CN110430736A - A kind of inflation molding phase transformation temperature-uniforming plate and processing method, electronic equipment - Google Patents

A kind of inflation molding phase transformation temperature-uniforming plate and processing method, electronic equipment Download PDF

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Publication number
CN110430736A
CN110430736A CN201910745033.1A CN201910745033A CN110430736A CN 110430736 A CN110430736 A CN 110430736A CN 201910745033 A CN201910745033 A CN 201910745033A CN 110430736 A CN110430736 A CN 110430736A
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China
Prior art keywords
inflation
protrusion
phase transformation
substrate
cavity
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CN201910745033.1A
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Chinese (zh)
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CN110430736B (en
Inventor
黄晓峰
张尧
涂志龙
徐栋
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Changzhou Hengchuang Thermal Management System Co ltd
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Changzhou Hengchuang Heat Management Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps

Abstract

The invention discloses a kind of inflations to form phase transformation temperature-uniforming plate, it includes the first substrate and the second substrate that mutual lid closes, closed cavity is provided between the first substrate and the second substrate, the first substrate is formed through the molding protrusion of blowing-up technology towards the direction far from the second substrate.Inflation of the invention forms phase transformation temperature-uniforming plate, directly, is closely bonded by protrusion with heating device, reduces transmitting thermal resistance, improve heat dissipation performance.The invention also discloses a kind of processing method for processing inflation molding phase transformation temperature-uniforming plate and the electronic equipments with inflation molding phase transformation temperature-uniforming plate.

Description

A kind of inflation molding phase transformation temperature-uniforming plate and processing method, electronic equipment
Technical field
The present invention relates to technical field of heat dissipation, particularly, are related to a kind of inflation molding phase transformation temperature-uniforming plate and processing method, electricity Sub- equipment.
Background technique
As power electronic equipment and device are to miniaturization, integrated, efficient fast development, device performance and heat dissipation Amount constantly increase, and bring heat flux distribution is uneven, local heat flux density greatly, heat be gathered in regional area, part The excessively high problem of temperature.
Existing inflation forms phase transformation temperature-uniforming plate, and usually slab construction, snaps in the conduit of substrate, heating device with Heat is transmitted to the heat dissipation of phase transformation temperature-uniforming plate by substrate by substrate fitting;Alternatively, after phase transformation temperature-uniforming plate bending directly and heater Part fitting, heat are transmitted to the cavity of phase transformation temperature-uniforming plate by bending part, pass through temperature-uniforming plate surface radiating.But for specific shape With the heating device of structure, position and layout, the structure of existing inflation type temperature-uniforming plate is difficult to heating device directly, closely Ground fitting, increases transmitting thermal resistance, and heat dissipation performance significantly reduces.
Summary of the invention
Based on this, it is necessary to provide a kind of inflation molding phase transformation temperature-uniforming plate being bonded with the close structure of heating device;
It there is a need to provide a kind of processing method for processing inflation molding phase transformation temperature-uniforming plate;
More it is necessary to provide a kind of electronic equipments with inflation molding phase transformation temperature-uniforming plate.
The technical solution adopted by the present invention to solve the technical problems is: a kind of inflation molding phase transformation temperature-uniforming plate, described to blow Being expanded into type phase transformation temperature-uniforming plate includes the first substrate and the second substrate that mutual lid closes, the first substrate and the second substrate it Between be provided with closed cavity, it is molding that the first substrate towards the direction far from the second substrate is formed through blowing-up technology Protrusion.
Further, the first cavity, setting in the protrusion are provided between the first substrate and the second substrate Have the second cavity, first cavity and second cavity are interconnected, the closed cavity include first cavity and Second cavity.
Further, the protrusion includes that the first protrusion and second are raised, first protrusion and the described second raised position In the first substrate the same side and have difference in height.
Further, second cavity is arranged in first protrusion, is provided with third chamber in second protrusion Body, the third cavity and second cavity are interconnected, and the closed cavity further includes the third cavity.
Further, the trapezoidal shape in section of the protrusion, the angle between the side wall and roof of the protrusion are α, 180 ° of 120 °≤α <.
Further, bending part is provided between the side wall and roof of the protrusion, the bending part is in arc structure, institute The radius bend for stating bending part is R, inflation molding phase transformation temperature-uniforming plate with a thickness of d, R > 2.5d.
Further, it is filled with phase-change working substance in the closed cavity, is provided with capillary structure in the closed cavity.
The present invention also provides a kind of processing method of inflation molding phase transformation temperature-uniforming plate, inflation described above forms phase transformation Temperature-uniforming plate, the processing method the following steps are included:
Step S1: agent is rolled in printing resistance, and agent pattern is rolled in printing resistance on the first substrate;
Step S2: the second substrate is covered on and is printed with resistance and rolls on the first substrate of agent by method hot rolling, and by first substrate Hot rolling, which is carried out, with the second substrate obtains composite plate;
Step S3: pre- inflation opens up fabrication hole in composite plate, is passed through high pressure gas to fabrication hole and carries out inflation, is formed Hollow cavity;
Step S4: composite plate is attached in inflation mold by secondary inflation, and the inflation mold includes the first mold and second Mold offers limiting slot on any inflation mold, is passed through high pressure gas to fabrication hole and carries out inflation, so that composite plate Protrusion is formed under the action of limiting slot.
The present invention also provides a kind of electronic equipment, the electronic equipment includes that any one of aforementioned inflation molding phase transformation is equal Warm plate.
Further, the electronic equipment further includes panel, circuit board, heating device and rear cover, the panel with it is described Rear cover complements each other to form an installation cavity, and the inflation molding phase transformation temperature-uniforming plate, circuit board and the heating device are installed in In the installation cavity, the heating device fits with the protrusion.
The beneficial effects of the present invention are: inflation provided by the invention forms phase transformation temperature-uniforming plate, pass through protrusion and heating device Directly, it is closely bonded, reduces transmitting thermal resistance, improve heat dissipation performance.The present invention also provides one kind for processing this Inflation forms the processing method of phase transformation temperature-uniforming plate and the electronic equipment with inflation molding phase transformation temperature-uniforming plate.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the structural schematic diagram before inflation molding phase transformation temperature-uniforming plate and inflation mold inflation of the invention;
Fig. 2 is the structural schematic diagram after the molding phase transformation temperature-uniforming plate of inflation shown in Fig. 1 and inflation mold inflation;
Fig. 3 is the structural schematic diagram of the molding phase transformation temperature-uniforming plate of inflation shown in Fig. 1 and heating device cooperation;
Fig. 4 is the partial enlarged view in Fig. 3 at A;
Fig. 5 is the flow chart of the processing method of inflation molding phase transformation temperature-uniforming plate of the invention;
Fig. 6 is the structural schematic diagram of the electronic equipment with the molding phase transformation temperature-uniforming plate of inflation shown in Fig. 1.
Parts title and its number are respectively as follows: in figure
1 the second substrate of first substrate, 2 first cavity 21
Raised 31 second cavitys 311 of protrusion 3 first
Second 321 first heating device 4 of raised 32 third cavity
Second heating device, 5 inflation mold, 20 first limiting slot 201
Second limiting slot, 202 first mold, 203 second mold 204
6 circuit board of panel, 7 rear cover 9
Installation cavity 61
Specific embodiment
Presently in connection with attached drawing, the present invention is described in detail.This figure is simplified schematic diagram, is only illustrated in a schematic way Basic structure of the invention, therefore it only shows the composition relevant to the invention.
The present invention provides a kind of inflations to form phase transformation temperature-uniforming plate referring to FIG. 1 to FIG. 4, comprising mutually lid close the One substrate 1 and the second substrate 2 are provided with closed cavity between first substrate 1 and the second substrate 2, first substrate 1 is towards far from second The direction of substrate 2 is formed through blowing-up technology molding raised 3, and protrusion 3 with heating device for fitting.
Protrusion 3 includes the first protrusion 31 and the second protrusion 32, and the first protrusion 31 and the second protrusion 32 are located at first substrate 1 The same side.In present embodiment, the height of the first protrusion 31 is high compared with the second protrusion 32.It is to be appreciated that unshowned at other In embodiment, the height of the first protrusion 31 and the second protrusion 32 can also be identical.
In the present embodiment, the first cavity 21 is provided between first substrate 1 and the second substrate 2, in the first protrusion 31 It is provided with the second cavity 311, third cavity 321, the first cavity 21, the second cavity 311 and are provided in the second protrusion 32 Three cavitys 321 are interconnected, and the first cavity 21, the second cavity 311 and third cavity 321 constitute closed cavity, closed cavity It is inside provided with capillary structure, is filled with phase-change working substance in the first cavity 21, the second cavity 311 and third cavity 321.
It is to be appreciated that in other unshowned embodiments, for multiple heating devices for needing to radiate, protrusion 3 It further include third protrusion or the 4th protrusion, the quantity of protrusion 3 and position are determined according to the quantity of heating device and position, preferably , the heating device for needing to radiate for one, protrusion 3 has one.
In the present embodiment, it needs to radiate to two heating devices, for example heating device includes being mounted on circuit The first heating device 4 and the second heating device 5 on plate 6, the first heating device 4 and the outer surface of the first protrusion 31 fit, Second heating device 5 and the outer surface of the second protrusion 32 fit, and the first protrusion 31 is scattered for carrying out to the first heating device 4 Heat, the second protrusion 32 is for radiating to the second heating device 5.
Preferably, the first protrusion 31 and the second protrusion 32 are square structure, the position of the first protrusion 31 and the second protrusion 32 It sets corresponding with the position of the first heating device 4 and the second heating device 5, shape and height.
Based on this, Fig. 1 to Fig. 5 is please referred to, the present invention also provides one kind for processing above-mentioned inflation molding phase transformation samming The processing method of plate, the processing method the following steps are included:
Step S1: printing resistance roll agent, by one of substrate carry out cleaning and feather plucking, and on the feather plucking face of substrate according to The cavity of process requirement inflation or the figure of flow path carry out printing resistance and roll agent.Resistance is rolled agent and is solidificated on substrate after drying, Then another substrate cover is closed on being printed with the substrate that agent is rolled in resistance, so that resistance rolls agent between two substrates.
In the present embodiment, it is graphite lotion or boron nitride lotion that agent is rolled in resistance.In addition, in present embodiment, in order to It avoids two substrates from unclamping before rolling conjunction, is not easy to following process, stake-fastening connects between two substrates.
Step S2: the double layer substrate after stake-fastening is put into heating furnace and heats by method hot rolling, heating temperature about 600 DEG C, the double layer substrate after heating, which is sent into hot-rolling mill, to be rolled, and synthesizes composite plate so that double layer substrate be rolled.
Step S3: pre- inflation opens up fabrication hole in composite plate, is passed through high pressure gas to fabrication hole and carries out inflation, is formed Hollow cavity.
It is to be appreciated that pipeline figure inflation can be come out by pre- inflation, formed so as to obtain wanted inflation The position of the part of protrusion.
Step S4: composite plate is attached in the inflation mold with limiting slot by secondary inflation, and the inflation mold includes the One mold and the second mold offer limiting slot on any inflation mold, are passed through high pressure gas to fabrication hole and are blown Swollen, so that composite plate forms protrusion 3 under the action of limiting slot, protrusion 3 includes the first protrusion 31 and the second protrusion 32.
Further, the substantially trapezoidal shape in section of protrusion 3, enables to not allow in inflation tearable.Protrusion 3 Angle between side wall and roof is α, 180 ° of 120 °≤α <, in the present embodiment, α=150 °.The side wall of protrusion 3 and top Bending part is provided between wall, which is in arc structure, and the radius bend of bending part is R (unit: mm), in addition, multiple Plywood is with a thickness of d (unit: mm), wherein R > 2.5d.In the present embodiment, R=3mm, d=9mm.It should be noted that Composite plate thickness d is the thickness of inflation molding phase transformation temperature-uniforming plate.
Before secondary inflation, preparing inflation mold 20, inflation mold 20 includes the first mold 203 and the second mold 204, Limiting slot is offered on any inflation mold 20, the limiting slot includes the first limiting slot 201 and the second limiting slot 202, the The position of one limiting slot 201 is corresponding with the position of the first protrusion 31, the position of the position of the second limiting slot 202 and the second protrusion 32 Set corresponding, specifically, the first limiting slot 201 is different from the depth of the second limiting slot 202, the depth of the first limiting slot 201 with The height of first protrusion 31 matches, and the depth of the second limiting slot 202 and the height of the second protrusion 32 match.Further, First limiting slot 201 and the second limiting slot 202 are arranged on the first mold 203.
In secondary blowing process, the part of corresponding first limiting slot 201 and the second limiting slot 202 on first substrate 1, by In the first limiting slot 201 and the second limiting slot 202, first substrate 1 is enabled to stretch to the first limiting slot 201 and the second limit In slot 202, the outer surface of the first protrusion 31 fits with the first limiting slot 201, the outer surface of the second protrusion 32 and the second limit Slot 202 fits.In the present embodiment, since the first limiting slot 201 is different from the depth of the second limiting slot 202, so as to Enough so that the height of the first protrusion 31 and the second protrusion 32 is different.
It should be noted that the composite plate that method hot rolling is formed, composite board internal have printed flow path figure, but from outside It can't see, therefore, it is impossible to which mold when by secondary inflation is placed at the position of flow path figure, will lead to eventually form convex It rises not corresponding with flow path figure, and then is unable to get expected blown position.In order to solve this problem, pre-blowing is first carried out Swollen operation, to obtain the position that wanted inflation forms the part of protrusion when carrying out the positioning of secondary inflation.
It is further comprising the steps of before the step S1,
Stock, prepares two substrates, and in the present embodiment, two substrates are aluminium sheet, and the model 3003 of aluminium sheet.
It is further comprising the steps of between the step S2 and the step S3,
Cold rolling smoothing, in order to guarantee that the flatness of composite plate, the composite plate formed after hot rolling need to be sent into cold-rolling mill progress Cold-rolling treatment is leveling by the composite plate after cold rolling.Meanwhile by cold rolling manipulation, adjustment finished product length can be also played Effect.Composite plate extends after rolling, but there are errors for the elongation after hot rolling, therefore to press length to the composite plate after hot rolling It is sorted, estimated length is reached by cold rolling control.
The composite plate of rolling is sent into annealing furnace by annealing, cooling after 600 DEG C of annealing.By making annealing treatment, The residual stress generated during composite plate cold rolling smoothing can be effectively reduced, avoiding composite plate, deformation occurs.In this embodiment party In formula, composite plate is heated to 600 DEG C of after annealings.
It is further comprising the steps of after the step S4,
Composite plate is put on press machine by punching and edge-cutting, by the cooperation of the first mold 203 and the second mold 204, is carried out Punching press, so that inflation mouth is closed, so that a closed cavity is formed in composite plate, then by composite plate according to process requirement Figure, size carry out trimming.
Filling phase-change working substance simultaneously seals, and the fill port being in communication with the outside is opened up in composite plate, and welding is connect with fill port Technique connecting leg.Composite plate is vacuumized by technique connecting leg, fills phase-change working substance, excision technique connects after welding or crimping sealing Pipe, to phase-change working substance is sealed in closed cavity, to obtain phase transformation temperature-uniforming plate.
Referring to Fig. 6, the present invention also provides a kind of electronic equipment with above-mentioned inflation molding phase transformation temperature-uniforming plate, the electricity Sub- equipment includes panel 6, circuit board 7, heating device, rear cover 9 and above-mentioned inflation molding phase transformation temperature-uniforming plate, wherein panel 6 It cooperates and connects with rear cover 9, so that form an installation cavity 61 between panel 6 and rear cover 9, circuit board 7, heating device and blow Type phase transformation temperature-uniforming plate is expanded into be installed in installation cavity 61.
In a specific embodiment, the heating device includes the first heating device 4 and the second heating device 5, Wherein, the second heating device 5 is mounted on circuit board 7.Inflation forms the protrusion 3 on phase transformation temperature-uniforming plate and is arranged towards panel 6, blows The surface (that is, planar structure on phase transformation temperature-uniforming plate) for being expanded into protrusion 3 relatively on type phase transformation temperature-uniforming plate fits with rear cover 9, the Two heating devices 5 are mounted on a surface of circuit board 7, with respect to the surface of the second heating device 5 and panel 6 on circuit board 7 It fits, side of second heating device 5 far from circuit board 7 fits with the second protrusion 32.Meanwhile first heating device 4 One surface fits with panel 6, and the first heating device 4 surface opposite with the surface fits with the first protrusion 31.
In this way, the heat that the first heating device 4 generates can directly pass through the first protrusion during electronic device works 81 are transferred on phase transformation temperature-uniforming plate, meanwhile, the heat that the second heating device 5 generates can be directly transferred to by the second protrusion 82 On phase transformation temperature-uniforming plate, effective transmitting of 5 heat of the first heating device 4 and the second heating device is promoted, is further improved scattered Thermal effect.
In a specific embodiment, electronic equipment is notebook computer or tablet computer, at this point, panel 6 is The keyboard and outline border of notebook computer or the display screen and outline border of tablet computer, the first heating device 4 are battery, the Two heating devices 5 are fever electronic device.
Inflation molding phase transformation temperature-uniforming plate or electronic equipment provided by the invention pass through protrusion 3 for traditional structure It directly, is closely bonded with heating device, reduces transmitting thermal resistance, improve heat dissipation performance.
Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff Various changes and amendments can be carried out without departing from the scope of the present invention completely.The technical scope of this invention is not The content being confined on specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.

Claims (10)

1. a kind of inflation forms phase transformation temperature-uniforming plate, it is characterised in that: the inflation molding phase transformation temperature-uniforming plate includes that mutual lid closes First substrate and the second substrate are provided with closed cavity, the first substrate between the first substrate and the second substrate The molding protrusion of blowing-up technology is formed through towards the direction far from the second substrate.
2. inflation as described in claim 1 forms phase transformation temperature-uniforming plate, it is characterised in that: the first substrate and second base It is provided with the first cavity between plate, is provided with the second cavity in the protrusion, first cavity and second cavity are mutual Connection, the closed cavity includes first cavity and second cavity.
3. inflation as claimed in claim 2 forms phase transformation temperature-uniforming plate, it is characterised in that: the protrusion includes the first protrusion and the Two protrusions, first protrusion are located at the same side of the first substrate with second protrusion and have difference in height.
4. inflation as claimed in claim 3 forms phase transformation temperature-uniforming plate, it is characterised in that: the second cavity setting is described the In one protrusion, third cavity is provided in second protrusion, the third cavity and second cavity are interconnected, described Closed cavity further includes the third cavity.
5. inflation as described in claim 1 forms phase transformation temperature-uniforming plate, it is characterised in that: the trapezoidal shape in section of the protrusion, Angle between the side wall and roof of the protrusion is α, 180 ° of 120 °≤α <.
6. inflation as claimed in claim 5 forms phase transformation temperature-uniforming plate, it is characterised in that: between the side wall and roof of the protrusion It is provided with bending part, the bending part is in arc structure, and the radius bend of the bending part is R, and the inflation molding phase transformation is equal Warm plate with a thickness of d, R > 2.5d.
7. inflation as described in claim 1 forms phase transformation temperature-uniforming plate, it is characterised in that: be filled with phase transformation in the closed cavity Working medium is provided with capillary structure in the closed cavity.
8. a kind of processing method of inflation molding phase transformation temperature-uniforming plate, it is characterised in that: be suitable for such as any one of claim 1-7 institute State inflation molding phase transformation temperature-uniforming plate, the processing method the following steps are included:
Step S1: agent is rolled in printing resistance, and agent pattern is rolled in printing resistance on the first substrate;
Step S2: the second substrate is covered on and is printed with resistance and rolls on the first substrate of agent by method hot rolling, and by first substrate and the Two substrates carry out hot rolling and obtain composite plate;
Step S3: pre- inflation opens up fabrication hole in composite plate, is passed through high pressure gas to fabrication hole and carries out inflation, is formed hollow Cavity;
Step S4: composite plate is attached in inflation mold by secondary inflation, and the inflation mold includes the first mold and the second mould Tool, offers limiting slot on any inflation mold, is passed through high pressure gas to fabrication hole and carries out inflation, so that composite plate exists Protrusion is formed under the action of limiting slot.
9. a kind of electronic equipment, it is characterised in that: the electronic equipment includes the described in any item inflation moldings of claim 1-7 Phase transformation temperature-uniforming plate.
10. electronic equipment as claimed in claim 9, it is characterised in that: the electronic equipment further includes panel, circuit board, hair An installation cavity is formed after thermal device and rear cover, the panel and rear cover mutual cooperation connection, the inflation molding phase transformation is equal Warm plate, circuit board and the heating device are installed in the installation cavity, and the heating device fits with the protrusion.
CN201910745033.1A 2019-08-13 2019-08-13 Inflation molding phase-change temperature-equalizing plate, processing method and electronic equipment Active CN110430736B (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110708934A (en) * 2019-10-31 2020-01-17 华为技术有限公司 Temperature equalizing component and electronic equipment
CN111063841A (en) * 2019-12-20 2020-04-24 福建元晟汽车配件科技有限公司 New energy automobile power battery box body bottom plate and single-side blowing process thereof
CN111148411A (en) * 2020-01-15 2020-05-12 常州恒创热管理有限公司 Fin type phase-change heat dissipation plate, machining method thereof and heat dissipation module
WO2021151233A1 (en) * 2020-01-30 2021-08-05 Barco N.V. Cooling sub-assembly

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017113571A1 (en) * 2015-12-31 2017-07-06 浙江嘉熙科技有限公司 Integrated phase-change inhibition heat transfer and heat exchange plate structure and manufacturing method thereof
CN109561640A (en) * 2019-01-14 2019-04-02 常州常发制冷科技有限公司 The finned temperature-uniforming plate of MULTILAYER COMPOSITE and processing method
CN109729700A (en) * 2019-01-14 2019-05-07 常州常发制冷科技有限公司 The processing method of phase transformation temperature-uniforming plate, radiator and the temperature-uniforming plate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017113571A1 (en) * 2015-12-31 2017-07-06 浙江嘉熙科技有限公司 Integrated phase-change inhibition heat transfer and heat exchange plate structure and manufacturing method thereof
CN109561640A (en) * 2019-01-14 2019-04-02 常州常发制冷科技有限公司 The finned temperature-uniforming plate of MULTILAYER COMPOSITE and processing method
CN109729700A (en) * 2019-01-14 2019-05-07 常州常发制冷科技有限公司 The processing method of phase transformation temperature-uniforming plate, radiator and the temperature-uniforming plate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110708934A (en) * 2019-10-31 2020-01-17 华为技术有限公司 Temperature equalizing component and electronic equipment
CN111063841A (en) * 2019-12-20 2020-04-24 福建元晟汽车配件科技有限公司 New energy automobile power battery box body bottom plate and single-side blowing process thereof
CN111148411A (en) * 2020-01-15 2020-05-12 常州恒创热管理有限公司 Fin type phase-change heat dissipation plate, machining method thereof and heat dissipation module
WO2021151233A1 (en) * 2020-01-30 2021-08-05 Barco N.V. Cooling sub-assembly

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Address after: 213176 No.20, Jiandong Road, Lijia Town, Wujin District, Changzhou City, Jiangsu Province

Patentee after: Changzhou Hengchuang Thermal Management System Co.,Ltd.

Country or region after: China

Address before: 213000 No.20, Jiandong Road, Lijia Town, Wujin District, Changzhou City, Jiangsu Province

Patentee before: CHANGZHOU HENGCHUANG HEAT MANAGEMENT Co.,Ltd.

Country or region before: China