPH03110847U true JPH03110847U (US07655688-20100202-C00109.png) 1991-11-13

Family

ID=31523399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2030390U Pending JPH03110847U (US07655688-20100202-C00109.png) 1990-02-28 1990-02-28

Country Status (1)

Country Link
JP (1) JPH03110847U (US07655688-20100202-C00109.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998008251A1 (fr) * 1996-08-20 1998-02-26 Hitachi, Ltd. Semi-conducteur et procede de fabrication correspondant
JP2003007966A (ja) * 2001-06-19 2003-01-10 Mitsubishi Electric Corp 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998008251A1 (fr) * 1996-08-20 1998-02-26 Hitachi, Ltd. Semi-conducteur et procede de fabrication correspondant
JP2003007966A (ja) * 2001-06-19 2003-01-10 Mitsubishi Electric Corp 半導体装置
JP4540884B2 (ja) * 2001-06-19 2010-09-08 三菱電機株式会社 半導体装置

Similar Documents

Publication Publication Date Title
JPH03110847U (US07655688-20100202-C00109.png)
JPH0262721U (US07655688-20100202-C00109.png)
JPH0463163U (US07655688-20100202-C00109.png)
JPH03101544U (US07655688-20100202-C00109.png)
JPS5874341U (ja) 半導体装置の樹脂モ−ルド装置
JPS6389253U (US07655688-20100202-C00109.png)
JPS59164251U (ja) 半導体装置用リ−ドフレ−ム
JPH0336141U (US07655688-20100202-C00109.png)
JPS583035U (ja) 樹脂モ−ルド用の型
JPS5844841U (ja) 樹脂封止形半導体装置のモ−ルド金型
JPH0470755U (US07655688-20100202-C00109.png)
JPH03102740U (US07655688-20100202-C00109.png)
JPH0485737U (US07655688-20100202-C00109.png)
JPH01156554U (US07655688-20100202-C00109.png)
JPH0231138U (US07655688-20100202-C00109.png)
JPS6331547U (US07655688-20100202-C00109.png)
JPS60179416U (ja) モ−ルド体
JPH0217810U (US07655688-20100202-C00109.png)
JPS6221523U (US07655688-20100202-C00109.png)
JPH0350317U (US07655688-20100202-C00109.png)
JPH0339857U (US07655688-20100202-C00109.png)
JPH0288271U (US07655688-20100202-C00109.png)
JPS588966U (ja) 半導体受光装置
JPH01121966U (US07655688-20100202-C00109.png)
JPH01146537U (US07655688-20100202-C00109.png)