JPH03101207A - Metallized plastic film capacitor and manufacture thereof - Google Patents
Metallized plastic film capacitor and manufacture thereofInfo
- Publication number
- JPH03101207A JPH03101207A JP23852289A JP23852289A JPH03101207A JP H03101207 A JPH03101207 A JP H03101207A JP 23852289 A JP23852289 A JP 23852289A JP 23852289 A JP23852289 A JP 23852289A JP H03101207 A JPH03101207 A JP H03101207A
- Authority
- JP
- Japan
- Prior art keywords
- wax
- plastic film
- metallized
- capacitor element
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 52
- 239000002985 plastic film Substances 0.000 title claims abstract description 24
- 229920006255 plastic film Polymers 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000003822 epoxy resin Substances 0.000 claims abstract description 13
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 13
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 8
- 230000008018 melting Effects 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 claims abstract description 6
- 239000011247 coating layer Substances 0.000 claims description 27
- 239000010410 layer Substances 0.000 claims description 12
- 229910010272 inorganic material Inorganic materials 0.000 claims description 10
- 239000011147 inorganic material Substances 0.000 claims description 10
- 238000000605 extraction Methods 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 238000005304 joining Methods 0.000 claims description 2
- 238000000576 coating method Methods 0.000 abstract description 12
- 238000009413 insulation Methods 0.000 abstract description 12
- 239000011248 coating agent Substances 0.000 abstract description 11
- 239000004721 Polyphenylene oxide Substances 0.000 abstract description 5
- 229920006380 polyphenylene oxide Polymers 0.000 abstract description 5
- 239000000843 powder Substances 0.000 abstract description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 abstract description 3
- 230000015556 catabolic process Effects 0.000 abstract description 2
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 239000001993 wax Substances 0.000 description 28
- 239000010408 film Substances 0.000 description 12
- 239000011368 organic material Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011104 metalized film Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012164 animal wax Substances 0.000 description 1
- 229910052454 barium strontium titanate Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000012184 mineral wax Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000012169 petroleum derived wax Substances 0.000 description 1
- 235000019381 petroleum wax Nutrition 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子機器、情報機器等の電子回路に使用する
金属化プラスチックフィルムコンデンサおよびその製造
法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a metallized plastic film capacitor used in electronic circuits such as electronic equipment and information equipment, and a method for manufacturing the same.
従来の技術
近年、電子機器等の軽薄短小化、高性能が進む中で電子
部品の小型化、高性能化への要望が高まってきており、
金属化プラスチックフィルムコンデンサにおいてもこれ
らへの取り組みが急務となりつつある。この流れの中で
小型化を図るために無機材料を分散させた誘電体材料の
開発がなされてきた。Conventional technology In recent years, as electronic devices have become lighter, thinner, shorter, and more sophisticated, there has been an increasing demand for electronic components to be smaller and have higher performance.
Efforts to address these issues are becoming an urgent priority for metallized plastic film capacitors as well. In this trend, dielectric materials in which inorganic materials are dispersed have been developed in order to achieve miniaturization.
以下に従来の金属化プラスチックフィルムコンデンサに
ついて説明する。A conventional metallized plastic film capacitor will be explained below.
第3図は従来の金属化プラスチワクフィルムコンデンサ
の外装構成を示す図である。1は外装を安定に行うため
の下塗り用エポキシ樹脂層、2は外装用エポキシ樹脂層
であり、積層コンデンサ素子3全体をおおっている。こ
の積層コンデンサ素子3は誘電体フィルムであるポリエ
チレンテレフタレート(以下PETと記す。)の両面に
真空蒸着によって形成されたアルミニウム(以下五eと
記す。)!極を有し、これらの電極上に誘電体塗工層(
誘電体塗工層の少なくとも片側が有機物に無機材料を分
散させた高誘電率誘電体塗工層)を設けてこれらを積層
したものであり、相対向する切断面に外部引き出し用電
極(メタリコン)を設けると共にその外部引き出し用電
極にリード線を接合したものである。FIG. 3 is a diagram showing the exterior structure of a conventional metallized plastic film capacitor. Reference numeral 1 denotes an epoxy resin layer for undercoating to provide a stable exterior coating, and 2 an epoxy resin layer for exterior coating, which covers the entire multilayer capacitor element 3. This multilayer capacitor element 3 is made of aluminum (hereinafter referred to as 5e) formed by vacuum deposition on both sides of polyethylene terephthalate (hereinafter referred to as PET), which is a dielectric film. It has a dielectric coating layer (
At least one side of the dielectric coating layer is provided with a high dielectric constant dielectric coating layer in which an inorganic material is dispersed in an organic material. A lead wire is connected to the electrode for external extraction.
ここで、金属化プラスチックフィルムコンデンサの特徴
の一つである自己回復機能について述べると、コンデン
サの電極に蒸着金属膜を用いていることから、誘電体塗
工層又はフィルムに絶縁欠陥が存在し破壊が発生した時
、その欠陥部で放電が起とり、その時のエネルギーによ
シ久陥部近傍の蒸着金属が飛散消滅し、絶縁が回復する
ことであり、これにより耐電圧が回復保持される機能で
ある。Here, we will talk about the self-healing function, which is one of the characteristics of metallized plastic film capacitors. Since a vapor-deposited metal film is used for the electrodes of the capacitor, there may be insulation defects in the dielectric coating layer or film, causing breakdown. When this occurs, an electric discharge occurs at the defective part, and the energy at that time scatters and annihilates the deposited metal near the defective part, restoring the insulation.This function restores and maintains the withstand voltage. It is.
発明が解決しようとする課題
しかしながら、上記の従来の構成では、有機物中へ無機
材料を均一に分散させることは難しく、そのために塗工
層に膜厚の薄い箇所が発生し絶縁欠陥部が多発する。そ
のうえ、外装を安定に行うために下塗り材として、コン
デンサ素子と密着性。Problems to be Solved by the Invention However, with the above-mentioned conventional configuration, it is difficult to uniformly disperse the inorganic material into the organic material, and as a result, thin areas occur in the coating layer and insulation defects occur frequently. . In addition, it is used as an undercoat material to ensure a stable exterior finish and has good adhesion to the capacitor element.
気密性の高いエポキシ樹脂を用いているため、絶縁欠陥
部が破壊した時、完全な自己回復機能が働くための十分
な酸素が供給されず、自己回復機能が働きにくくなり、
高温負荷試験時に絶融抵抗値が低下するという欠点を有
していた。Due to the use of highly airtight epoxy resin, when an insulation defect breaks down, sufficient oxygen is not supplied for the complete self-healing function to work, making it difficult for the self-healing function to work.
It had the disadvantage that the melting resistance value decreased during high-temperature load tests.
本発明は上記従来の課題を解決するもので、有機物に無
機材料を分散した高誘電率誘電体塗工層を形成すること
により小型化を図ると共に、金属化プラスチックフィル
ムコンデンサの最大の特徴である自己回復機能を大幅に
向上させることにより高温負荷試験時の絶縁抵抗値の低
下を改善することを目的とするものである。The present invention solves the above-mentioned conventional problems, and achieves miniaturization by forming a high dielectric constant dielectric coating layer in which an inorganic material is dispersed in an organic material. The purpose is to improve the decrease in insulation resistance during high-temperature load tests by significantly improving the self-recovery function.
課題を解決するための手段
この目的を達成するため、本発明の金属化プラスチック
フィルムコンデンサは、両面が金属化されたプラスチッ
クフィルムの両面に形成された誘電体塗工層の少なくと
も片側が有機物に無機材料を分散させた高誘電率誘電体
塗工層である積層コンデンサ素子と、この積層コンデン
サ素子の外部引き出し用電極が設けられる相対向する切
断面とは異なる切断面に塗布されたワックス層と、上記
ワックス層を含み上記積層コンデンサ素子全体をおおう
ように設けた熱硬化性エポキシ樹脂よりなる外装部を備
えたことを特徴とするものである。Means for Solving the Problems To achieve this object, the metallized plastic film capacitor of the present invention is characterized in that at least one side of the dielectric coating layer formed on both sides of the plastic film, which is metallized on both sides, is organic and inorganic. A multilayer capacitor element which is a high permittivity dielectric coating layer in which a material is dispersed, a wax layer applied to a cut surface different from the opposing cut surface on which the external extraction electrode of the multilayer capacitor element is provided; The present invention is characterized in that it includes an exterior part made of a thermosetting epoxy resin that includes the wax layer and covers the entire multilayer capacitor element.
また1本発明の金属化フィルムコンデンサの製造法は、
両面が金属化されたプラスチックフィルムの両面に形成
された誘電体塗工層の少なくとも片側が有機物に無機材
料を分散させた高誘電率誘電体塗工層である積重コンデ
ンサ素子の相対向する所定の切断面に外部引き出し電極
を形成し、その外部引き出し電極にリード線を接合する
工程と、この工程以後に上記所定の切断面とは異なる相
対向する切断面にワックスを塗布する工程と、この工程
以後に上記積層コンデンサ素子全体に熱硬化性エポキシ
樹脂よりなる外装部を形成する工程とを備えることを特
徴とするものである。Furthermore, the method for manufacturing the metallized film capacitor of the present invention is as follows:
At least one side of the dielectric coating layer formed on both sides of a plastic film metallized on both sides is a high dielectric constant dielectric coating layer in which an inorganic material is dispersed in an organic substance. A step of forming an external extraction electrode on the cut surface of the electrode and joining a lead wire to the external extraction electrode, and a step of applying wax to the opposite cut surface different from the predetermined cut surface after this step, The present invention is characterized by comprising a step of forming an exterior portion made of a thermosetting epoxy resin over the entire multilayer capacitor element after the step.
ここで、高誘電率誘電体塗工層は、たとえば有機物がポ
リフェニレンオキサイド、無機材料が酸化チタン、チタ
ン酸バリウム、チタン酸ストロンチウム、チタン酸鉛の
単体または二種以上の混合物よシ選択されるものである
。Here, the high dielectric constant dielectric coating layer is selected from polyphenylene oxide as the organic material and titanium oxide, barium titanate, strontium titanate, and lead titanate as the inorganic material or a mixture of two or more thereof. It is.
また、ワックスは、融点80℃以上150’C以下であ
り、フィルムとの接着力が弱く気密性の低いワックスが
使用され、たとえば合成炭化水素ワーノクス、変形ワッ
クス、水素化ワックスなどの合成ワックス、植物系ワッ
クス、動物系ワックス。In addition, the wax used is a wax with a melting point of 80°C or more and 150'C or less, which has weak adhesion to the film and low airtightness.For example, synthetic waxes such as synthetic hydrocarbon Warnox, modified wax, and hydrogenated wax, and wax, animal wax.
鉱物系ワックス1石油系ワヮクスなどの天然ワックスよ
り選択されるものである。融点が90’C未満のワック
スを使用すると、外装時にワ、ソクスが流れ出しやすく
均質な層ができないし作業性が劣る。Mineral Wax 1 This is selected from natural waxes such as petroleum waxes. If a wax with a melting point of less than 90'C is used, wax and wax tend to flow out during packaging, making it impossible to form a homogeneous layer and resulting in poor workability.
一方融点が150℃より高いワックスを使用するとコン
デンサ素子に与える熱ダメージが太きくいずれも本目的
を満たすことができない。On the other hand, if a wax with a melting point higher than 150° C. is used, the capacitor element will be seriously damaged by heat, and the purpose cannot be met.
作用
本発明の金属化プラスチックフィルムコンデンサは、積
層コンデンサ素子の少なくとも切断面にフィルムとの接
着力が弱く気密性の低いワックスを塗布することにより
、絶縁欠陥部で破壊した時、完全な自己回復機能が働く
ために十分な酸素が供給でき、また自己回復機能が働い
た時に発生する熱やガスの放散が容易になり、自己回復
機能が効率的に行われる。もって、高温負荷試験時の絶
縁抵抗値の低下を改善できる。Function: The metallized plastic film capacitor of the present invention has a complete self-healing function when it breaks at an insulation defect by coating at least the cut surface of the multilayer capacitor element with a wax that has weak adhesion to the film and low airtightness. Sufficient oxygen can be supplied for the self-healing function to work, and the heat and gas generated when the self-healing function works can be easily dissipated, so the self-healing function can be performed efficiently. As a result, it is possible to improve the reduction in insulation resistance value during high-temperature load tests.
また、本発明の金属化プラスチックフィルムコンデンサ
の製造法は、両面が金属化されたプラスチックフィルム
の両面に形成された誘電体塗工層の少なくとも片側が有
機物に無機材料を分散させた高誘電率誘電体塗工層であ
る積層コンデンサ素子の切断面にワックスを塗布する工
程が、上記積層コンデンサの相対向する切断面に設けた
外部引き出し電極にリード線を接合した以後に実施され
るので、外部引き出し電極へのリード線の接合をワック
スの影響を受けることなく行なうことができ、またワッ
クスの塗布作業も簡単に行なうことができる。Further, in the method for producing a metallized plastic film capacitor of the present invention, at least one side of the dielectric coating layer formed on both sides of a plastic film whose both sides are metallized has a high dielectric constant dielectric layer in which an inorganic material is dispersed in an organic material. The process of applying wax to the cut surfaces of the multilayer capacitor element, which is the body coating layer, is carried out after the lead wires are joined to the external lead electrodes provided on the opposing cut surfaces of the multilayer capacitor. Lead wires can be joined to electrodes without being affected by wax, and wax can be applied easily.
実施例 以下本発明を実施例及び比較例により説明する。Example The present invention will be explained below with reference to Examples and Comparative Examples.
実施例1
ポリフェニレンオキサイド(以下PPOと記す)の粉末
40gヲトリクレン400gに均一に溶解した後、平均
粒径0.21μlの酸化チタン(以下?i0□と記す)
を添加し、撹拌混合した後に更にボールミルにて40
Hr処理し、塗工液を得た。Example 1 After uniformly dissolving 40 g of powder of polyphenylene oxide (hereinafter referred to as PPO) in 400 g of Wotriclean, titanium oxide (hereinafter referred to as ?i0□) with an average particle size of 0.21 μl was dissolved.
was added, stirred and mixed, and further milled in a ball mill for 40 minutes.
It was subjected to Hr treatment to obtain a coating liquid.
この塗工液を両面金属化プラスチックフィルムの両面に
塗工し膜厚0.7μmの塗工層全得た。This coating solution was applied to both sides of a double-sided metallized plastic film to obtain an entire coating layer with a thickness of 0.7 μm.
この誘電体フィルムを偏平に巻回し積層した後、細い棒
状に切断し、その切断面にメタリコンにより外部引き出
し電極を形成すると共にリード線を接合し、更にチップ
状に切断して容量20μFのコンデンサ素子を作成した
。このコンデンサ素子を加熱し溶解したワンクス液内に
浸してコンデンサ素子の少なくとも切断面にワックスを
塗布し、過剰のワックスをとるためにコンデンサ素子を
加熱し遠心分離機にかけ0.1〜0.6μmの厚さにワ
ックス層を形成した。その後、熱硬化性エポキシ樹脂で
外装した。ここで、ワックスとしてはポリエチレンワッ
クスを使用シタ。After winding and laminating this dielectric film flatly, it is cut into thin rods, external lead electrodes are formed on the cut surfaces using metallized silicone, and lead wires are connected, and further cut into chips to form a capacitor element with a capacitance of 20 μF. It was created. This capacitor element is heated and immersed in melted Wank's liquid to coat at least the cut surface of the capacitor element with wax.To remove excess wax, the capacitor element is heated and placed in a centrifuge to reduce the wax to 0.1 to 0.6 μm. A thick wax layer was formed. It was then covered with thermosetting epoxy resin. Here, polyethylene wax is used as the wax.
第1図に本実施例の金属化フィルムコンデンサの断面図
を示す。第1図、第2図において、21ン↓フ″ラスナ
ツクフイルム、22はムe電極、23は誘電体塗工層、
24は外部引き出し電極、26はリード線、2eはワッ
クス層、2了は外装部である。FIG. 1 shows a cross-sectional view of the metallized film capacitor of this example. In FIGS. 1 and 2, 21 is a frame film, 22 is a mu e electrode, 23 is a dielectric coating layer,
24 is an external extraction electrode, 26 is a lead wire, 2e is a wax layer, and 2 is an exterior part.
実施例2
ppoの粉末401をトリクレン400gに均一に溶解
した後、平均粒径0.21 fi mのTlO2を添加
し、撹拌混合した後に更にボールミルにて4゜Hr処理
し、第1の塗工液を得た。この第1の塗工液をグラビア
コータを用いて1両面金属化プラスチックフィルムの片
側に塗工し、膜厚0.7μmの塗工層を得た。一方、p
poの粉末409をトリクレン40oyに均一に溶解し
た第2の塗工液を得、この第2の塗工液をグラビアコー
タを用いて両面金属化プラスチックフィルムのもつ片側
に塗工し、膜厚0.7μmの塗工層を得た。この誘電体
フィルムを偏平に巻回し積層した後、細い棒状に切断し
、その切断面にメタリコンにより外部引き出し電極を形
成すると共にリード線を接合し、更にチップ状に切断し
て容量20μFのコンデンサ素子を作成し、実施例1と
同様にワックス塗布後に外装を行った。Example 2 After uniformly dissolving PPO powder 401 in 400 g of trichlene, TlO2 with an average particle size of 0.21 fi m was added, stirred and mixed, and further treated with a ball mill for 4 ° Hr to form the first coating. I got the liquid. This first coating liquid was applied to one side of a single-sided metallized plastic film using a gravure coater to obtain a coating layer with a thickness of 0.7 μm. On the other hand, p
A second coating solution was obtained by uniformly dissolving Po powder 409 in 40 oy of Triclean, and this second coating solution was applied to one side of a double-sided metallized plastic film using a gravure coater to obtain a film thickness of 0. A coating layer of .7 μm was obtained. After winding and laminating this dielectric film flatly, it is cut into thin rods, external lead electrodes are formed on the cut surfaces using metallized silicone, and lead wires are connected, and further cut into chips to form a capacitor element with a capacitance of 20 μF. was prepared, and the exterior was applied after wax application in the same manner as in Example 1.
実施例のコンデンサの性能について従来例のコンデンサ
と比較し、第2図を用いて説明する。なお、従来例1は
両面ともに高誘電率誘電体塗工層をもつコンデンサ、従
来例2は片面が有機誘電体塗工層で、もう片面が高誘電
率誘電体塗工層のコンデンサである。外装は、下塗り用
エポキシ樹脂で、この上に外装用エポキシ樹脂を用いて
外装したものである。The performance of the capacitor of this example will be compared with that of a conventional capacitor and will be explained using FIG. Conventional Example 1 is a capacitor having a high dielectric constant dielectric coating layer on both sides, and Conventional Example 2 is a capacitor having an organic dielectric coating layer on one side and a high dielectric constant dielectric coating layer on the other side. The exterior is an epoxy resin for undercoating, and an epoxy resin for exterior coating is applied on top of this.
第2図は、実施例と従来例のコンデンサに温度86°C
の雰囲気中で電流esVを印加し、所定時間経過後室温
中に取り出して、1時間放置した後に測定した絶縁抵抗
値をグラフにて示したものである。Figure 2 shows the capacitors of the embodiment and conventional example at a temperature of 86°C.
The graph shows the insulation resistance value measured after applying a current esV in the atmosphere, taking out the sample at room temperature after a predetermined period of time, and leaving it for 1 hour.
実施例は、高温負荷試験時の絶縁抵抗値の低下がみられ
ず従来例の欠点を克服している。The example overcomes the drawbacks of the conventional example since no decrease in insulation resistance value was observed during the high-temperature load test.
発明の効果
以上のように本発明は、両面金属化プラスチックフィル
ムの両面に形成された塗工層の少なくとも片側が有機物
に無機材料を分散させた高誘電率誘電体塗工層である積
層コンデンサ素子の切断面にワックス層を有するので、
熱硬化エポキシ樹脂により外装されることにる高温負荷
試験時に絶縁抵抗値の低下しない高性能の金属化プラス
チックフィルムコンデンサを実現できるものである。Effects of the Invention As described above, the present invention provides a multilayer capacitor element in which at least one side of the coating layers formed on both sides of a double-sided metallized plastic film is a high dielectric constant dielectric coating layer in which an inorganic material is dispersed in an organic substance. Since it has a wax layer on the cut surface,
It is possible to realize a high-performance metallized plastic film capacitor whose insulation resistance value does not decrease during high-temperature load tests by being packaged with thermosetting epoxy resin.
第1図は本発明の金属化グラスチックフィルムコンデン
サの一実施例を示す断面図、第2図は同コンデンサと従
来のコンデンサの絶縁抵抗値の比較特性図、第3図は従
来の金属化プラスチックフィルムコンデンサの断面図で
ある。
21・・・・・・フラスチックフィルム、22・・出・
Ae電極、23・・・・・誘電体塗工層、24・・・・
・・外部引き出し用電極(メタリコン)、26・・・・
・・リート線、26・・・・・・ワックス層、27・由
・・外装部。Fig. 1 is a cross-sectional view showing one embodiment of the metallized glass film capacitor of the present invention, Fig. 2 is a comparative characteristic diagram of insulation resistance values of the same capacitor and a conventional capacitor, and Fig. 3 is a conventional metallized plastic film capacitor. FIG. 2 is a cross-sectional view of a film capacitor. 21...Flastic film, 22...Out...
Ae electrode, 23...dielectric coating layer, 24...
・・External lead-out electrode (Metallicon), 26・・・・
...Leet wire, 26...wax layer, 27...exterior part.
Claims (3)
面に形成された誘電体塗工層の少なくとも片側が有機物
に無機材料を分散させた高誘電率誘電体塗工層である積
層コンデンサ素子と、この積層コンデンサ素子の外部引
き出し用電極が設けられる相対向する切断面とは異なる
切断面に塗布されたワックス層と、上記ワックス層を含
み上記積層コンデンサ素子全体をおおうように設けた熱
硬化性エポキシ樹脂よりなる外装部を備えたことを特徴
とする金属化プラスチックフィルムコンデンサ。(1) A multilayer capacitor element, in which at least one side of a dielectric coating layer formed on both sides of a plastic film metallized on both sides is a high dielectric constant dielectric coating layer in which an inorganic material is dispersed in an organic substance; A wax layer coated on a cut surface different from the opposing cut surface on which the external extraction electrode of the multilayer capacitor element is provided, and a thermosetting epoxy resin provided so as to cover the entire multilayer capacitor element including the wax layer. A metallized plastic film capacitor characterized by having an exterior portion made of
ックスであることを特徴とする特許請求の範囲第1項記
載の金属化プラスチックフィルムコンデンサ。(2) The metallized plastic film capacitor according to claim 1, wherein the wax is a wax having a melting point of 80° C. or higher and 150° C. or lower.
面に形成された誘電体塗工層の少なくとも片側が有機物
に無機材料を分散させた高誘電率誘電体塗工層である積
層コンデンサ素子の相対向する所定の切断面に外部引き
出し電極を形成し、その外部引き出し電極にリード線を
接合する工程と、この工程以後に上記所定の切断面とは
異なる相対向する切断面にワックスを塗布する工程と、
この工程以後に上記積層コンデンサ素子全体に熱硬化性
エポキシ樹脂よりなる外装部を形成する工程とを備える
ことを特徴とする金属化プラスチックフィルムコンデン
サの製造法。(3) Opposite orientation of a multilayer capacitor element in which at least one side of the dielectric coating layers formed on both sides of a plastic film whose both sides are metallized is a high dielectric constant dielectric coating layer in which an inorganic material is dispersed in an organic substance. a step of forming an external extraction electrode on a predetermined cut surface and joining a lead wire to the external extraction electrode, and a step of applying wax to an opposite cut surface different from the predetermined cut surface after this step. ,
A method for manufacturing a metallized plastic film capacitor, which comprises the step of forming an exterior portion made of a thermosetting epoxy resin over the entire multilayer capacitor element after this step.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23852289A JPH03101207A (en) | 1989-09-14 | 1989-09-14 | Metallized plastic film capacitor and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23852289A JPH03101207A (en) | 1989-09-14 | 1989-09-14 | Metallized plastic film capacitor and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03101207A true JPH03101207A (en) | 1991-04-26 |
Family
ID=17031506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23852289A Pending JPH03101207A (en) | 1989-09-14 | 1989-09-14 | Metallized plastic film capacitor and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03101207A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002058508A (en) * | 2000-08-09 | 2002-02-26 | Joseph Anscher | Pressure release buckle with improved latch function |
JP2008267211A (en) * | 2007-04-18 | 2008-11-06 | Daikin Ind Ltd | Fluid machine and heat pump device |
-
1989
- 1989-09-14 JP JP23852289A patent/JPH03101207A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002058508A (en) * | 2000-08-09 | 2002-02-26 | Joseph Anscher | Pressure release buckle with improved latch function |
JP2008267211A (en) * | 2007-04-18 | 2008-11-06 | Daikin Ind Ltd | Fluid machine and heat pump device |
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