JPH0298645U - - Google Patents

Info

Publication number
JPH0298645U
JPH0298645U JP1989006581U JP658189U JPH0298645U JP H0298645 U JPH0298645 U JP H0298645U JP 1989006581 U JP1989006581 U JP 1989006581U JP 658189 U JP658189 U JP 658189U JP H0298645 U JPH0298645 U JP H0298645U
Authority
JP
Japan
Prior art keywords
semiconductor device
increasing
utility
surface area
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989006581U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989006581U priority Critical patent/JPH0298645U/ja
Publication of JPH0298645U publication Critical patent/JPH0298645U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • H01L2924/1815Shape

Description

【図面の簡単な説明】
第1図a,bは本考案の半導体装置の実施例を
示す側面図及び上面図、第2図は本考案の他の実
施例を示す斜視図、第3図は本考案のその他の実
施例を示す斜視図、第4図a,bは従来例を示す
側面図及び上面図である。 1……パツケージ、2……ピン、3,5……突
起部、4……傾斜部。

Claims (1)

    【実用新案登録請求の範囲】
  1. モールドパツケージの少なくとも一部分に表面
    積を増加させるための凹凸状部を設けたことを特
    徴とする半導体装置。
JP1989006581U 1989-01-24 1989-01-24 Pending JPH0298645U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989006581U JPH0298645U (ja) 1989-01-24 1989-01-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989006581U JPH0298645U (ja) 1989-01-24 1989-01-24

Publications (1)

Publication Number Publication Date
JPH0298645U true JPH0298645U (ja) 1990-08-06

Family

ID=31210885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989006581U Pending JPH0298645U (ja) 1989-01-24 1989-01-24

Country Status (1)

Country Link
JP (1) JPH0298645U (ja)

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