JPH03106764U - - Google Patents

Info

Publication number
JPH03106764U
JPH03106764U JP1990014908U JP1490890U JPH03106764U JP H03106764 U JPH03106764 U JP H03106764U JP 1990014908 U JP1990014908 U JP 1990014908U JP 1490890 U JP1490890 U JP 1490890U JP H03106764 U JPH03106764 U JP H03106764U
Authority
JP
Japan
Prior art keywords
facing
light
mounting
emitting diode
mounting surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990014908U
Other languages
English (en)
Japanese (ja)
Other versions
JP2544236Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990014908U priority Critical patent/JP2544236Y2/ja
Publication of JPH03106764U publication Critical patent/JPH03106764U/ja
Application granted granted Critical
Publication of JP2544236Y2 publication Critical patent/JP2544236Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1990014908U 1990-02-16 1990-02-16 発光ダイオードランプ Expired - Lifetime JP2544236Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990014908U JP2544236Y2 (ja) 1990-02-16 1990-02-16 発光ダイオードランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990014908U JP2544236Y2 (ja) 1990-02-16 1990-02-16 発光ダイオードランプ

Publications (2)

Publication Number Publication Date
JPH03106764U true JPH03106764U (fr) 1991-11-05
JP2544236Y2 JP2544236Y2 (ja) 1997-08-13

Family

ID=31518244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990014908U Expired - Lifetime JP2544236Y2 (ja) 1990-02-16 1990-02-16 発光ダイオードランプ

Country Status (1)

Country Link
JP (1) JP2544236Y2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011142123A1 (fr) * 2010-05-14 2011-11-17 コニカミノルタセンシング株式会社 Sources de lumière, système optique d'éclairage et appareil de mesure de propriétés de réflexion

Also Published As

Publication number Publication date
JP2544236Y2 (ja) 1997-08-13

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