JPH029440U - - Google Patents
Info
- Publication number
- JPH029440U JPH029440U JP8770088U JP8770088U JPH029440U JP H029440 U JPH029440 U JP H029440U JP 8770088 U JP8770088 U JP 8770088U JP 8770088 U JP8770088 U JP 8770088U JP H029440 U JPH029440 U JP H029440U
- Authority
- JP
- Japan
- Prior art keywords
- board body
- inclined surface
- periphery
- circuit board
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000003566 sealing material Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8770088U JPH029440U (enExample) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8770088U JPH029440U (enExample) | 1988-06-30 | 1988-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029440U true JPH029440U (enExample) | 1990-01-22 |
Family
ID=31312301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8770088U Pending JPH029440U (enExample) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029440U (enExample) |
-
1988
- 1988-06-30 JP JP8770088U patent/JPH029440U/ja active Pending