JPH03102729A - Compound raw material for thermal fuse - Google Patents
Compound raw material for thermal fuseInfo
- Publication number
- JPH03102729A JPH03102729A JP23927089A JP23927089A JPH03102729A JP H03102729 A JPH03102729 A JP H03102729A JP 23927089 A JP23927089 A JP 23927089A JP 23927089 A JP23927089 A JP 23927089A JP H03102729 A JPH03102729 A JP H03102729A
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- alloy
- tape
- lay
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000001875 compounds Chemical class 0.000 title abstract 4
- 239000002994 raw material Substances 0.000 title abstract 2
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 21
- 239000000956 alloy Substances 0.000 claims abstract description 21
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 6
- 239000002131 composite material Substances 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 10
- 230000004044 response Effects 0.000 abstract description 4
- 238000005553 drilling Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000006903 response to temperature Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
Description
【発明の詳細な説明】
（産業１′．の利用分粁）
本発明は、ＩＣ保護ＩＩｊＩ路用チップ型ヒューズのｄ
＝’ ＪｊＡに係り、詳しくはＳＭＤ（Ｓｕｒｆａｃｅ
Ｍｏｕｎｔ Ｄｅｖｉｃｅ）用で、特にｆ氏ｉ’７，
！ （ １５０ 〜６００’Ｃ）、ＩＡ前後でイＪ゜効
な限流ヒューズの素月に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Utilization of Industry 1'.) The present invention provides a
=' Regarding JJA, please refer to SMD (Surface) for details.
Mount Device), especially Mr. f i'7,
! (150 to 600'C), relates to the characteristics of a current limiting fuse that is effective at around IA.
（従来の技術）
従来、上記用途のヒューズは、線又はテープのヒューズ
合金をリード片間に電気ｔｌｋ抗溶接（スボッ１・溶接
）、ろう付け、ボンディング等にて接合して取付けてヒ
ューズ川本相を得た後、＋ｂｌ Ｉｌｒ？モールドにて
封止して作っていた。(Prior art) Conventionally, fuses for the above-mentioned applications have been manufactured by attaching wire or tape fuse alloys between lead pieces by electric TLK welding (Subop 1 welding), brazing, bonding, etc. After getting +bl Ilr? It was made by sealing it with a mold.
（発明が解決しようとする課題）
ところで、」二記の方法で作ったヒューズは、ヒューズ
合金とリード片との接合強度が低く不安定であり、また
製作に工数がかかり、さらに小型化力壮ｌｌいなどの問
題点があった。(Problems to be Solved by the Invention) By the way, the fuse made by the method described in ``2'' has a low bonding strength between the fuse alloy and the lead piece, is unstable, requires a lot of man-hours to manufacture, and requires further miniaturization and effort. There were some problems, such as the lack of space.
そこで本発明は、ヒューズ合金の接合強度か１１゛６く
安定していて、また温度、電流に対して応答ｔ＋’ｔ度
（溶断４．Ｙｔｌ→が良くて品質も安定していて、さら
に生産性が良く、しかもヒューズの小型化の容躬な温度
ヒューズ川複介素材を堤供しようとするものである。Therefore, the present invention has a fuse alloy that has a stable bonding strength of 11゛6, a good response to temperature and current (fuse 4.Ytl→), and stable quality. The purpose of this invention is to provide a thermal fuse composite material that has good performance and is compatible with miniaturization of fuses.
（課題を解決するための手段）
上１？Ｌ！課題を解決するための本発明の温度ヒューズ
川復介累｛４は、ヒューズ介金が中央に記され、Ｃｕ又
はＣ Ｌｌ合金が両側に配されたテープ状スルーレイ型
複合材料の長千万向に、前記ヒューズ合金が所定のホリ
ュームとなるように一足間隔に窓孔が穿設されて成るも
のである。(Means to solve the problem) Top 1? L! The temperature fuse of the present invention to solve the problem {4] is a tape-like through-lay type composite material in which a fuse metal is written in the center and Cu or CLL alloy is arranged on both sides. Further, window holes are bored at one-foot intervals so that the fuse alloy has a predetermined volume.
（作用）
」二記の如く構成された本発明の温度ヒューズ用複合累
材は、予めヒューズ合金とリード片伺料となるＣｕ又は
Ｃｕ合金とが接合されたテープ状スルーレイ型複合Ｈ料
より成るので、従来のようにヒューズ令金をリード片間
に接合して取付ける作業は不要で、ヒューズ介金とリー
ド片月料となるＣｕ又はＣｕ合金との接合強度はｉＸ’
：＋ ＜安定しており、また温度、電流に対して応答梢
度（溶断特性）が良くて、品質も安定している。また上
記テープ状スルーレイ型複含材料の長手方向に、所足の
ポリューｌ１のヒューズ合金がｉ：Ｉられるように窓孔
が一定間隔が穿設されているので、その製作は間欠的に
テープ状スルーレイ型複含月料を移送し／１ζらブレス
成形により行うことができて生産性が良く、しかもヒュ
ーズの超小型化が容秘である。(Function) The composite material for thermal fuses of the present invention configured as described in section 2 is made of a tape-shaped through-lay type composite H material in which a fuse alloy and Cu or a Cu alloy serving as a lead piece are bonded in advance. Therefore, there is no need to attach the fuse metal between the lead pieces as in the past, and the bonding strength between the fuse metal and the Cu or Cu alloy that forms the lead piece is 1X'.
:+ <It is stable, has good response strength (fusing characteristics) to temperature and current, and has stable quality. In addition, window holes are drilled at regular intervals in the longitudinal direction of the tape-shaped through-lay type composite material so that the necessary polyl1 fuse alloy is i:I. The through-lay type multi-containing charge can be transferred and press-molded from 1ζ, resulting in good productivity, and furthermore, it is a secret that the fuse can be miniaturized.
（ソ！ＪＪ伍ｆ列）
本光明のｌ１．ｋ度ヒューズ用複含崇月の−・尖ｈ飢例
をＩＸ＋によって説明すると、第１図に示す如く中央に
Φｉ＋ｊ ｌ ， ＯｌｌＩｎ＋のヒューズ合金１、本
例てはＰｂ−Ｓｎ−ＩＯｗｔＸが配され、左右両側に幡
２４．５ｍｍのリート片としてのＣｕ２が配された総１
ｉ＋ｆ ５ ０ ｍｍ、ＩＩ／．さ０，０５ｍｍのテー
プ状スルーレイ型複合材料３の長手方向に第２図に示す
幅１ ０ ｎ＋ｍ、長さ４曲ｎの窓孔４をプレスにて穿
設してヒューズ用複合素４４５を得た。(So! JJ 5th row) Honkomyo's l1. To explain the complex case of K-degree fuse for - and IX+, as shown in Fig. 1, fuse alloy 1 of Φi+j l, OllIn+, in this example Pb-Sn-IOwtX, is arranged in the center. , a total of 1 with Cu2 as a reed piece of 24.5 mm on both the left and right sides.
i+f 50 mm, II/. A window hole 4 having a width of 10 n+m and a length of 4 curves as shown in FIG. 2 is punched in the longitudinal direction of the tape-shaped through-lay type composite material 3 with a diameter of 0.05 mm using a press to obtain a composite element 445 for a fuse. Ta.
然してこのヒューズ用複合素材５のヒューズ合金Ｉの部
分を、第３因に示す如くエポキシ樹１１旨６にて封止し
た後、長手方向に５．０ｍｍ間隔に１１『１次プレス切
断して第４図に示すＩＣ保護同路用チップ型ヒューズ７
を製作した。However, after sealing the fuse alloy I portion of this composite material 5 for fuses with epoxy wood 11 to 6 as shown in the third factor, primary press cutting 11' was carried out at intervals of 5.0 mm in the longitudinal direction. Chip type fuse 7 for IC protection circuit shown in Figure 4
was produced.
−・方、従来例を因によって説明すると、第５］′χ１
に示ず如＜ １’Ｉｌｆ ５ ｎｕｎ、長さ２ ０ ｍ
ｍ、１゛ｌさ０，０５ｍｍのＣｕより成るリード片８間
に、幡１．Ｏｍｎ＋、長さ７ ｍｍ、Ｊ′ｌさ０．０５
ｍｍのＰｂ−Ｓｎ４０ｗｔ％より成るヒューズ介金９を
ボンディングにて接合して取付けてヒューズ用素材ＩＯ
を？ｊＩた。-・If we explain the conventional example based on the factors, the fifth]'χ1
As shown in <1'Ilf 5 nun, length 20 m
A banner 1.m is placed between 8 lead pieces made of Cu with a length of 0.05 mm. Omn+, length 7 mm, J'l height 0.05
A fuse metal 9 made of 40 wt% of Pb-Sn of mm is bonded and attached to form the fuse material IO.
of? jIta.
然してこのヒューズ用素材１０のヒューズ合金９を第６
図に示す如くエボキシ樹ＩＩｉ″ｒ１１にて月止して、
ＩＣ保護回路用チップ型ヒューズ１２を製作した。However, the fuse alloy 9 of this fuse material 10 was
As shown in the figure, stop at the epoxy tree IIi''r11,
A chip type fuse 12 for an IC protection circuit was manufactured.
こうして実施例のヒューズ用複介素村から？’ＪたＩＣ
保護同路用チップ型ヒューズ７と、従来例のヒューズ用
索材１０から得たＩＣ保謹同路用チップ型ヒューズｌ２
とを各１００個、遮断特性（溶断４）゛性）について応
答精度：温度２００〜２３０℃、徂流ＩＡ±１０％の条
件で検杏した処、下記の表に示ずような桔果を？：Ｉた
。In this way, from the complex element village for the fuse of the example? 'Jta IC
Chip type fuse 7 for protection and IC protection and chip type fuse 12 obtained from the conventional fuse cable material 10
100 pieces of each were tested for cut-off characteristics (fusion cutting 4) response accuracy: temperature 200-230℃, current IA ± 10%, results as shown in the table below were obtained. ? :I.
Ｌ記の表で明らかなように従来例によるＩＣ保誰同路用
チップ型ヒューズ１２は不介格品が１００佃中８佃もあ
ったのに対し、火飽例によるＩｃ保設同路用チップ型ヒ
ューズ７は不合格品が４・９無であった。As is clear from the table L, there were 8 out of 100 chip-type fuses 12 for IC protection in the same circuit in the conventional example, which were uninterrupted. For chip type fuse 7, the number of rejected products was 4.9.
尚、上記丈施例では、ヒューズ用複合Ｊｔ’：４Ａ’５
からＩＣ保設１ｕｌ路用チップ型ヒュース７を作る際、
ヒューズ合金１の部分にエボキシ樹１指６を封止し、そ
の後プレス切断しているが、場介によってはヒューズ用
複合素４４５をプレス切断した後各ｌｉｔ品のヒューズ
含金１の部分にエボキシ樹指６を』１１１−するように
しても良いものである。In addition, in the above length example, composite Jt' for fuse: 4A'5
When making the chip type fuse 7 for IC storage 1ul path from
The epoxy resin 1 finger 6 is sealed in the fuse alloy 1 part and then press cut, but depending on the location, after the fuse composite element 445 is press cut, epoxy resin is sealed in the fuse metal 1 part of each lit product. It is also possible to make the tree fingers 6 '111-'.
またテープ状スルーレイ型複合材料３は、いかように作
ったものでも良い。例えばインレイ型複合Ｈ料の片面に
切削加王を施して製作したものでも良い。Further, the tape-shaped through-lay type composite material 3 may be made in any way. For example, it may be manufactured by cutting one side of an inlay type composite H material.
さらに本発明の温皮ヒューズ用複介累４Ａ’ ５のヒュ
ーズ合金１のポリュー１２は、所定のヒュースイト様に
より複合累月５の板ＪＺとの関係で長さを阻定するもの
である。Further, the length of the polyurethane 12 of the fuse alloy 1 of the composite lamina 4A' 5 for a warm skin fuse of the present invention is restricted in relation to the plate JZ of the composite lunar 5 by a predetermined fuseite shape.
また本発明の温度ヒューズ用複合崇月５のリード片とし
ては、ＣＬＩ，ＣＬＩ合金以タトのものでも良いが、徂
気特ｔ’ｌＥ、とりわけ良奸な電気転導−ｔ’ｌの点か
らはやはりＣ Ｌｌ又はＣｕ介金が灯ましいものである
。The lead pieces of the composite Sogetsu 5 for thermal fuses of the present invention may be made of CLI, CLI alloys, etc., but from the point of view of higher temperature characteristics, especially good electric conduction. Of course, C Ll or Cu metal is the most promising.
（発明の効果）
以上の説明で判るように本発明の温度ヒューズ用複合素
ＪｊＡは、ヒューズ含金とり−１・片４４４′Ｆとなる
Ｃｕ又はＣｕ介金がスルーレイ１＆介されていて援合強
度がｉ；：＋ ＜安定しており、また温度、電流に対し
て応答Ｉ１１度（溶断４．Ｙ性）が良くて品１１も安定
している。さらにテープ状スルーレイ型複合・＋ｊ：’
４’Ａの長手方向にー・定間隔に窓孔が穿設されてい
るので、その製作は間欠的にテープ状スルーレイ型複合
材を移送し午らブレス成形により行うことができて生産
ｆＬが良く、しかもヒューズの超小型も容易である。(Effects of the Invention) As can be seen from the above explanation, the composite element JjA for a thermal fuse of the present invention has Cu or Cu intervening metal which becomes the fuse metal-containing strip 1/piece 444'F through-lay 1 & intervening. The strength is i;:+<stable, and the response to temperature and current is good (I11 degree) (melting resistance: 4.Y), and product 11 is also stable. In addition, tape-like through-lay type composite +j:'
Since window holes are drilled at regular intervals in the longitudinal direction of 4'A, the production can be carried out by intermittently transferring the tape-shaped through-lay type composite material and press-molding it, reducing the production fL. Moreover, it is easy to make the fuse ultra-small.
第１図はテープ状スルーレイ型複合４Ａ料を示す斜祝図
、第２図は本発明のヒューズ用複介素利を示す斜視因、
第３図は第２図のヒューズ用複合累ヰ４のヒューズ合金
を樹脂封止した状態を示す斜視図、第４図は第３図の複
含索Ｈを切断して？：ｌたＩＣ保護同路用ヂップ型ヒュ
ーズを示す斜悦図、第５図は従来のヒューズ用スｚイイ
を示す斜視図、第６図は第５図のヒューズ用素材から得
たＩＣ保護同路用チップ３Ｓ２ヒューズを示す斜視図で
ある。FIG. 1 is a perspective view showing a tape-like through-lay type composite 4A material, and FIG. 2 is a perspective view showing a composite element for a fuse according to the present invention.
FIG. 3 is a perspective view showing the state in which the fuse alloy of the composite wire 4 for fuses shown in FIG. 2 is sealed with resin, and FIG. 4 is a perspective view showing the composite wire H shown in FIG. Figure 5 is a perspective view showing a conventional fuse fuse, and Figure 6 is an IC protection fuse obtained from the fuse material shown in Figure 5. FIG. 3 is a perspective view showing a circuit chip 3S2 fuse.
Claims (1)
両側に配されたテープ状スルーレイ型複合材料の長手方
向に、前記ヒューズ合金が所定のボリュームとなるよう
に一定間隔に窓孔が穿設されて成る温度ヒューズ用複合
素材。1) Window holes are drilled at regular intervals in the longitudinal direction of a tape-shaped through-lay type composite material in which a fuse alloy is arranged in the center and Cu or Cu alloys are arranged on both sides so that the fuse alloy has a predetermined volume. Composite material for thermal fuses.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23927089A JPH03102729A (en) | 1989-09-14 | 1989-09-14 | Compound raw material for thermal fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23927089A JPH03102729A (en) | 1989-09-14 | 1989-09-14 | Compound raw material for thermal fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102729A true JPH03102729A (en) | 1991-04-30 |
Family
ID=17042264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23927089A Pending JPH03102729A (en) | 1989-09-14 | 1989-09-14 | Compound raw material for thermal fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102729A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6163244A (en) * | 1997-12-16 | 2000-12-19 | Yazaki Corporation | Method for producing fuse element and fuse element produced by the same |
-
1989
- 1989-09-14 JP JP23927089A patent/JPH03102729A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6163244A (en) * | 1997-12-16 | 2000-12-19 | Yazaki Corporation | Method for producing fuse element and fuse element produced by the same |
| US6622375B1 (en) | 1997-12-16 | 2003-09-23 | Yazaki Corporation | Method for producing a fuse element |
| DE19857299B4 (en) * | 1997-12-16 | 2005-09-15 | Yazaki Corp. | Method for producing a fuse element and fuse element made with the same |
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