JPH0296737U - - Google Patents
Info
- Publication number
- JPH0296737U JPH0296737U JP613789U JP613789U JPH0296737U JP H0296737 U JPH0296737 U JP H0296737U JP 613789 U JP613789 U JP 613789U JP 613789 U JP613789 U JP 613789U JP H0296737 U JPH0296737 U JP H0296737U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- flat part
- storage case
- chip storage
- semiconductor chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000005192 partition Methods 0.000 claims description 2
Landscapes
- Element Separation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP613789U JPH0296737U (hu) | 1989-01-23 | 1989-01-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP613789U JPH0296737U (hu) | 1989-01-23 | 1989-01-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0296737U true JPH0296737U (hu) | 1990-08-01 |
Family
ID=31210116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP613789U Pending JPH0296737U (hu) | 1989-01-23 | 1989-01-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0296737U (hu) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100359718B1 (ko) * | 1997-11-07 | 2003-01-15 | 오리엔트 세미컨덕터 일렉트로닉스 리미티드 | 반도체 칩 지지장치 |
JP2006066417A (ja) * | 2004-08-24 | 2006-03-09 | Ulvac Japan Ltd | 静電チャックおよび基板搬送用トレー |
KR101405124B1 (ko) * | 2013-01-07 | 2014-06-11 | 주식회사 고려반도체시스템 | 서로 다른 위치 공차를 갖는 트래이 간의 칩 이송 장치 및 방법 |
WO2022185647A1 (ja) * | 2021-03-01 | 2022-09-09 | 東レエンジニアリング株式会社 | チップトレイ、チップ保持装置、および外観検査装置 |
-
1989
- 1989-01-23 JP JP613789U patent/JPH0296737U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100359718B1 (ko) * | 1997-11-07 | 2003-01-15 | 오리엔트 세미컨덕터 일렉트로닉스 리미티드 | 반도체 칩 지지장치 |
JP2006066417A (ja) * | 2004-08-24 | 2006-03-09 | Ulvac Japan Ltd | 静電チャックおよび基板搬送用トレー |
KR101405124B1 (ko) * | 2013-01-07 | 2014-06-11 | 주식회사 고려반도체시스템 | 서로 다른 위치 공차를 갖는 트래이 간의 칩 이송 장치 및 방법 |
WO2022185647A1 (ja) * | 2021-03-01 | 2022-09-09 | 東レエンジニアリング株式会社 | チップトレイ、チップ保持装置、および外観検査装置 |
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