JPH029432U - - Google Patents
Info
- Publication number
- JPH029432U JPH029432U JP1988088386U JP8838688U JPH029432U JP H029432 U JPH029432 U JP H029432U JP 1988088386 U JP1988088386 U JP 1988088386U JP 8838688 U JP8838688 U JP 8838688U JP H029432 U JPH029432 U JP H029432U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- bonding wires
- bonding
- lead
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/50—
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- H10W72/07521—
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- H10W72/07551—
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- H10W72/07553—
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- H10W72/531—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5366—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988088386U JPH029432U (enExample) | 1988-07-01 | 1988-07-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988088386U JPH029432U (enExample) | 1988-07-01 | 1988-07-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029432U true JPH029432U (enExample) | 1990-01-22 |
Family
ID=31312956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988088386U Pending JPH029432U (enExample) | 1988-07-01 | 1988-07-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029432U (enExample) |
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1988
- 1988-07-01 JP JP1988088386U patent/JPH029432U/ja active Pending