JPH029461U - - Google Patents
Info
- Publication number
- JPH029461U JPH029461U JP8875488U JP8875488U JPH029461U JP H029461 U JPH029461 U JP H029461U JP 8875488 U JP8875488 U JP 8875488U JP 8875488 U JP8875488 U JP 8875488U JP H029461 U JPH029461 U JP H029461U
- Authority
- JP
- Japan
- Prior art keywords
- bonding surface
- semiconductor laser
- substrate
- heat sink
- laser device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8875488U JPH029461U (US06272168-20010807-M00014.png) | 1988-07-04 | 1988-07-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8875488U JPH029461U (US06272168-20010807-M00014.png) | 1988-07-04 | 1988-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029461U true JPH029461U (US06272168-20010807-M00014.png) | 1990-01-22 |
Family
ID=31313314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8875488U Pending JPH029461U (US06272168-20010807-M00014.png) | 1988-07-04 | 1988-07-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029461U (US06272168-20010807-M00014.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04124719U (ja) * | 1991-04-30 | 1992-11-13 | 東京特殊電線株式会社 | 細心同軸ケーブル |
| WO2005048421A1 (ja) * | 2003-11-14 | 2005-05-26 | Sanyo Electric Co., Ltd | 半導体レーザ装置 |
| JP2007142112A (ja) * | 2005-11-17 | 2007-06-07 | Shinko Electric Ind Co Ltd | 光半導体素子用ステムの製造方法 |
| JP2011146744A (ja) * | 2011-04-14 | 2011-07-28 | Shinko Electric Ind Co Ltd | 光半導体素子用ステム |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5925292A (ja) * | 1982-07-30 | 1984-02-09 | Fujitsu Ltd | 半導体レ−ザ装置 |
-
1988
- 1988-07-04 JP JP8875488U patent/JPH029461U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5925292A (ja) * | 1982-07-30 | 1984-02-09 | Fujitsu Ltd | 半導体レ−ザ装置 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04124719U (ja) * | 1991-04-30 | 1992-11-13 | 東京特殊電線株式会社 | 細心同軸ケーブル |
| WO2005048421A1 (ja) * | 2003-11-14 | 2005-05-26 | Sanyo Electric Co., Ltd | 半導体レーザ装置 |
| JPWO2005048421A1 (ja) * | 2003-11-14 | 2007-05-31 | 三洋電機株式会社 | 半導体レーザ装置 |
| JP4549298B2 (ja) * | 2003-11-14 | 2010-09-22 | 三洋電機株式会社 | 半導体レーザ装置 |
| JP2007142112A (ja) * | 2005-11-17 | 2007-06-07 | Shinko Electric Ind Co Ltd | 光半導体素子用ステムの製造方法 |
| JP2011146744A (ja) * | 2011-04-14 | 2011-07-28 | Shinko Electric Ind Co Ltd | 光半導体素子用ステム |
