JPS63201353U - - Google Patents
Info
- Publication number
- JPS63201353U JPS63201353U JP9218787U JP9218787U JPS63201353U JP S63201353 U JPS63201353 U JP S63201353U JP 9218787 U JP9218787 U JP 9218787U JP 9218787 U JP9218787 U JP 9218787U JP S63201353 U JPS63201353 U JP S63201353U
- Authority
- JP
- Japan
- Prior art keywords
- flat
- lead wire
- lead
- base material
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例を示す斜視図、第
２図は第１図の一部の立面図、第３図は第１図の
一部の側面図、第４図は従来のフラツトパツケー
ジを示す斜視図、第５図は第４図の一部を示す立
面図、第６図は第４図の一部を示す側面図。
１は印刷配線板基材、２はリード取り付けパツ
ド、３は平板状リード、４はフラツトパツケージ
本体、５はハンダ、７はパターン。なお、図中同
一符号は同一または相当部分を示す。
Fig. 1 is a perspective view showing one embodiment of this invention, Fig. 2 is an elevational view of a part of Fig. 1, Fig. 3 is a side view of a part of Fig. 1, and Fig. 4 is a conventional one. FIG. 5 is a perspective view showing a flat package, FIG. 5 is an elevational view showing a part of FIG. 4, and FIG. 6 is a side view showing a part of FIG. 4. 1 is a printed wiring board base material, 2 is a lead attachment pad, 3 is a flat lead, 4 is a flat package body, 5 is solder, and 7 is a pattern. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
線が印刷配線板基材上に設けられたリード取り付
けパツドに接続されるフラツトパツケージにおい
て、上記平板状のリード線は少なくとも上記リー
ド線が対応するパツドに接続される部分に於いて
はその平板の平面が上記リード取り付けパツドの
平面に対し直角な方向に設けられることを特徴と
するフラツトパツケージ。 In a flat package that is mounted on a printed wiring board base material and in which a flat lead wire is connected to a lead attachment pad provided on the printed wiring board base material, the flat lead wire is such that at least the lead wire is A flat package characterized in that, in a portion connected to a corresponding pad, the plane of the flat plate is perpendicular to the plane of the lead attachment pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9218787U JPS63201353U (en) | 1987-06-16 | 1987-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9218787U JPS63201353U (en) | 1987-06-16 | 1987-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201353U true JPS63201353U (en) | 1988-12-26 |
Family
ID=30953664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9218787U Pending JPS63201353U (en) | 1987-06-16 | 1987-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201353U (en) |
-
1987
- 1987-06-16 JP JP9218787U patent/JPS63201353U/ja active Pending