JPH029124A - Washing device for semiconductor substrate with water - Google Patents

Abstract

PURPOSE:To strongly wash a semiconductor substrate with water and to eliminate the damage of the substrate by forming an injection port for sucking and diffusing liquid by gas diffusing in a tank for containing the substrate. CONSTITUTION:A gas pipe 5 is disposed on a supporting plate 6 in the bottom of a tank 3, and an injection port 4 is connected to the pipe 5. The port 4 has a gas diffusing hole 7 communicating with the pipe 5 and a liquid suction hole 8 for sucking liquid in the tank 3. When the gas flows in a direction A in the pipe 5 to be throttled in the hole 7 and is diffused, the hole 8 becomes negative pressure. Thus, the liquid therearound flows in a direction B. Mixture gas is injected in a direction C, and gas/liquid mixture is hit to a semiconductor substrate 1. Thus, the substrate 1 is strongly washed with water to eliminate the damage of the substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an integrated circuit manufacturing apparatus, and more particularly to a washing bag for semiconductor substrates.

[Conventional technology]

Conventionally, this type of water washing equipment installed an ultrasonic vibrator at the bottom of the tank and used the vibrating force of the ultrasonic waves to generate bubbles, or made a small hole in the gas pipe and generated gas bubbles from there. Air bubbles were attached to the surface of a semiconductor substrate, and the force of the bubbles being popped was used to wash the semiconductor substrate with water.

[Invention or problem to be solved]

When the above-mentioned conventional water washing device uses ultrasonic waves, #1. It has the disadvantage of increasing the output (damage) by 11, and in the latter case, the size of the gas bubbles is not constant and the force applied is weak, so the effect of washing with water is small.

An object of the present invention is to provide a water washing apparatus for semiconductor substrates that solves the above problems.

[Differences between the invention and the prior art]

The present invention differs from the above-mentioned conventional water washing device in that it is equipped with a spout that sucks the surrounding liquid together with the jet of gas and blows out the liquid at the same time.

[Means to solve the problem]

In order to achieve the above object, the present invention provides an apparatus for cleaning semiconductor substrates, in which a tank housing the semiconductor substrate has a jet port for sucking in and blowing out liquid by blowing out gas into the tank.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG.
FIG. 3 is an enlarged sectional view of the jet nozzle shown in the figure.

In the figure, 2 is a carrier that holds the semiconductor substrate 1, 3 is a tank that accommodates the carrier 2 that holds the semiconductor substrate 1, and a gas pipe 5 is installed on the support plate 6 at the bottom of the WI 3. The spout 4 is connected to the gas pipe 5.

As shown in FIG. 2, the spout 4 includes a gas blow-off hole 7 communicating with the gas pipe 5 and a liquid suction hole 8 that sucks the liquid in the tank 3.
and has.

In the embodiment, a semiconductor substrate 1 is held by a carrier 2 and accommodated in a tank 3. On the other hand, the gas inside the gas pipe 5 is
When the liquid flows in the direction C and is throttled and blown out by the gas blow-off hole 7, the liquid suction hole 8 becomes a negative pressure, so that the surrounding liquid flows in the C direction.

Then, the gas-liquid mixture mixed in the spout 4 is ejected in the direction C, and the gas-liquid mixture is struck against the semiconductor substrate 1 to perform water washing.

〔Effect of the invention〕

As explained above, the present invention blows out a gas-liquid mixture vigorously and hits the semiconductor substrate, so the wafer can be washed more strongly than just the force of bursting bubbles, and it does not use high-frequency vibrations such as ultrasonic waves. This has the effect of not damaging the semiconductor substrate.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention, and FIG. 2 is an enlarged sectional view taken along the line A--A in FIG. 1... Semiconductor substrate 2... Carrier 3...
Tank 4... Outlet 5... Gas piping
6... Support plate 7... Gas blowing hole 8
...Liquid suction hole I-T-conductor Figure 1

Claims (1)

[Claims] (1) An apparatus for cleaning semiconductor substrates, characterized in that a tank housing the semiconductor substrates has a spout for sucking in and blowing out liquid by blowing out gas into the tank.