JPH03106794U - - Google Patents
Info
- Publication number
- JPH03106794U JPH03106794U JP1553690U JP1553690U JPH03106794U JP H03106794 U JPH03106794 U JP H03106794U JP 1553690 U JP1553690 U JP 1553690U JP 1553690 U JP1553690 U JP 1553690U JP H03106794 U JPH03106794 U JP H03106794U
- Authority
- JP
- Japan
- Prior art keywords
- coupling surface
- heat transfer
- transfer body
- power semiconductor
- semiconductor elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims 5
- 238000010168 coupling process Methods 0.000 claims 5
- 238000005859 coupling reaction Methods 0.000 claims 5
- 230000017525 heat dissipation Effects 0.000 claims 3
- 230000035939 shock Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1553690U JPH03106794U (fr) | 1990-02-19 | 1990-02-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1553690U JPH03106794U (fr) | 1990-02-19 | 1990-02-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03106794U true JPH03106794U (fr) | 1991-11-05 |
Family
ID=31518837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1553690U Pending JPH03106794U (fr) | 1990-02-19 | 1990-02-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03106794U (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0487211A (ja) * | 1990-07-31 | 1992-03-19 | Furukawa Electric Co Ltd:The | 低風騒音低コロナ騒音架空電線 |
JP2006202816A (ja) * | 2005-01-18 | 2006-08-03 | Japan Radio Co Ltd | 電子機器筐体の放熱器 |
JP2013232445A (ja) * | 2012-04-27 | 2013-11-14 | Toshiba Corp | 半導体装置 |
JP2015103801A (ja) * | 2013-11-26 | 2015-06-04 | 台達電子企業管理(上海)有限公司 | 電源変換装置 |
CN110463370A (zh) * | 2017-03-20 | 2019-11-15 | Lg伊诺特有限公司 | 用于功率转换模块的散热装置和包括该装置的功率转换模块 |
-
1990
- 1990-02-19 JP JP1553690U patent/JPH03106794U/ja active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0487211A (ja) * | 1990-07-31 | 1992-03-19 | Furukawa Electric Co Ltd:The | 低風騒音低コロナ騒音架空電線 |
JP2006202816A (ja) * | 2005-01-18 | 2006-08-03 | Japan Radio Co Ltd | 電子機器筐体の放熱器 |
JP2013232445A (ja) * | 2012-04-27 | 2013-11-14 | Toshiba Corp | 半導体装置 |
JP2015103801A (ja) * | 2013-11-26 | 2015-06-04 | 台達電子企業管理(上海)有限公司 | 電源変換装置 |
TWI562707B (en) * | 2013-11-26 | 2016-12-11 | Delta Electronics Shanghai Co | Power converter and power conversion board assembly |
CN110463370A (zh) * | 2017-03-20 | 2019-11-15 | Lg伊诺特有限公司 | 用于功率转换模块的散热装置和包括该装置的功率转换模块 |
EP3606305A4 (fr) * | 2017-03-20 | 2020-03-25 | LG Innotek Co., Ltd. | Dispositif de dissipation de chaleur pour module de conversion d'énergie, et module de conversion d'énergie le comprenant |
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