JPH03101289A - Packaging structure of semiconductor device - Google Patents

Abstract

PURPOSE:To reduce occurrence of non-conforming articles after mounting to a substrate and to enable functions of the substrate to be maintained normally by exchanging a small number of semiconductor elements even if defective articles may occur by mounting relatively small number of semiconductor packages on a middle substrate for performing various kinds of tests and by mounting only the middle substrates which passed this onto a plurality of substrates. CONSTITUTION:The tip part of a conduction pattern 18 which is provided at each semiconductor package placement position, 19, 19a, 19b, and 19c on a middle substrate 17 and a lead 3 of a semiconductor package D whose functions are tested previously are adjusted and electrical joint is performed by soldering, etc. Functional test is performed again in this state and only the package of the semiconductor package D which is decided to be defective is replaced by a new one. After this, resin sealing is performed to the lead 3 of each semiconductor package D and a joint part of the conduction pattern 18 for protection. Then, the middle substrate 17 which was subjected to resin sealing is mounted to a printed-wiring board 14 and the terminal on the middle substrate 17 and a wiring pattern 15 which is provided on the printed wiring board 14 are connected and current conductor test is performed, thus completing packaging of a number of semiconductor packages D.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mounting structure for a semiconductor device in which a large number of semiconductor packages are mounted on a printed wiring board at high density.

[Prior art] A semiconductor package is manufactured by attaching a semiconductor element to a die pad provided on a lead frame at -82, connecting the electrodes of the semiconductor element and terminals of the lead frame with wires, and connecting the semiconductor element and the surroundings of the wires and the terminals. Part of the resin,
Alternatively, after packaging it in ceramic, it is cut at the terminals, and the terminals are bent appropriately to connect. This makes the package thicker and larger overall.

By the way, recently, as electronic devices have become smaller and thinner,
The semiconductor packages used for this purpose are also required to be mounted in high density, so there is a desire for thinner and smaller semiconductor packages.

In order to meet these demands, a semiconductor element is placed in the device hole of a film carrier, the electrodes of the semiconductor element are directly connected to the leads of the film carrier, and a seal made of liquid resin (e.g. epoxy resin) is applied. Semiconductor packages that are printed or packaged with adhesive materials have come into use.

FIG. 3 is a plan view for explaining a semiconductor package using a film carrier. In the figure, 1 denotes semiconductor elements 6° 6a, 6b, which will be described later, arranged at equal intervals in the length direction.
Device hole 2 with an area larger than the surface area of...
．． 2a, 2b... thickness 25 to 1
It is a film carrier (hereinafter referred to as a film) of about 25 μm. 3 is a large number of leads made of a highly conductive metal foil such as copper, with a thickness of 10 to 70 μm and a width of 30 to 300 μm, provided on the film 1, some of which protrude into the device hole 2 and serve as free ends. It has become. 4 is a sprocket hole for conveying the film 1. FIG. 4 is a schematic diagram showing an example of a device for attaching the semiconductor element 6 to the film 1 as described above. be done. On the other hand, the film 1 guided by the tape rail 8 and sent in the direction perpendicular to the plane of the paper by the sprocket stops at the position where the device hole 2 reaches the top of the semiconductor element 6, and the film 1 stops at the position where the device hole 2 reaches the top of the semiconductor element 6. Align each lead 3 with each other. Next, the heated bonding tool 10 is lowered to apply pressure to each lead 3 and form it at a predetermined angle to bond and connect each lead 3 and the electrode 9. Next, the film 1 is moved and the leads 3 are cut as shown in FIG. 5, or the semiconductor element 6 and a part of the leads 3 are sealed with liquid soil-retaining resin by squeegee printing, botting, etc. to harden the resin sealing part 11.
After forming the lead 3, the semiconductor package D is cut.
Manufacture.

The semiconductor packages D manufactured as described above are mounted with the active surfaces 13 of a plurality of semiconductor packages D facing toward the printed wiring board 14, for example, as shown in FIGS. 5 and 6, and the leads 3 are mounted. After each connection is made to the wiring pattern 15 formed on the surface of the printed wiring board 14, the periphery of the semiconductor element 6 and the leads 3 are sealed with resin or the like by squeegee printing, botting, etc. to form a resin sealing area 16. Semiconductor devices were mounted.

[Problems and Objects to be Solved by the Invention] The above-mentioned mounting structure has the advantage of being able to mount a large number of semiconductor elements on a single substrate at high density, and has recently been widely implemented.

However, after sealing a semiconductor element by botting or printing, it is necessary to conduct a current test and a thermal shock resistance test to test the quality of the semiconductor device, but if even one of the many semiconductor elements is defective. Then, the entire board, including other non-defective products, had to be disposed of, which was extremely uneconomical.

The present invention was made to solve the above problems, and there is no risk of defective products occurring after mounting on a board. Even if a defective product occurs, the function of the board can be maintained by simply replacing a small number of semiconductor elements. The objective is to obtain a mounting structure for a semiconductor device that can be returned to normal operation.

[Means for Solving the Problems] A mounting structure for a semiconductor device according to the present invention includes a semiconductor element disposed on a film carrier, and leads of the film carrier each connected to a large number of electrodes provided on the semiconductor element. A semiconductor package obtained by cutting the leads or sealing a part of the semiconductor element and the leads with resin or the like and then cutting the leads, and an intermediate substrate having a conductive pattern on a heat-resistant film at approximately equal intervals. A printed wiring board comprising a plurality of intermediate substrates on which semiconductor packages are disposed and connecting leads of the semiconductor packages and conductive patterns of the intermediate substrate, respectively, and a printed wiring board on which a wiring pattern is formed. The plurality of intermediate boards are mounted thereon, and the conductive patterns of the intermediate boards are connected directly or via terminals to the wiring patterns of the previous printed wiring board.

[Operation] The semiconductor package, which is partially bonded onto a heat-resistant film substrate and then sealed with a liquid sealing material, is subjected to a functional test in the second step, and defective semiconductor packages are found and removed. However, at the stage of separating the semiconductor packages from the heat-resistant film substrate into individual semiconductor packages by means such as cutting, even if functional defects such as broken leads or chips occur, it is difficult to eliminate them as defects. Therefore, after a plurality of semiconductor packages are mounted on an intermediate substrate, defective products may occur. However, even if a defect is discovered after being mounted on the intermediate board, the defective semiconductor package can be excluded at this stage, so there is a high probability that a defective product will occur after the intermediate board is mounted on the printed wiring board. decreases further. If a defect occurs after the semiconductor package is mounted on a printed wiring board, only the intermediate board on which the semiconductor package is mounted needs to be replaced.

[Example] FIG. 1 is a perspective view of an embodiment of the present invention.

In the figure, reference numerals 17, 17a, 17b, and 17c are intermediate substrates having a conductive pattern 15 on a heat-resistant film, and a plurality of semiconductor packages D are mounted on the intermediate substrate 17 at approximately equal intervals of 9 to form a semiconductor package. The leads 3 of D and the conductive pattern 18 are electrically connected to each other. 14 is a printed wiring board having a wiring pattern 15 on its surface;
The conductive pattern 18 of each intermediate board 17 and the wiring pattern 15 of the printed wiring board 14 are electrically connected to each other. FIG. 2(a) is a plan view of an embodiment in which the semiconductor package D is mounted on the intermediate substrate 17, and FIG. 2(b) is a schematic cross-sectional view thereof. The intermediate substrate 17 has a plurality of semiconductor package placement locations 19. arranged at equal intervals in the length direction.
19a, 19b, and 19C are provided. Semiconductor package placement location 19.19&, 19b,
For each 19c, the tip of a conductive pattern 18 made of a material with high conductivity and provided on the intermediate substrate 17 is arranged to face the lead 3 of the semiconductor package D. Each conductive pattern 18 and the semiconductor package D glue 3 are electrically connected. Next, the present embodiment configured as described above will be explained. First, the tips of the conductive patterns 18 provided at the respective semiconductor package placement locations 19, 19a, 19b, and 19c on the intermediate substrate 7 are aligned with the leads 3 of the semiconductor package D, which has been previously subjected to a functional test such as an energization test. , electrical connection is performed by soldering, conductive adhesive, anisotropic conductive resin, etc. In this state, the function test is performed again, and if the semiconductor package D is determined to be defective in the function test on the intermediate board 17, only that semiconductor package D needs to be replaced. Lead 3 of this latter semiconductor package D
Then, the joint portion of the conductive pattern 18 is sealed with a sealing resin such as epoxy resin to protect the joint portion. Intermediate board 1 that passed the functional test on intermediate board 17 and was sealed with resin
7 is mounted on the printed wiring board 14, and the terminals of the conductive pattern 18 on the intermediate board 17 and the wiring pattern 15 provided on the printed wiring board 14 are respectively connected. After that, if a conduction test is performed between each terminal of the intermediate board 17 and the wiring pattern 15 of the printed wiring board 14, the printed wiring board 15
The mounting of a large number of semiconductor packages D on the is completed.

If a defective product occurs among a large number of semiconductor packages D, only the intermediate substrate 17 on which the semiconductor package D is mounted needs to be replaced.

[Effects of the Invention] As described above, according to the present invention, a relatively small number of semiconductor packages are mounted on an intermediate substrate, various tests are conducted, and only those intermediate substrates that have passed the tests are mounted on a plurality of substrates. As a result, there are almost no defective products after being mounted on a board. Furthermore, if a defective product occurs, only the intermediate board on which the semiconductor package is mounted needs to be replaced.

Therefore, it not only significantly improves reliability, but also
It is extremely advantageous economically and can reduce manufacturing costs.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing one embodiment of the present invention. Figure 2 (a
) is a plan view of one embodiment of the present invention in which a semiconductor package is mounted on an intermediate substrate. FIG. 2(b) is a sectional view schematically showing an embodiment of the present invention in which a semiconductor package is mounted on an intermediate substrate of the present invention. FIG. 7 is an explanatory diagram showing a mounting example of a third semiconductor device. 1: Film, 2 device holes, 3: Lead, 4
: Sprocket hole, 5: Semiconductor element mounting stand, 6: Semiconductor element, 7: Positioning guide, 8: Tape rail, 9
: Electrode, 10: Bonding tool, 11: Resin sealing part, 13: Active surface, 14 Niblint wiring board, 15:
Wiring pattern, 16: Resin sealing range, 17: Intermediate board,
18: Conductive pattern, 19: Package placement location, D=
semiconductor package. that's all

Claims (1)

[Claims] A semiconductor element is disposed on a film carrier, a number of electrodes provided on the semiconductor element are connected to leads of the film carrier, and the leads are cut, or a part of the semiconductor element and the leads are sealed with resin or the like. After stopping, a semiconductor package obtained by cutting the leads is arranged at approximately equal intervals on an intermediate substrate having a conductive pattern on a heat-resistant film, and the leads of the semiconductor package and the conductive pattern of the intermediate substrate are connected. It consists of a plurality of intermediate boards connected to each other and a printed wiring board on which a wiring pattern is formed, and the plurality of intermediate boards are mounted on the printed wiring board, and the conductive pattern of the intermediate board is connected directly or with a terminal. A mounting structure for a semiconductor device, which is connected to a wiring pattern of the printed wiring board through a semiconductor device.