CN110430736B - Inflation molding phase-change temperature-equalizing plate, processing method and electronic equipment - Google Patents
Inflation molding phase-change temperature-equalizing plate, processing method and electronic equipment Download PDFInfo
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- CN110430736B CN110430736B CN201910745033.1A CN201910745033A CN110430736B CN 110430736 B CN110430736 B CN 110430736B CN 201910745033 A CN201910745033 A CN 201910745033A CN 110430736 B CN110430736 B CN 110430736B
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- 238000000465 moulding Methods 0.000 title claims abstract description 19
- 238000003672 processing method Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 20
- 230000008569 process Effects 0.000 claims abstract description 19
- 239000002131 composite material Substances 0.000 claims description 29
- 230000008859 change Effects 0.000 claims description 20
- 238000007664 blowing Methods 0.000 claims description 19
- 238000005096 rolling process Methods 0.000 claims description 15
- 238000005452 bending Methods 0.000 claims description 13
- 239000003112 inhibitor Substances 0.000 claims description 12
- 238000005098 hot rolling Methods 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 6
- 230000007704 transition Effects 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 3
- 238000013329 compounding Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 238000000071 blow moulding Methods 0.000 abstract description 6
- 238000005097 cold rolling Methods 0.000 description 7
- 238000000137 annealing Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses an inflation molding phase-change temperature-equalizing plate, which comprises a first substrate and a second substrate which are mutually covered, wherein a closed cavity is arranged between the first substrate and the second substrate, and a bulge molded by an inflation process is formed on the first substrate in a direction away from the second substrate. According to the blow-molding phase-change temperature-equalizing plate, the protrusions are directly and tightly attached to the heating device, so that the transfer thermal resistance is reduced, and the heat dissipation performance is improved. The invention also discloses a processing method for processing the blow-up molding phase-change temperature-equalizing plate and electronic equipment with the blow-up molding phase-change temperature-equalizing plate.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to an inflation molding phase-change temperature-equalizing plate, a processing method and electronic equipment.
Background
With the rapid development of miniaturization, integration and high efficiency of power electronic equipment and devices, the performance and heat dissipation capacity of the devices are continuously increased, and the problems of uneven heat flux density distribution, local heat flux density maximization, heat accumulation in local areas and local overhigh temperature are brought.
The existing blow-molding phase-change temperature-equalizing plate is generally of a flat plate structure, is embedded and pressed in a channel of a substrate, and a heating device is attached to the substrate to conduct heat to the phase-change temperature-equalizing plate for heat dissipation; or, after the phase-change temperature-equalizing plate is bent, the phase-change temperature-equalizing plate is directly attached to the heating device, and heat is conducted to the cavity of the phase-change temperature-equalizing plate through the bending part and dissipated through the surface of the temperature-equalizing plate. However, for heating devices with specific shapes, structures, positions and layouts, the structure of the conventional blow-up type temperature equalizing plate is difficult to be directly and tightly attached to the heating device, so that the heat transfer resistance is increased, and the heat dissipation performance is obviously reduced.
Disclosure of Invention
Based on this, it is necessary to provide an inflation molding phase change temperature equalizing plate closely attached to the structure of the heat generating device;
it is also necessary to provide a processing method for processing the blow-molded phase change temperature equalizing plate;
it is further necessary to provide an electronic device with the blow-molded phase-change temperature-equalizing plate.
The technical scheme adopted for solving the technical problems is as follows: the utility model provides an inflation shaping phase transition samming board, inflation shaping phase transition samming board is including first base plate and the second base plate that mutually covers, first base plate with be provided with closed cavity between the second base plate, first base plate is kept away from the direction of second base plate is formed with the arch through inflation technology fashioned.
Further, a first cavity is arranged between the first substrate and the second substrate, a second cavity is arranged in the protrusion, the first cavity is communicated with the second cavity, and the closed cavity comprises the first cavity and the second cavity.
Further, the protrusions include a first protrusion and a second protrusion, the first protrusion and the second protrusion being located at the same side of the first substrate and having a height difference.
Further, the second cavity is arranged in the first protrusion, a third cavity is arranged in the second protrusion, the third cavity is communicated with the second cavity, and the closed cavity further comprises the third cavity.
Further, the cross section of the bulge is trapezoid, and the angle between the side wall and the top wall of the bulge is alpha, and alpha is more than or equal to 120 degrees and less than 180 degrees.
Further, a bending part is arranged between the protruding side wall and the top wall, the bending part is of an arc structure, the bending radius of the bending part is R, and the thickness of the inflation forming phase-change temperature-equalizing plate is d, wherein R is more than 2.5d.
Further, the closed cavity is filled with a phase change working medium, and a capillary structure is arranged in the closed cavity.
The invention also provides a processing method of the blow-up molding phase-change temperature-equalizing plate, which comprises the following steps:
step S1: printing a rolling inhibitor, and printing a rolling inhibitor pattern on a first substrate;
step S2: hot rolling and compounding, namely covering a second substrate on the first substrate printed with the rolling inhibitor, and hot rolling the first substrate and the second substrate to obtain a composite board;
step S3: pre-blowing, namely forming a process hole on the composite board, and introducing high-pressure gas into the process hole to perform blowing to form a hollow cavity;
and S4, secondarily blowing, namely loading the composite board into a blowing mold, wherein the blowing mold comprises a first mold and a second mold, a limiting groove is formed in any one of the blowing molds, and high-pressure gas is introduced into a process hole to perform blowing, so that the composite board forms a bulge under the action of the limiting groove.
The invention also provides electronic equipment, which comprises the blow-molding phase-change temperature-equalizing plate.
Further, the electronic equipment further comprises a panel, a circuit board, a heating device and a rear cover, wherein the panel and the rear cover are mutually matched to form an installation cavity, the inflation-molding phase-change temperature-equalizing plate, the circuit board and the heating device are all installed in the installation cavity, and the heating device is attached to the protrusion.
The beneficial effects of the invention are as follows: according to the inflation molding phase-change temperature-equalizing plate, the protrusions are directly and tightly attached to the heating device, so that the transfer thermal resistance is reduced, and the heat dissipation performance is improved. The invention also provides a processing method for processing the blow-up molding phase-change temperature-equalizing plate and electronic equipment with the blow-up molding phase-change temperature-equalizing plate.
Drawings
The invention is further described below with reference to the drawings and examples.
FIG. 1 is a schematic view of the structure of an inflation molding phase change temperature equalizing plate and an inflation mold before inflation;
FIG. 2 is a schematic view of the blow-up molded phase change temperature equalizing plate and the blow-up mold shown in FIG. 1;
FIG. 3 is a schematic view of the structure of the expansion molded phase change temperature equalizing plate shown in FIG. 1 in combination with a heat generating device;
FIG. 4 is an enlarged view of a portion of FIG. 3 at A;
FIG. 5 is a flow chart of a method of processing an inflation molded phase change temperature uniformity plate of the present invention;
fig. 6 is a schematic structural view of an electronic device with the blow-molded phase change temperature equalizing plate shown in fig. 1.
The names and the numbers of the parts in the figure are respectively as follows:
first substrate 1 second substrate 2 first cavity 21
Protrusion 3 first protrusion 31 second cavity 311
Third cavity 321 of second bump 32 first heat generating device 4
Second heating device 5 first limit groove 201 of inflation mold 20
Second limiting groove 202 first die 203 and second die 204
Panel 6 circuit board 7 rear cover 9
Mounting cavity 61
Detailed Description
The present invention will now be described in detail with reference to the accompanying drawings. The figure is a simplified schematic diagram illustrating the basic structure of the invention only by way of illustration, and therefore it shows only the constitution related to the invention.
Referring to fig. 1 to 4, the present invention provides a blow-molding phase-change temperature equalizing plate, which includes a first substrate 1 and a second substrate 2 that are mutually covered, a closed cavity is disposed between the first substrate 1 and the second substrate 2, a protrusion 3 molded by a blow-molding process is formed on the first substrate 1 in a direction away from the second substrate 2, and the protrusion 3 is used for being attached to a heat generating device.
The bump 3 includes a first bump 31 and a second bump 32, and the first bump 31 and the second bump 32 are located on the same side of the first substrate 1. In the present embodiment, the first protrusions 31 are higher than the second protrusions 32. It will be appreciated that in other embodiments not shown, the heights of the first protrusions 31 and the second protrusions 32 may be the same.
In this embodiment, a first cavity 21 is disposed between the first substrate 1 and the second substrate 2, a second cavity 311 is disposed in the first protrusion 31, a third cavity 321 is disposed in the second protrusion 32, the first cavity 21, the second cavity 311 and the third cavity 321 are mutually communicated, the first cavity 21, the second cavity 311 and the third cavity 321 form a closed cavity, a capillary structure is disposed in the closed cavity, and a phase change working medium is filled in the first cavity 21, the second cavity 311 and the third cavity 321.
It will be appreciated that in other embodiments not shown, the protrusion 3 further includes a third protrusion or a fourth protrusion for a plurality of heat generating devices requiring heat dissipation, and the number and positions of the protrusions 3 are determined according to the number and positions of the heat generating devices, and preferably, one protrusion 3 is required for one heat generating device requiring heat dissipation.
In this embodiment, it is necessary to dissipate heat from two heat generating devices, for example, the heat generating device includes a first heat generating device 4 and a second heat generating device 5 mounted on the circuit board 6, the first heat generating device 4 is attached to an outer surface of the first protrusion 31, the second heat generating device 5 is attached to an outer surface of the second protrusion 32, the first protrusion 31 is used for dissipating heat from the first heat generating device 4, and the second protrusion 32 is used for dissipating heat from the second heat generating device 5.
Preferably, the first protrusion 31 and the second protrusion 32 each have a square structure, and the positions of the first protrusion 31 and the second protrusion 32 correspond to the positions, shapes, and heights of the first heat generating device 4 and the second heat generating device 5.
Based on this, referring to fig. 1 to 5, the present invention further provides a processing method for processing the above-mentioned blow-molded phase-change temperature-equalizing plate, the processing method includes the following steps:
step S1: and (3) printing the rolling inhibitor, namely cleaning and roughening one of the substrates, and printing the rolling inhibitor on the roughened surface of the substrate according to the pattern of the cavity or the flow path which is blown up according to the process requirement. The rolling inhibitor is solidified on the base plate after being dried, and then the other base plate is covered on the base plate printed with the rolling inhibitor, so that the rolling inhibitor is positioned between the two base plates.
In this embodiment, the rolling inhibitor is a graphite emulsion or a boron nitride emulsion. In addition, in this embodiment, in order to avoid loosening of the two substrates before rolling, subsequent processing is inconvenient, and the two substrates are fixedly connected by riveting.
Step S2: and hot rolling and compounding, namely placing the riveted and fixed double-layer substrate into a heating furnace for heating, wherein the heating temperature is about 600 ℃, and conveying the heated double-layer substrate into a hot rolling mill for rolling, so that the double-layer substrate is rolled into a composite plate.
Step S3: pre-inflation, wherein a process hole is formed in the composite board, and high-pressure gas is introduced into the process hole to perform inflation, so that a hollow cavity is formed.
It will be appreciated that the pipeline pattern can be inflated out by pre-inflation, whereby the local position of the bulge to be inflated can be obtained.
And S4, secondarily blowing, namely loading the composite board into a blowing mold with limit grooves, wherein the blowing mold comprises a first mold and a second mold, wherein any one of the blowing molds is provided with the limit groove, and high-pressure gas is introduced into a process hole to perform blowing, so that the composite board forms a bulge 3 under the action of the limit groove, and the bulge 3 comprises a first bulge 31 and a second bulge 32.
Further, the cross section of the protrusions 3 is substantially trapezoidal, so that the protrusions are not easily torn during inflation. The angle between the side walls and the top wall of the projection 3 is α,120 ° or less α < 180 °, in this embodiment α=150°. A bending part is arranged between the side wall and the top wall of the bulge 3, the bending part is of an arc structure, the bending radius of the bending part is R (unit: mm), and the thickness of the composite board is d (unit: mm), wherein R is more than 2.5d. In this embodiment, r=3mm, d=9mm. The thickness d of the composite board is the thickness of the phase change temperature equalizing board formed by inflation.
Before secondary inflation, the inflation mold 20 is prepared, the inflation mold 20 comprises a first mold 203 and a second mold 204, a limit groove is formed in any inflation mold 20, the limit groove comprises a first limit groove 201 and a second limit groove 202, the position of the first limit groove 201 corresponds to the position of the first protrusion 31, the position of the second limit groove 202 corresponds to the position of the second protrusion 32, specifically, the depths of the first limit groove 201 and the second limit groove 202 are different, the depth of the first limit groove 201 is matched with the height of the first protrusion 31, and the depth of the second limit groove 202 is matched with the height of the second protrusion 32. Further, a first limit groove 201 and a second limit groove 202 are provided on the first mold 203.
In the secondary inflation process, the first substrate 1 can extend into the first limiting groove 201 and the second limiting groove 202 due to the first limiting groove 201 and the second limiting groove 202 on the first substrate 1, the outer surface of the first protrusion 31 is attached to the first limiting groove 201, and the outer surface of the second protrusion 32 is attached to the second limiting groove 202. In the present embodiment, since the first and second stopper grooves 201 and 202 have different depths, the heights of the first and second protrusions 31 and 32 can be made different.
It should be noted that, the composite board formed by hot rolling and compositing is printed with the flow path pattern inside but cannot be seen from the outside, so that the mold cannot be placed at the position of the flow path pattern during secondary inflation, which results in that the finally formed bulge does not correspond to the flow path pattern, and the expected inflation position cannot be obtained. To solve this problem, a pre-inflation operation is performed so that, when performing the secondary inflation positioning, a local position where the bulge is to be inflated is obtained.
The step S1 is preceded by the step of,
two substrates, in this embodiment, both of which are aluminum plates, are prepared, and the model of the aluminum plate is 3003.
The step S2 and the step S3 further comprise the following steps,
and (3) cold rolling and leveling, wherein in order to ensure the flatness of the composite board, the composite board formed after hot rolling is required to be sent into a cold rolling mill for cold rolling treatment, and the composite board after cold rolling is leveled. Meanwhile, the cold rolling operation can also play a role in adjusting the length of a finished product. The composite sheet is elongated after rolling, but there is an error in elongation after hot rolling, so the hot rolled composite sheet is sorted by length and controlled by cold rolling to a desired length.
And (3) annealing, namely sending the rolled composite plate into an annealing furnace, and cooling after annealing at 600 ℃. Through annealing treatment, the residual stress generated in the cold rolling leveling process of the composite board can be effectively reduced, and the deformation of the composite board is avoided. In this embodiment, the composite plate is heated to 600 ℃ and then annealed.
The step S4 is followed by the following steps,
and (3) stamping and trimming, namely placing the composite board on a stamping machine, stamping through the cooperation of the first die 203 and the second die 204, so as to seal the inflation port, further forming a sealed cavity on the composite board, and trimming the composite board according to the pattern and the size required by the process.
And filling phase change working medium, sealing, forming a filling port communicated with the outside on the composite board, and welding a process connecting pipe connected with the filling port. And vacuumizing the composite board through the process connecting pipe, filling the phase change working medium, and cutting off the process connecting pipe after welding or crimping and sealing, so that the phase change working medium is sealed in the sealed cavity, and the phase change temperature equalizing board is obtained.
Referring to fig. 6, the present invention further provides an electronic device with the above-mentioned blow-molded phase-change temperature-equalizing plate, which includes a panel 6, a circuit board 7, a heating device, a back cover 9, and the above-mentioned blow-molded phase-change temperature-equalizing plate, wherein the panel 6 and the back cover 9 are connected in a matching manner, such that a mounting cavity 61 is formed between the panel 6 and the back cover 9, and the circuit board 7, the heating device, and the blow-molded phase-change temperature-equalizing plate are all mounted in the mounting cavity 61.
In a specific embodiment, the heat generating device comprises a first heat generating device 4 and a second heat generating device 5, wherein the second heat generating device 5 is mounted on a circuit board 7. The bulge 3 on the blow-up molding phase-change temperature-equalizing plate is arranged towards the panel 6, the surface (i.e. the planar structure on the phase-change temperature-equalizing plate) of the bulge 3 on the blow-up molding phase-change temperature-equalizing plate is attached to the rear cover 9, the second heating device 5 is arranged on one surface of the circuit board 7, the surface of the circuit board 7 opposite to the second heating device 5 is attached to the panel 6, and one side of the second heating device 5 away from the circuit board 7 is attached to the second bulge 32. Meanwhile, one surface of the first heat generating device 4 is attached to the panel 6, and a surface of the first heat generating device 4 opposite to the surface is attached to the first protrusion 31.
So, in electronic equipment working process, the heat that first heating device 4 produced can be directly through first protruding 81 transfer to the phase transition samming board on, simultaneously, the heat that second heating device 5 produced can be directly through second protruding 82 transfer to the phase transition samming board on, has promoted the effective transfer of first heating device 4 and second heating device 5 heat, has further promoted the radiating effect.
In a specific embodiment, the electronic device is a notebook computer or a tablet computer, where the panel 6 is a keyboard and an outer frame of the notebook computer, or a display screen and an outer frame of the tablet computer, the first heat generating device 4 is a battery, and the second heat generating device 5 is a heat generating electronic device.
Compared with the traditional structure, the blow-molding phase-change temperature-equalizing plate or the electronic equipment provided by the invention has the advantages that the bulge 3 is directly and tightly attached to the heating device, so that the heat transfer resistance is reduced, and the heat dissipation performance is improved.
While the foregoing is directed to the preferred embodiment of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (8)
1. An inflation molding phase transition samming board which is characterized in that: the phase change temperature equalizing plate comprises a first substrate and a second substrate which are mutually covered, a closed cavity is arranged between the first substrate and the second substrate, a bulge formed through an inflation process is formed on the first substrate in the direction away from the second substrate, a first cavity is arranged between the first substrate and the second substrate, a second cavity is arranged in the bulge, the first cavity and the second cavity are mutually communicated, the closed cavity comprises the first cavity and the second cavity, a phase change working medium is filled in the closed cavity, and a capillary structure is arranged in the closed cavity.
2. The blow-molded phase change temperature equalization plate as recited in claim 1 wherein: the protrusions include a first protrusion and a second protrusion, the first protrusion and the second protrusion being located on the same side of the first substrate and having a height difference.
3. The blow-molded phase change temperature equalization plate as recited in claim 2 wherein: the second cavity is arranged in the first protrusion, a third cavity is arranged in the second protrusion, the third cavity is communicated with the second cavity, and the closed cavity further comprises the third cavity.
4. The blow-molded phase change temperature equalization plate as recited in claim 1 wherein: the cross section of the bulge is trapezoid, and the angle between the side wall and the top wall of the bulge is alpha, and alpha is more than or equal to 120 degrees and less than 180 degrees.
5. The blow-molded phase-change temperature-equalizing plate according to claim 4, wherein: the temperature-equalizing plate is characterized in that a bending part is arranged between the side wall and the top wall of the bulge, the bending part is of an arc structure, the bending radius of the bending part is R, and the thickness of the inflation forming phase-change temperature-equalizing plate is d, wherein R is more than 2.5d.
6. A processing method of an inflation molding phase-change temperature-equalizing plate is characterized by comprising the following steps of: an inflation molding phase transition temperature equalizing plate suitable for use in any one of claims 1 to 5, the processing method comprising the steps of:
step S1: printing a rolling inhibitor, and printing a rolling inhibitor pattern on a first substrate;
step S2: hot rolling and compounding, namely covering a second substrate on the first substrate printed with the rolling inhibitor, and hot rolling the first substrate and the second substrate to obtain a composite board;
step S3: pre-blowing, namely forming a process hole on the composite board, and introducing high-pressure gas into the process hole to perform blowing to form a hollow cavity;
and S4, secondarily blowing, namely loading the composite board into a blowing mold, wherein the blowing mold comprises a first mold and a second mold, a limiting groove is formed in any one of the blowing molds, and high-pressure gas is introduced into a process hole to perform blowing, so that the composite board forms a bulge under the action of the limiting groove.
7. An electronic device, characterized in that: the electronic device comprising the blow-molded phase change temperature equalizing plate according to any one of claims 1 to 5.
8. The electronic device of claim 7, wherein: the electronic equipment further comprises a panel, a circuit board, a heating device and a rear cover, wherein the panel and the rear cover are mutually matched and connected to form an installation cavity, the inflation-molding phase-change temperature-equalizing plate, the circuit board and the heating device are all installed in the installation cavity, and the heating device is attached to the protrusion.
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| CN201910745033.1A CN110430736B (en) | 2019-08-13 | 2019-08-13 | Inflation molding phase-change temperature-equalizing plate, processing method and electronic equipment |
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| CN201910745033.1A CN110430736B (en) | 2019-08-13 | 2019-08-13 | Inflation molding phase-change temperature-equalizing plate, processing method and electronic equipment |
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| CN110430736B true CN110430736B (en) | 2023-11-10 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110708934A (en) * | 2019-10-31 | 2020-01-17 | 华为技术有限公司 | Temperature equalizing component and electronic equipment |
| CN110779369A (en) * | 2019-12-04 | 2020-02-11 | 东莞市万维热传导技术有限公司 | Take capillary structure inflation formula aluminium temperature-uniforming plate |
| CN111063841A (en) * | 2019-12-20 | 2020-04-24 | 福建元晟汽车配件科技有限公司 | New energy automobile power battery box body bottom plate and single-side blowing process thereof |
| CN111148411A (en) * | 2020-01-15 | 2020-05-12 | 常州恒创热管理有限公司 | Fin type phase-change heat dissipation plate, machining method thereof and heat dissipation module |
| WO2021151233A1 (en) * | 2020-01-30 | 2021-08-05 | Barco N.V. | Cooling sub-assembly |
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| WO2017113571A1 (en) * | 2015-12-31 | 2017-07-06 | 浙江嘉熙科技有限公司 | Integrated phase-change inhibition heat transfer and heat exchange plate structure and manufacturing method thereof |
| CN109561640A (en) * | 2019-01-14 | 2019-04-02 | 常州常发制冷科技有限公司 | The finned temperature-uniforming plate of MULTILAYER COMPOSITE and processing method |
| CN109729700A (en) * | 2019-01-14 | 2019-05-07 | 常州常发制冷科技有限公司 | The processing method of phase transformation temperature-uniforming plate, radiator and the temperature-uniforming plate |
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| WO2017113571A1 (en) * | 2015-12-31 | 2017-07-06 | 浙江嘉熙科技有限公司 | Integrated phase-change inhibition heat transfer and heat exchange plate structure and manufacturing method thereof |
| CN109561640A (en) * | 2019-01-14 | 2019-04-02 | 常州常发制冷科技有限公司 | The finned temperature-uniforming plate of MULTILAYER COMPOSITE and processing method |
| CN109729700A (en) * | 2019-01-14 | 2019-05-07 | 常州常发制冷科技有限公司 | The processing method of phase transformation temperature-uniforming plate, radiator and the temperature-uniforming plate |
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