JPH0289818U - - Google Patents
Info
- Publication number
- JPH0289818U JPH0289818U JP17019688U JP17019688U JPH0289818U JP H0289818 U JPH0289818 U JP H0289818U JP 17019688 U JP17019688 U JP 17019688U JP 17019688 U JP17019688 U JP 17019688U JP H0289818 U JPH0289818 U JP H0289818U
- Authority
- JP
- Japan
- Prior art keywords
- mount component
- surface mount
- view
- showing
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002265 prevention Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案に係る面実装部品の一例を示
す底面図、第２図はその側面図、第３図は実装状
態を示す側面図、第４図はその平面図、第５図は
この考案に係る面実装部品の他の例を示す第１図
と同様な平面図、第６図は面実装部品の一例を示
す斜視図、第７図はその底面図、第８図は実装状
態の一例を示す側面図、第９図はその動作説明に
供する図、第１０図は接着剤を使用したときの実
装状態を示す側面図、第１１図及び第１２図はそ
れぞれの平面図である。
１０……面実装部品、１１……アルミニウム電
解コンデンサ本体、１２，１３……電極、１５…
…モールド体、１５ａ……底面、１７……電極ガ
イド部、２０……プリント基板、２１，２２……
導電パツド、３０……滑り防止手段、３０ａ……
凸部、３０ｂ……凹部。
Fig. 1 is a bottom view showing an example of the surface mount component according to this invention, Fig. 2 is a side view thereof, Fig. 3 is a side view showing the mounted state, Fig. 4 is a plan view thereof, and Fig. 5 is this. A plan view similar to FIG. 1 showing another example of the surface mount component according to the invention, FIG. 6 a perspective view showing an example of the surface mount component, FIG. 7 a bottom view thereof, and FIG. FIG. 9 is a side view showing an example, FIG. 9 is a view for explaining the operation, FIG. 10 is a side view showing a mounting state when adhesive is used, and FIGS. 11 and 12 are respective plan views. 10... Surface mount component, 11... Aluminum electrolytic capacitor body, 12, 13... Electrode, 15...
...Mold body, 15a...Bottom surface, 17...Electrode guide section, 20...Printed circuit board, 21, 22...
Conductive pad, 30...Slip prevention means, 30a...
Convex portion, 30b... recessed portion.
Claims (1)
が導出された面実装部品において、 その下面の一部に面実装部品をプリント基板上
に載置したときの滑り防止手段が設けられてなる
ことを特徴とする面実装部品。[Claims for Utility Model Registration] Slippage when the surface mount component is placed on a printed circuit board on a part of the bottom surface of a surface mount component that has a flat shape and electrodes are led out only on one end surface. A surface mount component characterized by being provided with a prevention means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17019688U JPH0289818U (en) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17019688U JPH0289818U (en) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289818U true JPH0289818U (en) | 1990-07-17 |
Family
ID=31460930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17019688U Pending JPH0289818U (en) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289818U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS631321B2 (en) * | 1978-05-30 | 1988-01-12 | Goodrich Co B F | |
| JPH01238010A (en) * | 1988-03-18 | 1989-09-22 | Nippon Chemicon Corp | Chip type capacitor |
-
1988
- 1988-12-28 JP JP17019688U patent/JPH0289818U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS631321B2 (en) * | 1978-05-30 | 1988-01-12 | Goodrich Co B F | |
| JPH01238010A (en) * | 1988-03-18 | 1989-09-22 | Nippon Chemicon Corp | Chip type capacitor |