CN106879159A - The flexible PCB and its manufacture method of 3D structures, electronic installation - Google Patents
The flexible PCB and its manufacture method of 3D structures, electronic installation Download PDFInfo
- Publication number
- CN106879159A CN106879159A CN201510922530.6A CN201510922530A CN106879159A CN 106879159 A CN106879159 A CN 106879159A CN 201510922530 A CN201510922530 A CN 201510922530A CN 106879159 A CN106879159 A CN 106879159A
- Authority
- CN
- China
- Prior art keywords
- flexible pcb
- structures
- mould
- depressed part
- protuberance
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A kind of flexible PCB of 3D structures, it includes first surface and the second surface opposite with the first surface, the first surface has at least one first protuberance, at least one first protuberance protrudes along the first surface, the second surface has at least one first depressed part, at least one first depressed part is recessed along the second surface, and every 1 first protuberance and one first depressed part are correspondingly arranged on the opposite first surface of the flexible PCB of the 3D structures and second surface and form concaveconvex structure.Separately, the present invention also provides a kind of manufacture method of the flexible PCB of above-mentioned 3D structures, a kind of electronic installation of the flexible PCB of the above-mentioned 3D structures of application.
Description
Technical field
The present invention relates to the flexible PCB and its manufacture method of a kind of 3D structures, and the electronic installation for applying the flexible PCB of the 3D structures.
Background technology
In recent years, compact electronic product is favored by consumers in general.The internal space of electronic product is less and less so that the mechanism's design inside electronic product becomes increasingly complex, and certainly will require flexible PCB（FPC）Closely attached with save space with the mechanism inside electronic product.Flat FPC is generally converted into 3D structures so that the FPC is engaged with the interior spatial structure for installing its device at present, after obtaining the FPC of 3D structures, the FPC of the 3D structures is fitted with adhesive tape again and is fixed in described device, but, this method needs to use adhesive tape, increased cost, the thickness of product is increased to a certain extent and reduces the heat resistance of electronic product, and after using a period of time, as adhesive tape viscosity is reduced, the easy rebound deformations of FPC of 3D structures even depart from the mechanism.
The content of the invention
In view of this, it is necessary to a kind of flexible PCB of new 3D structures is provided, to solve the above problems.
Separately, there is a need to the manufacture method that a kind of flexible PCB of above-mentioned 3D structures is provided.
Separately, there is a need to the electronic installation that a kind of flexible PCB for applying above-mentioned 3D structures is provided.
A kind of flexible PCB of 3D structures, it includes first surface and the second surface opposite with the first surface, the first surface has at least one first protuberance, at least one first protuberance protrudes along the first surface, the second surface has at least one first depressed part, at least one first depressed part is recessed along the second surface, and every 1 first protuberance and one first depressed part are correspondingly arranged on the opposite first surface of the flexible PCB of the 3D structures and second surface and form concaveconvex structure.
A kind of manufacture method of the flexible PCB of 3D structures, it comprises the following steps：
Step S1：One flat flexible PCB is provided；
Step S2：There is provided one has the mould of heating and refrigerating function, the mould have upper mould and with this on the lower mould that matches of mould, the upper mould and lower mould of the mould have cooperatively formed a die cavity, the mold has one first forming surface, the lower mould has one second forming surface, there is at least one second depressed part in first forming surface, second depressed part is recessed along first forming surface, there is at least one second protuberance in second forming surface, second protuberance protrudes along second forming surface, when mould closes film with lower mould on this, every 1 second depressed part is just to one second protuberance, mould is airbag structure on this；
Step S3：The flat flexible PCB is positioned in the die cavity, the deformation temperature of the flat flexible PCB to the flat flexible PCB is heated, the flat flexible PCB is carried out hot-forming, obtain an intermediate；
Step S4：The intermediate is cooled down, the flexible PCB of 3D structures is obtained.
A kind of electronic installation of the flexible PCB of the application 3D structures, the space structure that the shape and electronic installation of the flexible PCB of the 3D structures are used for the flexible PCB for installing 3D structures matches.
The surface of the flexible PCB of the 3D structures has concaveconvex structure, and the concaveconvex structure has stronger rigidity, so as to improve the rigidity of the flexible PCB of 3D structures.In addition, the shape of the flexible PCB of the 3D structures matches with the space structure of the flexible PCB for installing the 3D structures of electronic installation, so that the flexible PCB of 3D structures can be set directly at the space structure of the flexible PCB for installing 3D structures of electronic installation, avoid the use of adhesive tape, be conducive to saving the inner space of electronic installation, reduce the thickness of electronic installation.
Brief description of the drawings
Fig. 1 is the schematic cross-section of the flexible PCB of the 3D structures of one embodiment of the invention.
Fig. 2 is the schematic cross-section of the flexible PCB of the 3D structures of yet another embodiment of the invention.
Fig. 3 is the schematic cross-section of the flexible PCB of the 3D structures of further embodiment of this invention.
Fig. 4 is the schematic cross-section of flat flexible PCB.
Fig. 5 is that mould carries out the hot-forming schematic diagram for obtaining intermediate to flat flexible PCB.
Main element symbol description
| The flexible PCB of 3D structures | 100、100a、100b |
| First surface | 11 |
| First protuberance | 111 |
| Second surface | 12 |
| First depressed part | 121 |
| Concaveconvex structure | 13 |
| Flat flexible PCB | 200 |
| Mould | 300 |
| Upper mould | 301 |
| First forming surface | 3011 |
| Second depressed part | 3012 |
| Lower mould | 302 |
| Second forming surface | 3021 |
| Second protuberance | 3022 |
| Die cavity | 310 |
| Intermediate | 400 |
Following specific embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Specific embodiment
Refer to Fig. 1 ~ 3, the flexible PCB 100 of the 3D structures of better embodiment of the present invention, it includes insulating barrier（It is not shown）, an at least conductive circuit layer（It is not shown）And an at least solder mask（It is not shown）.
The flexible PCB 100 of the 3D structures includes first surface 11 and the second surface 12 opposite with the first surface 11.The first surface 11 has at least one first protuberance 111, at least one first protuberance 111 protrudes along the first surface 11, the second surface 12 has at least one first depressed part 121, at least one first depressed part 121 is recessed along the second surface 12, and every 1 first protuberance 111 and one first depressed part 121 are correspondingly arranged on the opposite first surface 11 of the flexible PCB 100 of the 3D structures and second surface 12 so as to form concaveconvex structure 13.The concaveconvex structure 13 can be three-dimensional decorative pattern, and the three-dimensional decorative pattern can be striped, spiral lamination, miniature three-dimensional gully etc..The flexible PCB 100 of the 3D structures has 3D structures in its natural state, and the region with concaveconvex structure 13 of the flexible PCB 100 of the 3D structures has stronger rigidity.
Wall thickness of the wall thickness of the concaveconvex structure 13 less than the region without concaveconvex structure 13 on the flexible PCB 100 of 3D structures.
The space structure of flexible PCB 100 of the shape of the flexible PCB 100 of the 3D structures with electronic installation for installing the 3D structures matches.
The material of the insulating barrier of the flexible PCB 100 of the 3D structures is amorphous resin.Amorphous resin can be amorphous polyimides（PI）, amorphous polyethylene terephthalate（PEN）, amorphous polyethylene terephthalate（PET）Etc. amorphous macromolecular material.The material of the conductive circuit layer can be the preferable metal of ductility（Such as copper）.
It should be understood that the flexible PCB 100 of the 3D structures can also be able to be multi-layer flexible circuit board for single-layer-flex circuit.
Fig. 1 is the flexible PCB 100 of the 3D structures of one embodiment of the invention, and an at least region of the flexible PCB 100 of the 3D structures is formed with concaveconvex structure 13.In the present embodiment, the first protuberance 111 of the flexible PCB 100 of the 3D structures is rendered as projection, and the first depressed part 121 of the flexible PCB 100 of the 3D structures is rendered as gully.
Fig. 2 is the flexible PCB 100a of the 3D structures of yet another embodiment of the invention, and an at least region of the flexible PCB 100a of the 3D structures is formed with concaveconvex structure 13.In the present embodiment, first protuberance 111 of a of flexible PCB 100 of the 3D structures is rendered as N-shaped projection, and first depressed part 121 of a of flexible PCB 100 of the 3D structures is rendered as U-shaped gully.The thickness in the region without concaveconvex structure 13 of a of flexible PCB 100 of the 3D structures is D1, the thickness of the side wall in U-shaped gully is D2, the thickness of the bottom wall in U-shaped gully is D3, D1＞ D2＞ D3。
Fig. 3 is the flexible PCB 100b of the 3D structures of further embodiment of this invention, and an at least region of the b of flexible PCB 100 of the 3D structures is formed with concaveconvex structure 13.In the present embodiment, first protuberance 111 of the b of flexible PCB 100 of the 3D structures is rendered as ∧ types（It is reverse V-shaped）Projection, first depressed part 121 of the b of flexible PCB 100 of the 3D structures is rendered as V-type gully.The thickness in the region without concaveconvex structure 13 of the b of flexible PCB 100 of the 3D structures is D4, the wall thickness in V-type gully is D5, D4＞ D5。
Further referring to Fig. 4 ~ 5, the flexible PCB of the 3D structures of better embodiment of the present invention（FPC）100 manufacture method, the flexible PCB 100 of the 3D structures is installed in an electronic installation（It is not shown）Inside, the space structure that the shape of the flexible PCB 100 of the 3D structures and electronic installation are used for the flexible PCB 100 for installing 3D structures matches, and the manufacture method of the flexible PCB 100 of the 3D structures comprises the following steps.
Step S1：Refer to Fig. 4, there is provided a flat flexible PCB 200.
The flat flexible PCB 200 can be conventional flexible PCB, and it includes insulating barrier, conductive circuit layer and the solder mask that Traditional flexible circuit plate has（It is not shown）Etc. structure.The flat flexible PCB 200 can be alternatively multi-layer flexible circuit board for single-layer-flex circuit.The material of the insulating barrier is the resin of crystalline state.The resin of the crystalline state can be polyimides（PI）, polyethylene terephthalate（PEN）, polyethylene terephthalate（PET）Etc. the macromolecular material for being usually used in flexible circuit plate insulating layer.The material of the conductive circuit layer can be the preferable metal of ductility（Such as copper）.
Step S2：Further referring to Fig. 5, there is provided a molding tool 300.
The mould 300 itself has the function of heating and cooling.The mould 300 have upper mould 301 and with this on the lower mould 302 that matches of mould 301, mould 301 and lower mould 302 have cooperatively formed a die cavity 310 on this, the space structure of flexible PCB 100 of the space structure of the die cavity 310 with electronic installation for installing 3D structures is identical, i.e., the space structure of the die cavity 310 is identical with the structure of the flexible PCB 100 of the 3D structures to be prepared.Mould 301 has one first forming surface 3011 on this, and the lower mould 302 has one second forming surface 3021.There is at least one second depressed part 3012 in first forming surface 3011, second depressed part 3012 is recessed along first forming surface 3011, there is at least one second protuberance 3022, second protuberance 3022 protrudes along second forming surface 3021 in second forming surface 3021.When mould 301 closes film with lower mould 302 on this, every 1 second depressed part 3012 is just to one second protuberance 3022.Second depressed part 3012 is recessed in first forming surface 3011 and forms three-dimensional gully, and second protuberance 3022 protrudes above to form striped or spiral lamination in second forming surface 3021.Mould 301 can be airbag structure on this.
Step S3：The flat flexible PCB 200 is positioned in the die cavity 310 of the mould 300, and the temperature of the mould 300 is raised rapidly, the temperature of flat flexible PCB 200 is set to reach deformation temperature, heat-insulation pressure keeping is hot-forming to carry out to flat flexible PCB 200, obtains an intermediate 400.The intermediate 400 includes insulating barrier, conductive circuit layer and solder mask.
Step S4：With more than or equal to 10 degree per seconds Celsius（℃/S）Speed cool down the intermediate 400 rapidly, the resin of the insulating barrier of the intermediate 400 is changed into amorphous state by crystalline state, that is, obtain the flexible PCB 100 of 3D structures, an at least region of the flexible PCB 100 of the 3D structures has concaveconvex structure 13.
In the step S3, the first surface 11 that second depressed part 3012 is transferred to the flexible PCB 100 of 3D structures forms the first protuberance 111, the second surface 12 that second protuberance 3022 is transferred to the flexible PCB 100 of 3D structures forms the first depressed part 121, so as to form concaveconvex structure 13 in an at least region of the flexible PCB 100 of 3D structures.The concaveconvex structure 13 can be three-dimensional decorative pattern, and the three-dimensional decorative pattern can be striped, spiral lamination or three-dimensional gully, and the concaveconvex structure 13 has stronger rigidity, such that it is able to improve the rigidity of the flexible PCB 100 of 3D structures.
The temperature of the deformation of the insulating barrier of the flat flexible PCB 200 is different and different according to the resin for constituting the insulating barrier, for example, when the material of insulating barrier is polyimides, the temperature of its deformation is 150 ~ 200 DEG C.The flat flexible PCB 200 is cooled down rapidly with the speed more than or equal to 10 DEG C/S, the insulating barrier of the flat flexible PCB 200 can be made to be changed into amorphous state from crystalline state so that the shape of the flexible PCB 100 of last obtained 3D structures is difficult to be changed.
It should be understood that the intermediate 400 is cooled down rapidly constantly in the step S4 medium velocities, other resin materials in addition to insulating barrier of the intermediate 400（Such as glue-line, coating）Also can occur, by crystalline state to amorphous transformation, further to strengthen the difficult degree of deformation of the flexible PCB 100 of obtained 3D structures.
The material of the insulating barrier of the flexible PCB 100 of 3D structures of the invention is amorphous resin so that the Stability Analysis of Structures of the flexible PCB 100 of 3D structures, and the situation of rebound deformation will not occur in use.And the concaveconvex structure 13 that the surface of the flexible PCB 100 of the 3D structures is formed with the striped by depression or projection, spiral lamination or three-dimensional gully, the concaveconvex structure 13 has stronger rigidity, so as to improve the rigidity of the flexible PCB 100 of 3D structures.In addition, the shape of the flexible PCB 100 of the 3D structures matches with the space structure of the flexible PCB 100 for installing the 3D structures of electronic installation, so that the flexible PCB 100 of 3D structures can be set directly at the space structure of the flexible PCB 100 for installing 3D structures of electronic installation, avoid the use of adhesive tape, be conducive to saving the inner space of electronic installation, reduce the thickness of electronic installation.
In addition, for the person of ordinary skill of the art, other various corresponding changes and deformation can be made with technology according to the present invention design, and all these changes and deformation should all belong to the protection domain of the claims in the present invention.
Claims (10)
1. a kind of flexible PCB of 3D structures, it includes first surface and the second surface opposite with the first surface, it is characterised in that：The first surface has at least one first protuberance, at least one first protuberance protrudes along the first surface, the second surface has at least one first depressed part, at least one first depressed part is recessed along the second surface, and every 1 first protuberance and one first depressed part are correspondingly arranged on the opposite first surface of the flexible PCB of the 3D structures and second surface and form concaveconvex structure.
2. the flexible PCB of 3D structures as claimed in claim 1, it is characterised in that：The concaveconvex structure is three-dimensional pattern.
3. the flexible PCB of 3D structures as claimed in claim 2, it is characterised in that：The three-dimensional pattern is striped, spiral lamination or three-dimensional gully.
4. the flexible PCB of 3D structures as claimed in claim 1, it is characterised in that：Wall thickness of the wall thickness of the concaveconvex structure less than the region without concaveconvex structure on the flexible PCB of 3D structures.
5. the flexible PCB of 3D structures as claimed in claim 1, it is characterised in that：The flexible PCB of the 3D structures has an at least insulating barrier, the material of the insulating barrier is amorphous resin, and amorphous resin is amorphous resin polyimides, amorphous resin polyethylene terephthalate or amorphous resin polyethylene terephthalate.
6. a kind of manufacture method of the flexible PCB of 3D structures, it comprises the following steps：
Step S1：One flat flexible PCB is provided；
Step S2：There is provided one has the mould of heating and refrigerating function, the mould have upper mould and with this on the lower mould that matches of mould, the upper mould and lower mould of the mould have cooperatively formed a die cavity, the mold has one first forming surface, the lower mould has one second forming surface, there is at least one second depressed part in first forming surface, second depressed part is recessed along first forming surface, there is at least one second protuberance in second forming surface, second protuberance protrudes along second forming surface, when mould closes film with lower mould on this, every 1 second depressed part is just to one second protuberance, mould is airbag structure on this；
Step S3：The flat flexible PCB is positioned in the die cavity, the deformation temperature of the flat flexible PCB to the flat flexible PCB is heated, the flat flexible PCB is carried out hot-forming, obtain an intermediate；
Step S4：The intermediate is cooled down, the flexible PCB of 3D structures is obtained.
7. the manufacture method of the flexible PCB of 3D structures as claimed in claim 6, it is characterised in that：Second depressed part is recessed in first forming surface and forms three-dimensional gully, and second protuberance protrudes above to form striped or spiral lamination in second forming surface.
8. the manufacture method of the flexible PCB of 3D structures as claimed in claim 6, it is characterised in that：Cooling velocity in the step S4 is more than or equal to 10 degree per seconds Celsius.
9. the manufacture method of the flexible PCB of 3D structures as claimed in claim 6, it is characterised in that：The intermediate has an insulating barrier, and the material of the insulating barrier is the resin of crystalline state, and when cooling down the intermediate in the step S4, the material of the insulating barrier is changed into amorphous state by crystalline state.
10. a kind of electronic installation of the flexible PCB of the 3D structures in application claim 1 ~ 5 described in any one, the space structure of the flexible PCB of the shape of the flexible PCB of the 3D structures with electronic installation for installing 3D structures matches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510922530.6A CN106879159A (en) | 2015-12-14 | 2015-12-14 | The flexible PCB and its manufacture method of 3D structures, electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510922530.6A CN106879159A (en) | 2015-12-14 | 2015-12-14 | The flexible PCB and its manufacture method of 3D structures, electronic installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106879159A true CN106879159A (en) | 2017-06-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510922530.6A Pending CN106879159A (en) | 2015-12-14 | 2015-12-14 | The flexible PCB and its manufacture method of 3D structures, electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106879159A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0292511A (en) * | 1988-09-28 | 1990-04-03 | Toppan Printing Co Ltd | Preparation of three dimensional molded item having electrically-conductive circuit wiring on surface |
| CN102738361A (en) * | 2011-03-31 | 2012-10-17 | 山一电机股份有限公司 | Luminous-body flexible board and luminous device |
| CN103281858A (en) * | 2013-05-28 | 2013-09-04 | 三星半导体(中国)研究开发有限公司 | Printed circuit board and manufacturing method thereof, and flip-chip packaging member and manufacturing method thereof |
-
2015
- 2015-12-14 CN CN201510922530.6A patent/CN106879159A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0292511A (en) * | 1988-09-28 | 1990-04-03 | Toppan Printing Co Ltd | Preparation of three dimensional molded item having electrically-conductive circuit wiring on surface |
| CN102738361A (en) * | 2011-03-31 | 2012-10-17 | 山一电机股份有限公司 | Luminous-body flexible board and luminous device |
| CN103281858A (en) * | 2013-05-28 | 2013-09-04 | 三星半导体(中国)研究开发有限公司 | Printed circuit board and manufacturing method thereof, and flip-chip packaging member and manufacturing method thereof |
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Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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Effective date of registration: 20190114 Address after: 223065 No. 11 Honghai North Road, Huaian Economic and Technological Development Zone, Jiangsu Province Applicant after: Qing Ding precision electronic (Huaian) Co., Ltd. Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Peng Ding Polytron Technologies Inc Address before: 518105 Yanchuan Yanluo Road, Songgang Street, Baoan District, Shenzhen City, Guangdong Province Applicant before: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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