JPH03102766U - - Google Patents

Info

Publication number
JPH03102766U
JPH03102766U JP1167690U JP1167690U JPH03102766U JP H03102766 U JPH03102766 U JP H03102766U JP 1167690 U JP1167690 U JP 1167690U JP 1167690 U JP1167690 U JP 1167690U JP H03102766 U JPH03102766 U JP H03102766U
Authority
JP
Japan
Prior art keywords
thin film
ground plane
wiring board
film wiring
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1167690U
Other languages
English (en)
Japanese (ja)
Other versions
JPH085579Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990011676U priority Critical patent/JPH085579Y2/ja
Publication of JPH03102766U publication Critical patent/JPH03102766U/ja
Application granted granted Critical
Publication of JPH085579Y2 publication Critical patent/JPH085579Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1990011676U 1990-02-08 1990-02-08 薄膜配線基板 Expired - Lifetime JPH085579Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990011676U JPH085579Y2 (ja) 1990-02-08 1990-02-08 薄膜配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990011676U JPH085579Y2 (ja) 1990-02-08 1990-02-08 薄膜配線基板

Publications (2)

Publication Number Publication Date
JPH03102766U true JPH03102766U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-10-25
JPH085579Y2 JPH085579Y2 (ja) 1996-02-14

Family

ID=31515197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990011676U Expired - Lifetime JPH085579Y2 (ja) 1990-02-08 1990-02-08 薄膜配線基板

Country Status (1)

Country Link
JP (1) JPH085579Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214412A (ja) * 2002-12-27 2004-07-29 Tohoku Ricoh Co Ltd ノイズシールド板及びプリント配線板
JP2007116010A (ja) * 2005-10-24 2007-05-10 Sumitomo Bakelite Co Ltd 回路基板

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015083216A1 (ja) * 2013-12-02 2015-06-11 山一電機株式会社 多層基板、及び、その製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119797A (ja) * 1982-12-25 1984-07-11 京セラ株式会社 多層配線基板
JPS60211897A (ja) * 1984-04-05 1985-10-24 日本電気株式会社 多層配線基板
JPS6423598A (en) * 1987-07-20 1989-01-26 Sony Corp Multilayer circuit board
JPS6482694A (en) * 1987-09-25 1989-03-28 Toshiba Corp Wiring substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119797A (ja) * 1982-12-25 1984-07-11 京セラ株式会社 多層配線基板
JPS60211897A (ja) * 1984-04-05 1985-10-24 日本電気株式会社 多層配線基板
JPS6423598A (en) * 1987-07-20 1989-01-26 Sony Corp Multilayer circuit board
JPS6482694A (en) * 1987-09-25 1989-03-28 Toshiba Corp Wiring substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214412A (ja) * 2002-12-27 2004-07-29 Tohoku Ricoh Co Ltd ノイズシールド板及びプリント配線板
JP2007116010A (ja) * 2005-10-24 2007-05-10 Sumitomo Bakelite Co Ltd 回路基板

Also Published As

Publication number Publication date
JPH085579Y2 (ja) 1996-02-14

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