JPH0289394A - Manufacture of electronic circuit board - Google Patents
Manufacture of electronic circuit boardInfo
- Publication number
- JPH0289394A JPH0289394A JP24132988A JP24132988A JPH0289394A JP H0289394 A JPH0289394 A JP H0289394A JP 24132988 A JP24132988 A JP 24132988A JP 24132988 A JP24132988 A JP 24132988A JP H0289394 A JPH0289394 A JP H0289394A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- component
- electronic
- printed wiring
- function module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims abstract description 22
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 238000005476 soldering Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 14
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract 3
- 230000003685 thermal hair damage Effects 0.000 description 3
- 241000272168 Laridae Species 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はビデオテープレコーダー、テレビジョン受像機
、ヌテレオなどの各種映像・音響機器や、コンピュータ
、電話などの情報通信機器に用いられる電子回路基板の
製造方法に関するものである。[Detailed Description of the Invention] Industrial Field of Application The present invention is directed to the manufacture of electronic circuit boards used in various video and audio equipment such as video tape recorders, television receivers, and Nuteleo, as well as information communication equipment such as computers and telephones. It is about the method.
従来の技術
近年、電子機器の小型・軽量化・高性能化要求は富にそ
の厳しさを増し、それらの構成要素である電子部品、プ
リント配線基板についても同様の状況であり、それら要
求を達成すべく様々な揮類・形態のものが提案され、実
用化の領域に達している。プリント配線基板においては
、メツキ技術を用いたスルーホールを有する両面配線導
体構成のものが一般化しており、それらと面実装電子部
品とを組合せた構造の電子回路基板が、電子機器の軽薄
短小化に多大に貢献しヤいるものである。Conventional technology In recent years, the demands for smaller, lighter weight, and higher performance electronic devices have become increasingly strict, and the same is true for the electronic components and printed wiring boards that make up these devices. A variety of volatile compounds and forms have been proposed and have reached the point of practical application. For printed wiring boards, double-sided wiring conductor structures with through holes using plating technology have become commonplace, and electronic circuit boards with a structure that combines these with surface-mounted electronic components are making electronic devices lighter, thinner, and smaller. It has contributed greatly to the
従来の電子回路基板においては、第２図に示すようにス
ルーホール２を有し、両面に配線導体３ａ。A conventional electronic circuit board has a through hole 2 as shown in FIG. 2, and wiring conductors 3a on both sides.
３ｂを有するプリント配線基板１の上にチップ状の面実
装電子部品４ａ、４ｂ、リード付きディスクリート電子
部品５、ハイブリッドＩＣに代表されるようなたとえば
リードスルー型の回路機能モジュール６などを配設した
基本構造をなしているものである。これら従来の電子回
路基板１２の製造方法については、まずプリント配線基
板１の一方の載置面１ａの部品接続部位７ａにペースト
状の半田部材８を供給し面実装電子部品４ａを搭載した
後、プリント配線基板１を全体加熱、いわゆる半田リフ
ローをすることによって、半田部材８を溶融させ面実装
電子部品４ａとプリント配線基板１とを電気的に接続固
定する。次にディスクリート電子部品５やリードスルー
型の回路機能モジュール６のリード端子５ａ 、６ａを
所定のスルーホー／Ｌ’９．１０に沿って挿入する。最
後に、プリント配線基板１のもう一方の載置面１ｂの部
品搭載部位７ｂに接着剤１１を塗布し、面実装電子部品
４ｂを固着させ、通常の半田フローによって、プリント
配線基板１と面実装電子部品４ｂ、！：ヘディスクリー
ト部品６およびリードスルー型の回路機能モジュール６
との電気的接続を完了させ、重子回路基板１２を得るこ
ととなる。Chip-shaped surface-mount electronic components 4a, 4b, leaded discrete electronic components 5, and, for example, a lead-through type circuit function module 6 such as a hybrid IC are arranged on a printed wiring board 1 having a circuit board 3b. It forms the basic structure. Regarding the manufacturing method of these conventional electronic circuit boards 12, first, a paste-like solder member 8 is supplied to the component connection area 7a on one mounting surface 1a of the printed wiring board 1, and after mounting the surface-mounted electronic component 4a, By heating the entire printed wiring board 1, ie, performing so-called solder reflow, the solder member 8 is melted and the surface-mounted electronic component 4a and the printed wiring board 1 are electrically connected and fixed. Next, the lead terminals 5a and 6a of the discrete electronic component 5 and the lead-through type circuit function module 6 are inserted along the predetermined through hole /L'9.10. Finally, adhesive 11 is applied to the component mounting area 7b of the other mounting surface 1b of the printed wiring board 1 to fix the surface-mounted electronic component 4b, and the surface-mounted electronic component 4b is bonded to the printed wiring board 1 using a normal soldering flow. Electronic parts 4b! : Hediscrete component 6 and lead-through type circuit function module 6
By completing the electrical connection with the multiplex circuit board 12, the multiplex circuit board 12 is obtained.
発明が解決しようとする課題
一方、電子回路基板の高密度化対応のため、電子部品の
面実装構造化が進む中で、回路機能モジュールもその例
外ではなく、様々な形、態のものが提案されている。具
体的には、リード形状が、ガルウィングタイプや、■ベ
ンドタイプのものが実用化されつつある。それら面実装
構造の回路機能モジュールを従来の製造プロセスに従っ
て実装するとすれば、それらを半田リフロー面に載置し
、チップ状面実装電子部品と同一工程で半田付けするこ
ととなる。それら加熱方法は全体加熱であることから、
回路機能モジュールに内蔵されている電子部品１３や接
続部の熱的損傷や脱落９回路機能モジュール直下の配設
電子部品１４の熱量不足による接続不具合等の問題点を
有していた。Problems to be Solved by the Invention On the other hand, as surface-mounted structures of electronic components are progressing in order to cope with the increasing density of electronic circuit boards, circuit function modules are no exception, and various shapes and configurations have been proposed. has been done. Specifically, lead shapes such as gull wing type and ■bend type are being put into practical use. If these surface-mounted circuit function modules were to be mounted according to the conventional manufacturing process, they would be placed on a solder reflow surface and soldered in the same process as chip-shaped surface-mounted electronic components. Since these heating methods are whole heating,
There have been problems such as thermal damage to the electronic components 13 built into the circuit function module and connection parts, and connection failures due to insufficient heat in the electronic components 14 disposed directly under the missing circuit function module.
課題を解決するための手段
本発明はかかる点を解決するため、面実装構造の回路機
能モジュールのプリント基板への取付けを新たに局部的
な加熱処理方法とし、それら工程を独立させるとともに
面実装部品のりフロー半田付けする工程とディスクリー
ト電子部号のリード挿入工程との間に組み込んで電子回
路基板を製造するようにしたものである。Means for Solving the Problems In order to solve the above problems, the present invention adopts a new local heat treatment method for attaching a circuit function module with a surface mount structure to a printed circuit board, makes these processes independent, and makes surface mount components The electronic circuit board is manufactured by being incorporated between the glue flow soldering process and the discrete electronic component lead insertion process.
作 用
これにより、面実装構造の回路機能モジュールに対し、
熱的損傷や、電子部品の脱落、半田の接続不具合等の問
題を発生させることなく、プリント配線基板への取付け
を完了することが可能となる。Effect: As a result, for circuit function modules with surface mount structure,
It becomes possible to complete the attachment to the printed wiring board without causing problems such as thermal damage, falling off of electronic components, and failure of solder connections.
実施例 以下、本発明の一実施例を図面にもとづいて説明する。Example Hereinafter, one embodiment of the present invention will be described based on the drawings.
第１図において１は基材がアルミナ、ガラスエポキシ、
アルミニウムなどからなる無機系、有機系。In Figure 1, 1 has a base material of alumina, glass epoxy,
Inorganic and organic types made of aluminum, etc.
金属系の内、いずれかのプリント配線基板であり、その
両面に銅箔などの配線導体ｓａ、ｓｂそれらを電気的に
接続しているスルーホール２が形成しである。It is a printed wiring board made of metal, and has through holes 2 formed on both sides thereof to electrically connect wiring conductors sa, sb such as copper foil.
まず、プリント配線基板１の一方の載置面配線導体１ａ
の所定の接続部位７ａにペースト状の半田部材８を、た
とえばスクリーン印刷方法によって供給し、その上にチ
ップ状の面実装電子部品４ａを搭載し、プリント配線基
板１を全体加熱処理である半田リフローすることにより
、半田部材８を溶融させ、面実装部品４ａとプリント配
線基板１とを電気的に接続固定する。First, one mounting surface wiring conductor 1a of the printed wiring board 1
A paste-like solder member 8 is supplied to a predetermined connection portion 7a of the board 1 by, for example, a screen printing method, a chip-shaped surface-mounted electronic component 4a is mounted thereon, and the printed wiring board 1 is subjected to solder reflow, which is an entire heating process. By doing so, the solder member 8 is melted and the surface mount component 4a and the printed wiring board 1 are electrically connected and fixed.
次に同一載置面１ａの配線導体３Ｃの所定の接続部位７
Ｃにこれもペースト状の半田部材を、吐出や転写方式に
よって供給し、その上にたとえばガルウィングタイプの
面実装構造を有する回路機能モジュール１５を載置する
。そして、たとえば赤外線やレーザなどの光ビームやホ
ットエアなどの非接触加熱方式によって、接続部位子Ｃ
を集中的に局所加熱し、その上の半田部材のみを溶融さ
せ、回路機能モジュー）ｖ１５とプリント配線基板１と
を電気的に接続固定する。Next, a predetermined connection portion 7 of the wiring conductor 3C on the same mounting surface 1a
A paste-like solder member is also supplied to C by a discharge or transfer method, and a circuit function module 15 having, for example, a gull wing type surface mount structure is placed thereon. Then, the connection part C is heated using a non-contact heating method such as a light beam such as infrared rays or a laser or hot air.
is intensively locally heated to melt only the solder material thereon, thereby electrically connecting and fixing the circuit function module (v15) and the printed wiring board 1.
さらに、同一載置面１ａよりディスクリート電子部品５
のリード端子６ａを所定のヌ／レーホール９に沿って挿
入する。Furthermore, the discrete electronic component 5 is placed on the same mounting surface 1a.
Insert the lead terminal 6a along the predetermined hole 9.
最後にプリント配線基板１のもう一方の載置面１ｂの部
品搭載部位７ｂに接着剤１１を塗布し、面実装電子部品
４ｂを固着させ、通常の半田フローによってプリント配
線基板１と面実装部品４ｂおよびディスクリート部品５
との電気的接続を一括的に完了させ、本発明に示す電子
回路基板１２を得るものである。他方、面実装構造を有
する回路機能モジュールを局部的な加熱処理によって半
田付けする工程をリード付きディスクリート電子部品の
挿入工程後に組み込むことも考えられるが、ディスクリ
ート電子部品の高背性、低耐熱性などの特性から上記回
路機能モジュールの接続部位の近傍には実質上配置でき
ず、結果として電子回路基板が大きくなり良好な方法と
はいえない。Finally, adhesive 11 is applied to the component mounting area 7b on the other mounting surface 1b of the printed wiring board 1, the surface mount electronic component 4b is fixed, and the printed wiring board 1 and the surface mount component 4b are bonded together by a normal soldering flow. and discrete parts 5
The electronic circuit board 12 according to the present invention is obtained by completing the electrical connection with the electronic circuit board 12 at once. On the other hand, it may be possible to incorporate a process of soldering a circuit function module having a surface mount structure through local heat treatment after the process of inserting leaded discrete electronic components, but this may be due to the high height, low heat resistance, etc. of discrete electronic components. Due to these characteristics, it is virtually impossible to arrange the electronic circuit board near the connecting portion of the circuit function module, and as a result, the electronic circuit board becomes large, which is not a good method.
発明の効果
本発明の製造方法によって得られる電子回路基板は、回
路機能モジュールの半田付けの際の熱的損傷や内蔵電子
部品の脱落もなく、直下の面実装電子部品の半田付は不
具合等の問題も発生させないことから、高信頼性を確保
できるものである。Effects of the Invention The electronic circuit board obtained by the manufacturing method of the present invention has no thermal damage or falling-off of built-in electronic components during soldering of circuit function modules, and no defects such as soldering of surface-mounted electronic components directly below. Since no problems occur, high reliability can be ensured.
また搭載電子部品に対する配置上の設計制約もなく、小
型・軽量化を実現できる電子回路基板の合理的な製造方
法を提供でき、工業上極めて有益である。Furthermore, there is no design restriction on the arrangement of mounted electronic components, and it is possible to provide a rational manufacturing method for electronic circuit boards that can be made smaller and lighter, which is extremely useful industrially.
第１図は本発明の一実施例における電子回路基板の製造
方法を示す一部切欠き斜視図、第２図は従来の電子回路
基板の製造方法を示す一部切欠き斜視図である。
１・・・・・・プリント配線基板、１ａ、１ｂ・・・・
・載置面、２，９．１ｏ・・・・・・スルーホール、３
ａ、３ｂ。
３Ｃ・・・・・・配線導体、４ａ、４ｂ・・・・・・面
実装電子部品、５・・・・・・ディスクリート電子部品
、６ａ・・・・・・リード端子、６・・・・・・リード
スルー型回路機能モジュール、６ａ・・・・・・リード
端子、７ａ 、７ｂ 、７ｃ・・・・・・接続部位、８
・・・・・・半田部材、１１・・・・・接着剤、１２・
・・・・・電子回路基板、１３・・・・・・内蔵電子部
品、１４・・・・・・直下配設電子部品、１５・・・・
・・面実装型回路機能モジュール。FIG. 1 is a partially cutaway perspective view showing a method for manufacturing an electronic circuit board according to an embodiment of the present invention, and FIG. 2 is a partially cutaway perspective view showing a conventional method for manufacturing an electronic circuit board. 1...Printed wiring board, 1a, 1b...
・Placement surface, 2,9.1o...Through hole, 3
a, 3b. 3C...Wiring conductor, 4a, 4b...Surface mount electronic component, 5...Discrete electronic component, 6a...Lead terminal, 6... ...Lead-through type circuit function module, 6a...Lead terminal, 7a, 7b, 7c...Connection part, 8
...Solder component, 11..Adhesive, 12.
...Electronic circuit board, 13...Built-in electronic components, 14...Electronic components disposed directly below, 15...
...Surface-mounted circuit function module.
Claims (2)
に面実装電子部品を搭載して半田付けする工程と、前記
載置面Ａの配線導体上に面実装型の回路機能モジュール
を搭載し、局部的な加熱処理によって半田付けする工程
と、前記載置面Ａよりリード付きディスクリート電子部
品を貫通孔に挿入する工程と、他方の載置面Ｂの配線導
体上に面実装電子部品を搭載して半田付けする工程から
なる電子回路基板の製造方法。(1) A process of mounting and soldering surface-mounted electronic components on the wiring conductor on one mounting surface A of the printed wiring board, and mounting a surface-mounted circuit function module on the wiring conductor on the mounting surface A. A process of mounting and soldering by local heat treatment, a process of inserting the leaded discrete electronic component into the through hole from the mounting surface A, and a step of inserting the surface-mounted electronic component onto the wiring conductor on the other mounting surface B. A method of manufacturing an electronic circuit board, which includes the steps of mounting and soldering.
法として、光ビーム，ホットエアなどの非接触方式を用
いる請求項１記載の電子回路基板の製造方法。(2) The method of manufacturing an electronic circuit board according to claim 1, wherein a non-contact method such as a light beam or hot air is used as the local heat treatment method for the circuit function module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24132988A JPH0289394A (en) | 1988-09-27 | 1988-09-27 | Manufacture of electronic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24132988A JPH0289394A (en) | 1988-09-27 | 1988-09-27 | Manufacture of electronic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289394A true JPH0289394A (en) | 1990-03-29 |
Family
ID=17072678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24132988A Pending JPH0289394A (en) | 1988-09-27 | 1988-09-27 | Manufacture of electronic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289394A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100389113B1 (en) * | 2001-06-21 | 2003-06-25 | 주식회사 태화인서트 | Device Adhering Method for FPCB |
-
1988
- 1988-09-27 JP JP24132988A patent/JPH0289394A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100389113B1 (en) * | 2001-06-21 | 2003-06-25 | 주식회사 태화인서트 | Device Adhering Method for FPCB |
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