JPH0292511A - Preparation of three dimensional molded item having electrically-conductive circuit wiring on surface - Google Patents
Preparation of three dimensional molded item having electrically-conductive circuit wiring on surfaceInfo
- Publication number
- JPH0292511A JPH0292511A JP63245722A JP24572288A JPH0292511A JP H0292511 A JPH0292511 A JP H0292511A JP 63245722 A JP63245722 A JP 63245722A JP 24572288 A JP24572288 A JP 24572288A JP H0292511 A JPH0292511 A JP H0292511A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- fixing
- circuit wiring
- wiring sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- 238000002347 injection Methods 0.000 claims abstract description 18
- 239000007924 injection Substances 0.000 claims abstract description 18
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 7
- 239000000057 synthetic resin Substances 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 abstract description 12
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 229920005669 high impact polystyrene Polymers 0.000 abstract description 4
- 239000004797 high-impact polystyrene Substances 0.000 abstract description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 abstract description 3
- 239000004793 Polystyrene Substances 0.000 abstract description 2
- 229920002223 polystyrene Polymers 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、表面に電気回路配線が形成され、かつ成形品
基材と一体化して備った合成樹脂立体成形品の製造方法
に関し、産業用、事務用、家庭用電気、電子機器の筐体
に利用できる。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a method for manufacturing a three-dimensional synthetic resin molded product having electrical circuit wiring formed on its surface and integrated with a base material of the molded product. It can be used for housings for commercial, office, household electrical, and electronic equipment.
〈従来技術〉
各種の電気、電子機器において、構造の簡素化、軽量化
、コンパクト化によるコストダウンを計るため、回路配
線部材としてプリント基板を用いずに、筐体等の合成樹
脂成形品の表面に回路配線を一体に設ける技術が開発さ
れつつある。 この場合、回路配線を形成する方法とし
て、表面に導電性回路配線を有するフレキシブルプリン
ト配線シートを射出成形用金型内に載置し、該金型を閉
じ、溶融した合成樹脂を射出し、冷却固化させた後、該
金型を開くことにより立体成形品の表面に導電性回路配
線を設ける方法がある。<Prior art> In order to reduce costs by simplifying, lightweighting, and compacting the structure of various electrical and electronic devices, the surface of synthetic resin molded products such as casings is used instead of printed circuit boards as circuit wiring members. Technology is being developed to integrate circuit wiring into In this case, the method for forming circuit wiring is to place a flexible printed wiring sheet with conductive circuit wiring on its surface in an injection mold, close the mold, inject molten synthetic resin, and cool it. There is a method of providing conductive circuit wiring on the surface of the three-dimensional molded product by opening the mold after solidification.
〈発明が解決しようとする課題〉
しかしながら、この方法においては、射出成形用金型内
にフレキシブルプリント配線シートを固定する方法に問
題があった。たとえば従来行われてきたインサート成形
と同様に金型内に吸着孔を設け、真空ポンプ等により真
空吸引を行ないフレキシブルプリント配線を固定する方
法では、フレキシブルプリント配線シートの厚みが厚＜
（１００〜３００ＩＩｍ） さらに重量が重いた
め、金型内壁への吸着が難しく、射出成形時の樹脂の流
動圧力によって位置ずれが起ってしまう欠点があった。<Problems to be Solved by the Invention> However, this method has a problem with the method of fixing the flexible printed wiring sheet within the injection mold. For example, in a method similar to conventional insert molding in which suction holes are provided in the mold and vacuum suction is performed using a vacuum pump or the like to fix the flexible printed wiring, the thickness of the flexible printed wiring sheet is
(100 to 300 IIm) Moreover, since it is heavy, it is difficult to adsorb it to the inner wall of the mold, and there is a drawback that positional displacement occurs due to the flow pressure of the resin during injection molding.
また、従来インサート成形で行われてきた静電気により
フレキシブルプリント配線シートを帯電させて、金型内
壁に吸着させる方法では、フレキシブルプリント配線シ
ートの表面に導電性の回路パターンが設けられているこ
とから、帯電させた場合にスパークして大変危険であり
、帯電しても導体があるため帯電時間が短く、成形時に
フレキシブル配線シートがずれてしまう等の問題があっ
た。In addition, in the conventional method of insert molding, in which the flexible printed wiring sheet is charged with static electricity and adsorbed to the inner wall of the mold, a conductive circuit pattern is provided on the surface of the flexible printed wiring sheet. When it is charged, it sparks, which is very dangerous, and even if it is charged, the charging time is short because there is a conductor, and there are problems such as the flexible wiring sheet being displaced during molding.
く課題を解決するための手段〉
本発明は、上記問題点を解決するためになされたもので
、表面に導電性回路配線を有するフレキシブルプリント
配線シートを射出成形用金型内に載置し、該金型を閉じ
、溶融した合成樹脂を射出し、冷却固化させた後、該金
型を開くことにより表面に導電性回路配線を有する立体
成形品を製造する方法において、射出成形用金型内にフ
レキシブルプリント配線シートを固定、位置決めするた
めの突起８および金型内壁面に該フレキシブルプリント
配線シートを密着、固定するためのバキューム吸引孔９
を設けた金型を用いて射出成形することを要旨とする表
面に導電性回路配線を有する立体成形品の製造方法であ
る。Means for Solving the Problems> The present invention was made to solve the above problems, and includes placing a flexible printed wiring sheet having conductive circuit wiring on the surface in an injection mold, In a method of manufacturing a three-dimensional molded product having conductive circuit wiring on the surface by closing the mold, injecting a molten synthetic resin, cooling and solidifying the resin, and then opening the mold, a protrusion 8 for fixing and positioning the flexible printed wiring sheet on the mold, and a vacuum suction hole 9 for tightly fitting and fixing the flexible printed wiring sheet on the inner wall surface of the mold.
This is a method for manufacturing a three-dimensional molded product having conductive circuit wiring on its surface, the gist of which is injection molding using a mold provided with.
次に本発明を図面に基づいて詳しく説明する。Next, the present invention will be explained in detail based on the drawings.
第１図は、本発明に使用する表面に導電性回路配線を有
するフレキシブル配線シートの断面図であり、第２図は
その平面図である。FIG. 1 is a sectional view of a flexible wiring sheet having conductive circuit wiring on its surface used in the present invention, and FIG. 2 is a plan view thereof.
本発明に使用する表面に導電性回路配線を有するフレキ
シブルプリント配線シートは、ポリエチレンテレフタレ
ート、ポリイミド、ポリサルホンポリエーテルサルホン
、ポリエーテルイミドなどの耐熱性に優れる熱可塑性樹
脂や熱硬化性樹脂基材フィルム１上に銅箔を接着した後
、回路配線２をエツチング処理により成形するかあるい
は基材フィルム１上に導電性インキで回路配線をスクリ
ーン印刷し、裏面に接着剤３を塗布した後、所定形状に
打抜いて製造する。この際、射出成形用金型内に設けた
固定用突起８と挿着できる固定用孔４を成形する。この
フレキシブル配線シートｌＯの固定用孔４は、射出成形
用金型内の固定用突起８への位置決めと固定用突起８に
挿着することにより、射出成形時に樹脂の流動圧力によ
ってシートが動くのを防止するためのものであり、フレ
キシブル配線シート内に少なくとも２ケ所以上の固定用
孔を設ける必要がある。The flexible printed wiring sheet having conductive circuit wiring on the surface used in the present invention is made of a thermoplastic resin with excellent heat resistance such as polyethylene terephthalate, polyimide, polysulfone, polyethersulfone, polyetherimide, etc., or a thermosetting resin base film. After adhering copper foil on the base film 1, the circuit wiring 2 is formed by etching or screen printing the circuit wiring with conductive ink on the base film 1, and after applying the adhesive 3 to the back side, the circuit wiring 2 is formed into a predetermined shape. Manufactured by punching. At this time, a fixing hole 4 into which a fixing protrusion 8 provided in the injection mold can be inserted is formed. The fixing holes 4 of the flexible wiring sheet 10 are positioned and inserted into the fixing protrusions 8 in the injection mold to prevent the sheet from moving due to the flow pressure of the resin during injection molding. In order to prevent this, it is necessary to provide at least two fixing holes in the flexible wiring sheet.
第３図は本発明に使用する射出成形用金型の断面図であ
る。金型のコア７にフレキシブル配線シート１０の固定
用孔４を挿着する固定用突起８を設け、かつフレキシブ
ル配線シート１０を吸着するバキューム吸引孔９を設け
である。固定用突起８はフレキシブル配線シート１０の
固定用孔の数に対応して形成する。バキューム吸引孔９
はフレキシブル配線シートを金型内壁に吸着することに
より、射出成形時に樹脂の流動圧力によって該シートが
動くことを防止し、かつ、樹脂が金型内壁と該シートと
の間に流入することを防ぐために設ける。FIG. 3 is a sectional view of an injection mold used in the present invention. A fixing protrusion 8 for inserting the fixing hole 4 of the flexible wiring sheet 10 into the core 7 of the mold is provided, and a vacuum suction hole 9 for sucking the flexible wiring sheet 10 is provided. The fixing protrusions 8 are formed in correspondence with the number of fixing holes in the flexible wiring sheet 10. Vacuum suction hole 9
By adhering the flexible wiring sheet to the inner wall of the mold, the sheet is prevented from moving due to the flow pressure of the resin during injection molding, and the resin is also prevented from flowing between the inner wall of the mold and the sheet. established for the purpose of
バキューム吸引孔９は焼結金属等の微細な通気孔をもつ
材料により形成することができ、外径５〜２０■、内部
の通気孔径０．３〜０．５閣、空孔率２８〜５０％の材
料が好ましく、通気孔径が０．１ ｍ以下であると射出
成形時に発生する樹脂の分解ガス等により詰まり、また
０、７１以上では吸着したフレキシブル配線シート上に
樹脂圧力によってバキューム吸引孔９の跡がついてしま
う、また、バキューム吸引孔９によるフレキシブル配線
シート１０の吸着には真空ポンプを使用し、真空度は４
０ｍｍＨｇ以下で吸引することが好ましく 、１００ｍ
ｍＨｇ以上の真空度では金型内壁と該シートとの密着の
点で問題がある。The vacuum suction hole 9 can be formed of a material with fine ventilation holes such as sintered metal, and has an outer diameter of 5 to 20 cm, an internal ventilation hole diameter of 0.3 to 0.5 cm, and a porosity of 28 to 50 cm. % material is preferable; if the vent hole diameter is 0.1 m or less, it will become clogged by resin decomposition gas generated during injection molding, and if it is 0.71 m or more, the vacuum suction hole 9 will be clogged by resin pressure on the adsorbed flexible wiring sheet. In addition, a vacuum pump is used to adsorb the flexible wiring sheet 10 by the vacuum suction hole 9, and the degree of vacuum is 4.
It is preferable to suction at 0 mmHg or less, and 100 m
If the degree of vacuum is higher than mHg, there is a problem in the close contact between the inner wall of the mold and the sheet.
本実施例の射出成形用金型では固定用突起８及びバキュ
ーム吸引孔９を金型のコアに設けているが、場合によっ
ては金型のキャビティに設けてもよい。In the injection mold of this embodiment, the fixing protrusion 8 and the vacuum suction hole 9 are provided in the core of the mold, but depending on the case, they may be provided in the cavity of the mold.
次に本発明の製造方法を第３図に基づき説明する。Next, the manufacturing method of the present invention will be explained based on FIG.
まず、射出成形用金型を型開きし、金型のコア７に設け
られた固定用突起８にフレキシブル配線シート１０の接
着剤面８が樹脂側に向くように固定用孔４を通して装着
し、同時に金型キャビティのバキューム吸引孔９よりフ
レキシブル配線シートｌＯを吸引し、金型内壁に吸着す
る０次に金型を閉じ、射出シリンダーより溶融樹脂を射
出し、冷却固化後、金型を開くことにより表面に導電性
回路配線を有する立体成形品１３を得ることができる。First, the injection mold is opened, and the flexible wiring sheet 10 is attached to the fixing protrusion 8 provided on the core 7 of the mold through the fixing hole 4 so that the adhesive side 8 faces the resin side. At the same time, the flexible wiring sheet lO is sucked through the vacuum suction hole 9 of the mold cavity, and the flexible wiring sheet lO is adsorbed to the inner wall of the mold. Next, the mold is closed, the molten resin is injected from the injection cylinder, and after cooling and solidifying, the mold is opened. As a result, a three-dimensional molded product 13 having conductive circuit wiring on the surface can be obtained.
本発明において射出成形に用いる樹脂には、−般の産業
用、事務用、家庭用電気、電子機器用の筐体として使用
される合成樹脂を用いることができ、例えばポリスチレ
ン、耐衝撃性ポリスチレン（ＨＩＰＳ）、ＡＢＳ樹脂、
アクリロニトリル−スチレン共重合樹脂、ポリプロピレ
ン樹脂、ポリカーボネート樹脂、変性ポリフェニレンエ
ーテル樹脂等を用いることができる。In the present invention, the resin used for injection molding can be a synthetic resin used as a housing for general industrial, office, household electrical, or electronic equipment, such as polystyrene, high-impact polystyrene ( HIPS), ABS resin,
Acrylonitrile-styrene copolymer resin, polypropylene resin, polycarbonate resin, modified polyphenylene ether resin, etc. can be used.
〈作用〉
本発明による表面に導電性回路配線を有する立体成形品
の製造方法では、射出成形用金型内にフレキシブル配線
シートを固定、位置決め用の突起およびバキューム吸引
孔を設けであるため、立体成形品の射出成形と同時にそ
の表面に位置精度よく回路配線を形成することができる
。<Function> In the method of manufacturing a three-dimensional molded product having conductive circuit wiring on the surface according to the present invention, a flexible wiring sheet is fixed in an injection mold and protrusions for positioning and vacuum suction holes are provided. Circuit wiring can be formed on the surface of a molded product with high positional accuracy at the same time as injection molding of the molded product.
〈実施例〉
ポリエチレンテレフタレートフィルム（厚み７５μｍ）
の表面に銀粉末を含みポリエステル樹脂をバインダーと
した導電性インキをスクリーン印刷して回路配線を形成
した。続いて裏面に共重合ポリエステル樹脂からなる接
着剤をスクリーン印刷により全面に塗布（厚み２０μｍ
）した後、固定用孔をあけ、表面に導電性回路を有する
フレキシフルプリント配線シートを製造した。<Example> Polyethylene terephthalate film (thickness 75 μm)
Circuit wiring was formed by screen printing conductive ink containing silver powder and using polyester resin as a binder on the surface. Next, an adhesive made of copolymerized polyester resin was applied to the entire surface by screen printing (thickness: 20 μm).
), holes for fixing were made, and a flexible printed wiring sheet having a conductive circuit on the surface was manufactured.
このフレキシブルプリント配線シートを箱型成形品の射
出成形金型内に設けた固定用突起にフレキシブルプリン
ト配線シートの接着剤面が樹脂側に向くようにして固定
用孔を通して装置した。続いて金型を閉じ、加熱溶融し
たＡＢＳ樹脂を下記の条件で射出した。This flexible printed wiring sheet was passed through a fixing hole into a fixing protrusion provided in an injection mold for a box-shaped molded product so that the adhesive side of the flexible printed wiring sheet faced the resin side. Subsequently, the mold was closed, and heated and melted ABS resin was injected under the following conditions.
・加熱シリンダー温度
（ノズル部２３０．前部２３０．中部２２０．後部２１
０ °Ｃ）・金型温度
（キャビティ４０°Ｃ，コア４０°Ｃ）・射出圧力
（−次射出圧力８００ｋｇ／ｃｊ、二次射出圧力６００
ｋｇ／ｃ＋１）次に冷却（時間１０秒）後、金型を開き
箱型成形品を得た。得られた箱型成形品は表面に導電性
回路配線を有しており、位置精度良く、かつ回路の断裂
もなく、成形品とフレキシブルプリント配線シートとの
密着も良好であった。・Heating cylinder temperature (nozzle part 230. Front part 230. Middle part 220. Rear part 21
0 °C), mold temperature (cavity 40 °C, core 40 °C), injection pressure (-secondary injection pressure 800 kg/cj, secondary injection pressure 600
kg/c+1) Next, after cooling (time: 10 seconds), the mold was opened to obtain a box-shaped molded product. The obtained box-shaped molded product had conductive circuit wiring on its surface, had good positional accuracy, had no circuit breakage, and had good adhesion between the molded product and the flexible printed wiring sheet.
〈発明の効果〉
本発明による表面に導電性回路配線を有する立体成形品
の製造方法では、射出成形用金型内の固定用突起にフレ
キシブルプリント配線シートの固定用孔を通して固定し
、かつバキューム吸引孔によりフレキシブルプリント配
線シートを金型内壁に吸着しているので、射出成形時に
樹脂圧力によってフレキシブル配線シートが動いたり、
金型内壁とフレキシブルプリント配線シートの間に樹脂
が流入したりする問題点がなくなる。<Effects of the Invention> In the method of manufacturing a three-dimensional molded product having conductive circuit wiring on its surface according to the present invention, a flexible printed wiring sheet is fixed through a fixing hole in a fixing protrusion in an injection mold, and is then fixed by vacuum suction. Since the flexible printed wiring sheet is adsorbed to the inner wall of the mold through the holes, there is no possibility that the flexible printed wiring sheet will move due to resin pressure during injection molding.
This eliminates the problem of resin flowing between the inner wall of the mold and the flexible printed wiring sheet.
さらに、本技術はフレキシブルプリント配線シートに限
らず、厚みが厚く、比重の大きいシートを用いたインサ
ート成形に適用できるものである。Furthermore, the present technology is applicable not only to flexible printed wiring sheets but also to insert molding using sheets that are thick and have a high specific gravity.
第１図は、本の立体成形品の製造に使用するブキシブル
プリント配線シートの一実施例を示す断面図であり、第
２図は、その平面図、第３図は製造に使用する射出成形
金型の断面図、第４図は立体成形品の断面図である。
１ 基材フィルム
２ 導電性回路配線
３ 接着剤
４ 固定用孔
５ 雌型
６ 雄型
７ コア
８ 固定用突起
９ バキューム吸引孔
１０ フレキシブル配線シート
キャビティ
射出シリンダー
成形品
特
許
出
願
人
凸
版
印
刷
株
式Fig. 1 is a sectional view showing an example of a buxible printed wiring sheet used in the production of three-dimensional molded products for books, Fig. 2 is a plan view thereof, and Fig. 3 is an injection molding used in the production. A sectional view of the mold, and FIG. 4 is a sectional view of the three-dimensional molded product. 1 Base film 2 Conductive circuit wiring 3 Adhesive 4 Fixing hole 5 Female mold 6 Male mold 7 Core 8 Fixing protrusion 9 Vacuum suction hole 10 Flexible wiring sheet cavity injection cylinder molded product Patent applicant Toppan Printing Co., Ltd.
Claims (1)
ト配線シートを射出成形用金型内に載置し、該金型を閉
じ、溶融した合成樹脂を射出し、冷却固化させた後、該
金型を開くことにより表面に導電性回路配線を有する立
体成形品を製造する方法において、固定用突起及びバキ
ューム吸引孔を有する金型内に固定用孔を有するフレキ
シブルプリント配線シートを移送し、該シートを前記固
定用突起と固定用孔との嵌合及びバキューム吸引孔によ
り金型内に固定し、樹脂を金型内に射出することにより
、成形することを特徴とする導電性回路配線を有する立
体成形品の製造方法。1) A flexible printed wiring sheet with conductive circuit wiring on the surface is placed in an injection mold, the mold is closed, molten synthetic resin is injected, and after cooling and solidifying, the mold is closed. In a method of manufacturing a three-dimensional molded product having conductive circuit wiring on the surface by opening, a flexible printed wiring sheet having fixing holes is transferred into a mold having fixing protrusions and vacuum suction holes, and the sheet is A three-dimensional molded product having conductive circuit wiring, characterized in that it is fixed in a mold by fitting a fixing protrusion and a fixing hole and by a vacuum suction hole, and is molded by injecting resin into the mold. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63245722A JPH0292511A (en) | 1988-09-28 | 1988-09-28 | Preparation of three dimensional molded item having electrically-conductive circuit wiring on surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63245722A JPH0292511A (en) | 1988-09-28 | 1988-09-28 | Preparation of three dimensional molded item having electrically-conductive circuit wiring on surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0292511A true JPH0292511A (en) | 1990-04-03 |
Family
ID=17137828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63245722A Pending JPH0292511A (en) | 1988-09-28 | 1988-09-28 | Preparation of three dimensional molded item having electrically-conductive circuit wiring on surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0292511A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04182108A (en) * | 1990-11-16 | 1992-06-29 | Japan Steel Works Ltd:The | Method and device of doubling molding |
| JP2011135005A (en) * | 2009-12-25 | 2011-07-07 | Teikoku Tsushin Kogyo Co Ltd | Method of manufacturing substrate with base |
| JP2014013930A (en) * | 2013-09-11 | 2014-01-23 | Teikoku Tsushin Kogyo Co Ltd | Method for manufacturing substrate with base |
| CN106879159A (en) * | 2015-12-14 | 2017-06-20 | 富葵精密组件(深圳)有限公司 | The flexible PCB and its manufacture method of 3D structures, electronic installation |
-
1988
- 1988-09-28 JP JP63245722A patent/JPH0292511A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04182108A (en) * | 1990-11-16 | 1992-06-29 | Japan Steel Works Ltd:The | Method and device of doubling molding |
| JP2011135005A (en) * | 2009-12-25 | 2011-07-07 | Teikoku Tsushin Kogyo Co Ltd | Method of manufacturing substrate with base |
| JP2014013930A (en) * | 2013-09-11 | 2014-01-23 | Teikoku Tsushin Kogyo Co Ltd | Method for manufacturing substrate with base |
| CN106879159A (en) * | 2015-12-14 | 2017-06-20 | 富葵精密组件(深圳)有限公司 | The flexible PCB and its manufacture method of 3D structures, electronic installation |
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