JPH03101528U - - Google Patents
Info
- Publication number
- JPH03101528U JPH03101528U JP948390U JP948390U JPH03101528U JP H03101528 U JPH03101528 U JP H03101528U JP 948390 U JP948390 U JP 948390U JP 948390 U JP948390 U JP 948390U JP H03101528 U JPH03101528 U JP H03101528U
- Authority
- JP
- Japan
- Prior art keywords
- bonding position
- window hole
- semiconductor element
- tab tape
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000003566 sealing material Substances 0.000 claims description 2
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990009483U JP2525354Y2 (ja) | 1990-01-31 | 1990-01-31 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990009483U JP2525354Y2 (ja) | 1990-01-31 | 1990-01-31 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03101528U true JPH03101528U (bg) | 1991-10-23 |
JP2525354Y2 JP2525354Y2 (ja) | 1997-02-12 |
Family
ID=31513083
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990009483U Expired - Fee Related JP2525354Y2 (ja) | 1990-01-31 | 1990-01-31 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2525354Y2 (bg) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6867068B2 (en) | 1996-10-17 | 2005-03-15 | Seiko Epson Corporation | Semiconductor device, method of making the same, circuit board, and film carrier tape |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03129745A (ja) * | 1989-10-16 | 1991-06-03 | Sumitomo Bakelite Co Ltd | 半導体装置の実装方法 |
-
1990
- 1990-01-31 JP JP1990009483U patent/JP2525354Y2/ja not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03129745A (ja) * | 1989-10-16 | 1991-06-03 | Sumitomo Bakelite Co Ltd | 半導体装置の実装方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6867068B2 (en) | 1996-10-17 | 2005-03-15 | Seiko Epson Corporation | Semiconductor device, method of making the same, circuit board, and film carrier tape |
Also Published As
Publication number | Publication date |
---|---|
JP2525354Y2 (ja) | 1997-02-12 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |