JPH0294491A - Copper-clad laminated plate for printed-wiring board - Google Patents
Copper-clad laminated plate for printed-wiring boardInfo
- Publication number
- JPH0294491A JPH0294491A JP24559988A JP24559988A JPH0294491A JP H0294491 A JPH0294491 A JP H0294491A JP 24559988 A JP24559988 A JP 24559988A JP 24559988 A JP24559988 A JP 24559988A JP H0294491 A JPH0294491 A JP H0294491A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- copper foil
- insulating layer
- copper
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000011889 copper foil Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims description 8
- 239000006081 fluorescent whitening agent Substances 0.000 claims description 5
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 claims description 4
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 claims description 4
- CNGYZEMWVAWWOB-VAWYXSNFSA-N 5-[[4-anilino-6-[bis(2-hydroxyethyl)amino]-1,3,5-triazin-2-yl]amino]-2-[(e)-2-[4-[[4-anilino-6-[bis(2-hydroxyethyl)amino]-1,3,5-triazin-2-yl]amino]-2-sulfophenyl]ethenyl]benzenesulfonic acid Chemical compound N=1C(NC=2C=C(C(\C=C\C=3C(=CC(NC=4N=C(N=C(NC=5C=CC=CC=5)N=4)N(CCO)CCO)=CC=3)S(O)(=O)=O)=CC=2)S(O)(=O)=O)=NC(N(CCO)CCO)=NC=1NC1=CC=CC=C1 CNGYZEMWVAWWOB-VAWYXSNFSA-N 0.000 claims description 2
- 229960000956 coumarin Drugs 0.000 claims description 2
- 235000001671 coumarin Nutrition 0.000 claims description 2
- 229930192474 thiophene Natural products 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 125000002971 oxazolyl group Chemical group 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 13
- 230000003287 optical effect Effects 0.000 abstract description 11
- 239000004020 conductor Substances 0.000 abstract description 6
- 238000001514 detection method Methods 0.000 abstract description 5
- 238000005282 brightening Methods 0.000 abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000004744 fabric Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- 238000007689 inspection Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、回路欠陥を精度よく迅速に検定することがで
きる印刷配線板用銅張積層板に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a copper-clad laminate for printed wiring boards that allows circuit defects to be accurately and quickly tested.
電子機器に広く使用されている印刷配線板は、絶縁性の
高い基板の片側面又は両側面に金属導体（主にＳｌわを
配し、各種電子部品への電力供給、（３号伝達及びそれ
ら部品の搭載機能を有する。印刷配線板は、先ずフェノ
ール樹脂、エポキシ樹脂、ポリイミド樹脂、ポリエステ
ル樹脂、ポリオレフィン系樹脂等の単独あるいはこれら
樹脂を紙、ガラス繊維紙布、アラミド繊維紙布等の基材
に含浸し半硬化状態に乾燥したプリプレグと銅箔とを重
ね、これをステンレス板の間に挟み加熱加圧して銅張積
層板とする。次いで、この銅箔層を部分的にエツチング
して回路を形成する。この方法とは別に、銅箔を張らな
い単なる積層板面に選択的に銅めっきを析出させて導体
＠路を形成する方法もある。Printed wiring boards, which are widely used in electronic devices, have metal conductors (mainly Sl) on one or both sides of a highly insulating board, and are used to supply power to various electronic components, (No. 3 transmission and It has the function of mounting components.Printed wiring boards are first made of phenol resin, epoxy resin, polyimide resin, polyester resin, polyolefin resin, etc., or these resins are used as a base material such as paper, glass fiber paper cloth, aramid fiber paper cloth, etc. The prepreg, which has been impregnated and dried to a semi-hardened state, is layered with copper foil, which is sandwiched between stainless steel plates and heated and pressed to form a copper-clad laminate.Then, this copper foil layer is partially etched to form a circuit. Apart from this method, there is also a method in which copper plating is selectively deposited on the surface of a simple laminated board without copper foil to form a conductor@path.
何れの方法によっても、形成する回路が、所定の形状と
ならないで、異常を呈する場合がある。No matter which method is used, the formed circuit may not have a predetermined shape and exhibit abnormalities.
これには、回路の断線、短絡、線細り、回路残り、回路
くわれ等の欠陥、又は欠陥につながる可能性のある部分
がある。このような個所は、後工程で欠陥として発見さ
れ、機器に組込んだ後に配線板不良となり、あるいは他
の部品性能の劣化原因となる可能性があり、最終的には
機器の欠陥原因となる。従って、このような印刷配線板
の回路異常は、回路形成後に出来るだけ早く正確に１゛
す別する必要がある。This includes defects such as circuit breaks, short circuits, wire thinning, remaining circuits, and circuit holes, or parts that may lead to defects. Such areas may be discovered as defects in subsequent processes, and may result in defective wiring boards after being incorporated into equipment, or may cause deterioration in the performance of other parts, ultimately resulting in equipment defects. . Therefore, it is necessary to eliminate such circuit abnormalities in printed wiring boards as quickly and accurately as possible after the circuit is formed.
これら欠陥及び欠陥につながる点を発見する手段には、
目視あるいは光学機器を用いて所望の回路形状であるか
否かを区別するが、近年回路密度が細かくなり、生産量
の大巾増にこたえるために光学機器を用いる方が多くな
り、これら機器の判定精度及び速度を向上する手段が強
く要望される現状にある。The means to discover these defects and the points that lead to them include:
Visual inspection or optical equipment is used to distinguish whether the circuit has the desired shape or not, but in recent years, circuit densities have become finer and optical equipment has been increasingly used to meet the large increase in production volume. Currently, there is a strong demand for means for improving determination accuracy and speed.
この判定は、導体部と絶縁層が露出する部分とを判然と
区別することが条件であるが、この’Ｉ’ｌｌ定には透
過光を利用する方法、反射光を利用する方法、有機材料
から発生する蛍光を感知する方法及びこれらを組合わせ
る方法がある。This determination requires a clear distinction between the conductor part and the exposed part of the insulating layer. There are methods of sensing fluorescence emitted from and methods of combining these methods.
この判定の精度と速度を向上するには、機器の能力を改
善するか、判定しやすい印刷配線板用基材とするかの何
れかである。前者の方法は、判定した信号を早く表示し
たり、検出部の視野を広くする、次の検出部に移動する
速度を早くするなどの機械的システムあるいは信号の処
理に関する。In order to improve the accuracy and speed of this determination, it is either necessary to improve the capabilities of the equipment or to create a base material for printed wiring boards that is easier to determine. The former method relates to a mechanical system or signal processing that quickly displays a determined signal, widens the field of view of a detection unit, and increases the speed of movement to the next detection unit.
後者は、印刷配線板自体に何れかの方策を立てることに
ある。The latter method consists in taking some measures on the printed wiring board itself.
本発明は、印刷配線板回路の欠陥判定における精度及び
速度の向上策を印刷配線板自体の工夫によって確立しよ
うとするものである。The present invention attempts to establish a method for improving accuracy and speed in determining defects in printed wiring board circuits by devising the printed wiring board itself.
本発明は、回路を形成加工すべき外層銅箔の外面または
外層銅箔と接する絶縁層面のｆｉＩＴれかに蛍光増白剤
を付着して成る印刷配線板用銅張積層板である。The present invention is a copper-clad laminate for a printed wiring board, in which a fluorescent whitening agent is adhered to the outer surface of an outer copper foil on which a circuit is to be formed or to the fiIT on the insulating layer surface in contact with the outer copper foil.
本発明に用いる蛍光増白剤は、クマリン系、オキナゾリ
ル系、チオフェン系等である。The optical brightener used in the present invention is a coumarin type, an ochinazolyl type, a thiophene type, or the like.
蛍光増白剤を付着するには、絶縁層樹脂に混合熔解する
方法、使用する基材に予め（♂布しておく方法、銅箔に
予め塗布しておき積層する方法、プリプレグ樹脂または
基材の導体と接する面に予め塗布しておく方法がある。To attach a fluorescent brightener, there are two methods: mixing it with the insulating layer resin and melting it, applying it to the base material to be used in advance (♂ cloth), applying it to copper foil in advance and laminating it, prepreg resin or base material. There is a method of pre-coating the surface that will be in contact with the conductor.
蛍光を発するために必要な量は、添加しようとする樹脂
によって大きく異なり、エポキシ樹脂は自ら蛍光を発す
るので経済性と必要；ｉ′に光発光量から決定する。色
相の暗いボリイミ１１脂のように自身では蛍光をほとん
ど発しない場合は、自ら蛍光を発する樹脂より多くの蛍
光増白剤添加が必要である。組成によって異なるが、経
済性と必要蛍光発光量から０．０００１〜１０％の添加
、望ましくは０．０１〜〜１０％の添加が適している。The amount required to emit fluorescence varies greatly depending on the resin to be added, and since epoxy resins emit fluorescence by themselves, it is determined based on economic efficiency and the amount of light emitted by necessity; i'. If the resin emits almost no fluorescence by itself, such as the dark-hued Boliimi 11 resin, it is necessary to add more optical brightener than if the resin emits fluorescence by itself. Although it varies depending on the composition, it is suitable to add 0.0001 to 10%, preferably 0.01 to 10%, in view of economic efficiency and the required amount of fluorescence.
蛍光増白剤を添加した樹脂をワニス化して２３材に含浸
乾燥してプリプレグを作る。これを全層または一部の層
に入るように重ね、銅箔を両面または片面に配し、加熱
加圧して銅張積層板とする。A prepreg is made by making a varnish from a resin containing an optical brightener and impregnating it into Material 23 and drying it. These are stacked so as to cover all or some of the layers, copper foil is placed on both sides or one side, and heated and pressed to form a copper-clad laminate.
ガラス繊維紙布等基材に樹脂含浸前に蛍光増白剤を付着
するには、水または溶剤に蛍光増白剤を分散または溶か
して基材繊維に塗布する、成るいはカップリング剤、バ
インダに蛍光増白剤を混合溶解しで処理することもでき
る。このように前処理した基材に樹脂を含浸乾燥してプ
リプレグとし、さらに銅張積層板とすることもできる。To attach an optical brightener to a base material such as glass fiber paper cloth before resin impregnation, disperse or dissolve the optical brightener in water or a solvent and apply it to the base fiber, or use a coupling agent or binder. It can also be treated by mixing and dissolving an optical brightener. The thus pretreated base material can be impregnated with a resin and dried to produce a prepreg, which can also be used to produce a copper-clad laminate.
また蛍光増白剤付銅箔をプリプレグの両面又は片面に重
ね、さらに常法によって銅張積層板とする。すなわら、
銅箔に蛍光増白剤を水又は溶剤に分散溶解して塗布する
か、成るいは接着割付ｆｌＩＩ箔の場合は接着剤にこれ
を混合して蛍光増白剤（＝Ｉ銅箔とする。Further, a copper foil coated with a fluorescent whitening agent is laminated on both sides or one side of the prepreg, and further a copper-clad laminate is made by a conventional method. In other words,
A fluorescent whitening agent is dispersed and dissolved in water or a solvent and applied to the copper foil, or in the case of adhesive layout flII foil, it is mixed with an adhesive to form a fluorescent whitening agent (=I copper foil).
本発明による印刷配線板の回路面は、光学［３による欠
陥判定においては、導体部分と絶縁層部分の反射光量差
にさらに蛍光量の差が加わるために判別し易く、欠陥検
出の精度及び速度が向上する。The circuit surface of the printed wiring board according to the present invention can be easily identified in defect determination using optics [3] since the difference in the amount of fluorescence is added to the difference in the amount of reflected light between the conductor part and the insulating layer part, which improves the accuracy and speed of defect detection. will improve.
また、絶縁層の色相が褐色又はそれに近い暗色は場合、
蛍光増白剤の有無によって大きな差となる。In addition, if the insulating layer is brown or a dark color close to it,
There is a big difference depending on the presence or absence of an optical brightener.
ポリイミド樹脂（ケルイミド６０１ 日本ポリイミド
社製）をＮ−メチルピロリドンに溶解して樹脂分６０重
量％のワニスを作成した。このワニスに蛍光増白剤（Ｕ
Ｂ［ＴＥＸＯ１３チバガイギー社製）を樹脂に対して０
．５１壇％添加した。これを０．１１１１１ガラス布（
ガラススタイル＃２１１６日東紡績社製）に塗布含浸し
、乾燥して溶剤を揮発させ、Ｂステージの蛍光増白割入
ガラス基材ポリイミドプリプレグＡを得た。Polyimide resin (Kelimide 601, manufactured by Nippon Polyimide Co., Ltd.) was dissolved in N-methylpyrrolidone to prepare a varnish with a resin content of 60% by weight. Optical brightener (U) is added to this varnish.
B [TEXO13 manufactured by Ciba Geigy] to resin 0
．． Added 51%. Add this to 0.11111 glass cloth (
Glass style #2116 (manufactured by Nittobo Co., Ltd.) was coated and impregnated, and the solvent was evaporated by drying to obtain B-stage fluorescent whitening glass base polyimide prepreg A.
一方、前記と同様にケルイミド６０１をＮ−メチルピロ
リドンに熔解し、樹脂分６０重量％のワニスを作成した
。このワニスを前記ガラス布に塗布含浸し、乾燥して溶
剤を揮発させＢステージのガラス基材ポリイミドプリプ
レグＢを得た。On the other hand, in the same manner as above, Kelimide 601 was dissolved in N-methylpyrrolidone to prepare a varnish having a resin content of 60% by weight. This varnish was coated and impregnated onto the glass cloth, dried, and the solvent was evaporated to obtain a B-stage glass base polyimide prepreg B.
プリプレグ八を両弁側に１枚ずつ、その中にプリプレグ
Ｂを１３枚重ね、計１５枚を積層した両弁側に１８μｍ
の電解銅箔（ＪＴＣはく日鉱グールドホイル社製）を配
し、これを１．８ ｍｍのステンレス板で挟み、圧力６
０Ｋｇ／ｃｊ、温度２００℃で２時間加熱加圧して銅張
積層板を得た。この銅張積層板を薬液によるエツチング
で回路を形成し、２０μｍの大きさに集光した５ｍＷの
ＩＩ ｅ −Ｃｄレーザを用いた回路検査機で検査を行
った。この検査機は、レーザを光源にし対象物から発す
る蛍光差を光増倍管を用いて検出するものである。One sheet of Prepreg 8 is placed on both valve sides, and 13 sheets of Prepreg B are stacked therein, making a total of 15 sheets stacked on both valve sides with a thickness of 18 μm.
Electrolytic copper foil (manufactured by JTC Hakunikko Gould Foil Co., Ltd.) was placed between 1.8 mm stainless steel plates, and a pressure of 6.
A copper-clad laminate was obtained by heating and pressing at 0 kg/cj and a temperature of 200° C. for 2 hours. A circuit was formed on this copper-clad laminate by chemical etching and inspected using a circuit inspection machine using a 5 mW II e-Cd laser focused on a size of 20 μm. This inspection machine uses a laser as a light source and detects the difference in fluorescence emitted from an object using a photomultiplier tube.
検査は、目視で完全に形成した回路であると確認した板
と他の板で比較した。その結果、３０μｍの回路欠陥を
検知することができた。In the inspection, the board that was visually confirmed to have a completely formed circuit was compared with other boards. As a result, a circuit defect of 30 μm could be detected.
実施例で作成したプリプレグＢを１５枚重ね、実施例で
用いた電解銅はくを両弁側に配し、実施例と同様に銅張
積層板とし回路形成を行った。この仮を回路検査機で行
い、検出できる欠陥の大きさは７０μｍあった。Fifteen sheets of the prepreg B prepared in the example were stacked, the electrolytic copper foil used in the example was placed on both valve sides, and a circuit was formed as a copper-clad laminate in the same manner as in the example. This sample was tested using a circuit inspection machine, and the size of the defect that could be detected was 70 μm.
Claims (3)
の何れかに蛍光増白剤を付着して成る印刷配線板用銅張
積層板。1. A copper-clad laminate for a printed wiring board, which has a fluorescent brightener attached to either the outer surface of the outer layer copper foil or the insulating layer surface in contact with the outer layer copper foil.
する請求項１記載の印刷配線板用銅張積層板。2. The copper-clad laminate for printed wiring boards according to claim 1, characterized in that a fluorescent whitening agent is attached to the laminated base material.
又はチオフェン系を使用したことを特徴とする請求項１
又は２記載の印刷配線板用銅張積層板。3. Coumarin type, oxazolyl type,
Claim 1 characterized in that a thiophene-based compound is used.
Or the copper-clad laminate for printed wiring boards according to 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24559988A JPH0294491A (en) | 1988-09-29 | 1988-09-29 | Copper-clad laminated plate for printed-wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24559988A JPH0294491A (en) | 1988-09-29 | 1988-09-29 | Copper-clad laminated plate for printed-wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0294491A true JPH0294491A (en) | 1990-04-05 |
Family
ID=17136119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24559988A Pending JPH0294491A (en) | 1988-09-29 | 1988-09-29 | Copper-clad laminated plate for printed-wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0294491A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024024484A1 (en) * | 2022-07-27 | 2024-02-01 | 株式会社レゾナック | Resist pattern inspection method, resist pattern manufacturing method, substrate selection method, and manufacturing method for semiconductor package substrate or printed circuit board |
-
1988
- 1988-09-29 JP JP24559988A patent/JPH0294491A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024024484A1 (en) * | 2022-07-27 | 2024-02-01 | 株式会社レゾナック | Resist pattern inspection method, resist pattern manufacturing method, substrate selection method, and manufacturing method for semiconductor package substrate or printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100674319B1 (en) | Manufacturing method of printed circuit board having thin core layer | |
| US8400782B2 (en) | Wiring board and method for manufacturing the same | |
| WO2012100648A1 (en) | Prepreg comprising aromatic synthetic fiber paper and printed circuit board made using the prepreg | |
| JP2006148038A (en) | Method of manufacturing high density printed circuit board | |
| JPH0294491A (en) | Copper-clad laminated plate for printed-wiring board | |
| JP3577801B2 (en) | Copper clad laminate | |
| JP3312199B2 (en) | Resin composition for insulating layer for build-up on printed wiring board and multilayer wiring board | |
| JP3261775B2 (en) | Metal foil clad laminate | |
| EP1163389B1 (en) | Visible and fluorescent dye containing laminate materials | |
| JP2001174503A (en) | Method of evaluating reliability of insulation between inner layer circuits of printed circuit board | |
| US4965208A (en) | Inspection of multipattern circuit boards | |
| JPH0588905B2 (en) | ||
| JPH059309A (en) | Fluorescent laminate, printed circuit board and method for examining circuit pattern | |
| JP2002363897A (en) | Nonwoven fabric for electric insulation, method for producing the same, prepreg and laminate | |
| JPH0750455A (en) | Rigid/flexible printed wiring board and its manufacture | |
| JPH0977886A (en) | Glass nonwoven fabric for laminated plate and laminated plate | |
| KR20050035710A (en) | Manufacture method of the multi layer board with duplex plated through hole | |
| JPH06112607A (en) | Circuit board coping with optical inspection device type | |
| WO2000079849A1 (en) | High performance ball grid array substrates | |
| JPH06338663A (en) | Rigid-flex printed wiring board and its manufacture | |
| JPH0222891A (en) | Copper-clad laminated plate | |
| JPH06350207A (en) | Rigid flex printed wiring board and production thereof | |
| JP2003251727A (en) | Laminated sheet and printed-wiring board | |
| Huschka | Advanced Multilayer Bonding Technology | |
| JPH1019882A (en) | Method for evaluating adhesive applied copper foil |