JPH03106775U - - Google Patents
Info
- Publication number
- JPH03106775U JPH03106775U JP1464590U JP1464590U JPH03106775U JP H03106775 U JPH03106775 U JP H03106775U JP 1464590 U JP1464590 U JP 1464590U JP 1464590 U JP1464590 U JP 1464590U JP H03106775 U JPH03106775 U JP H03106775U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- base substrate
- inorganic filler
- circuit conductor
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011256 inorganic filler Substances 0.000 claims 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図及び第２図は本考案に係る金属ベース基
板の第１実施例及び第２実施例を示す層構成図で
ある。第３図及び第４図は従来例を示す層構成図
である。
１……金属板、２……絶縁層、３……回路導体
、４……絶縁層。
1 and 2 are layer configuration diagrams showing a first embodiment and a second embodiment of a metal base substrate according to the present invention. FIGS. 3 and 4 are layer configuration diagrams showing a conventional example. 1... Metal plate, 2... Insulating layer, 3... Circuit conductor, 4... Insulating layer.
Claims (1)
成されている金属ベース基板において、 前記絶縁層が長尺形状の無機充填材を添加され
た有機絶縁材料からなり、該無機充填材の長手方
向が回路導体側から金属板側に向かつて揃えられ
ていること、 を特徴とする金属ベース基板。[Claims for Utility Model Registration] A metal base substrate in which a circuit conductor is formed on the surface of a metal plate via an insulating layer, wherein the insulating layer is made of an organic insulating material added with an elongated inorganic filler. A metal base substrate characterized in that the longitudinal direction of the inorganic filler is aligned from the circuit conductor side to the metal plate side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1464590U JPH03106775U (en) | 1990-02-15 | 1990-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1464590U JPH03106775U (en) | 1990-02-15 | 1990-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03106775U true JPH03106775U (en) | 1991-11-05 |
Family
ID=31517995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1464590U Pending JPH03106775U (en) | 1990-02-15 | 1990-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03106775U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4427994C2 (en) * | 1993-08-06 | 2000-10-26 | Mitsubishi Electric Corp | Metal core substrate, especially for use in electronic circuits |
-
1990
- 1990-02-15 JP JP1464590U patent/JPH03106775U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4427994C2 (en) * | 1993-08-06 | 2000-10-26 | Mitsubishi Electric Corp | Metal core substrate, especially for use in electronic circuits |
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