JPH0292967U - - Google Patents
Info
- Publication number
- JPH0292967U JPH0292967U JP111989U JP111989U JPH0292967U JP H0292967 U JPH0292967 U JP H0292967U JP 111989 U JP111989 U JP 111989U JP 111989 U JP111989 U JP 111989U JP H0292967 U JPH0292967 U JP H0292967U
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed circuit
- soldering land
- flexible printed
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims 1
- 239000006071 cream Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP111989U JPH0292967U (en:Method) | 1989-01-09 | 1989-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP111989U JPH0292967U (en:Method) | 1989-01-09 | 1989-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0292967U true JPH0292967U (en:Method) | 1990-07-24 |
Family
ID=31200728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP111989U Pending JPH0292967U (en:Method) | 1989-01-09 | 1989-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0292967U (en:Method) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012209436A (ja) * | 2011-03-30 | 2012-10-25 | Fujifilm Corp | フレキシブル配線回路基板の接続構造体及びその接続方法 |
| CN106465541A (zh) * | 2014-12-01 | 2017-02-22 | 株式会社村田制作所 | 电子设备、电气元件以及电气元件用托盘 |
| JP2018170521A (ja) * | 2016-01-20 | 2018-11-01 | 株式会社村田製作所 | 樹脂多層基板と回路基板の接合構造 |
-
1989
- 1989-01-09 JP JP111989U patent/JPH0292967U/ja active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012209436A (ja) * | 2011-03-30 | 2012-10-25 | Fujifilm Corp | フレキシブル配線回路基板の接続構造体及びその接続方法 |
| CN106465541A (zh) * | 2014-12-01 | 2017-02-22 | 株式会社村田制作所 | 电子设备、电气元件以及电气元件用托盘 |
| JP2017092486A (ja) * | 2014-12-01 | 2017-05-25 | 株式会社村田製作所 | 電気素子 |
| US10270150B2 (en) | 2014-12-01 | 2019-04-23 | Murata Manufacturing Co., Ltd. | Electronic apparatus |
| CN110212276A (zh) * | 2014-12-01 | 2019-09-06 | 株式会社村田制作所 | 电子设备及电气元件 |
| US10424824B2 (en) | 2014-12-01 | 2019-09-24 | Murata Manufacturing Co., Ltd. | Electronic apparatus, electrical element, and electrical element tray |
| CN111447737A (zh) * | 2014-12-01 | 2020-07-24 | 株式会社村田制作所 | 电子设备 |
| CN110212276B (zh) * | 2014-12-01 | 2022-05-10 | 株式会社村田制作所 | 电子设备及电气元件 |
| JP2018170521A (ja) * | 2016-01-20 | 2018-11-01 | 株式会社村田製作所 | 樹脂多層基板と回路基板の接合構造 |
| US10403989B2 (en) | 2016-01-20 | 2019-09-03 | Murata Manufacturing Co., Ltd. | Resin multilayer substrate and electronic device |
| US10505298B2 (en) | 2016-01-20 | 2019-12-10 | Murata Manufacturing Co., Ltd. | Joint structure of a resin multilayer substrate and a circuit board |