JPH0289388A - Flexible printed board - Google Patents
Flexible printed boardInfo
- Publication number
- JPH0289388A JPH0289388A JP24166388A JP24166388A JPH0289388A JP H0289388 A JPH0289388 A JP H0289388A JP 24166388 A JP24166388 A JP 24166388A JP 24166388 A JP24166388 A JP 24166388A JP H0289388 A JPH0289388 A JP H0289388A
- Authority
- JP
- Japan
- Prior art keywords
- base film
- connection
- flux
- flexible printed
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims abstract description 15
- 239000010408 film Substances 0.000 abstract description 24
- 230000004907 flux Effects 0.000 abstract description 15
- 238000004140 cleaning Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 8
- 239000013039 cover film Substances 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はフレキシブルプリント基板に関し、特に半田付
は接続時に生じるフラックス等を容易に除去できるプリ
ント基板の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a flexible printed circuit board, and particularly to a structure of a printed circuit board in which flux and the like generated during soldering can be easily removed.
［従来の技術］
フレキシブルプリント基板（ＦＰＣ）は、可視性のある
絶縁フィルム上に銅箔等により回路を形成したもので、
曲面や段差のある面への回路設置が可能であり、また、
ハードプリント基板間の回路接続に多用されている。[Prior art] A flexible printed circuit board (FPC) is a circuit formed with copper foil or the like on a visible insulating film.
It is possible to install circuits on curved or stepped surfaces, and
It is often used for circuit connections between hard printed boards.
一方、表示器等の電気機器には、従来、内部回路との接
続用にリード電極を突出せしめてあり、これを第９図に
示す。図において、偏平な直方体状の表示器２には側面
に複数のリード電極２２が突出せしめてあり、これに接
続電極１３を形成したＦＰＣＩを半田付は接続している
。On the other hand, electrical devices such as displays have conventionally been provided with protruding lead electrodes for connection with internal circuits, as shown in FIG. In the figure, a flat rectangular parallelepiped display 2 has a plurality of lead electrodes 22 protruding from its side surfaces, to which an FPCI having a connecting electrode 13 formed is connected by soldering.
この半田付けにはフラックスを使用するが、過剰なフラ
ックスや半田粒が接続電極１３間のフィルム面に付着し
て残るため、接続工程終了後に洗浄除去している。Although flux is used for this soldering, excess flux and solder particles adhere to and remain on the film surface between the connection electrodes 13, so they are washed and removed after the connection process is completed.
ところで、近年は、表示器等の低コスト化および小形化
の要請より、リード電極を設けず、第６図に示す如く、
ケースの一部に設けた接続面２ａ上に内部回路に導通す
る端子電極２１を形成して、これに上記ＦＰＣＩを接続
することが行われつつある。これを第７図および第８図
で説明すると、ＦＰＣＩは、可撓性を有するベースフィ
ルム１１上に平行帯状に接続電極１３を多数形成し、接
続電極１３は両端部を除いてカバーフィルム１２で覆っ
である。そして、露出する接続電極１３の一端部１３１
を上記端子電極２１に半田付は接続する。By the way, in recent years, due to the demand for lower cost and smaller size of displays, etc., lead electrodes are not provided, and as shown in Fig. 6,
A terminal electrode 21 that is electrically connected to an internal circuit is formed on a connection surface 2a provided in a part of a case, and the above-mentioned FPCI is connected to this terminal electrode 21. To explain this with reference to FIGS. 7 and 8, in FPCI, a large number of connection electrodes 13 are formed in parallel strips on a flexible base film 11, and the connection electrodes 13 are covered with a cover film 12 except for both ends. It's covered. One end 131 of the connection electrode 13 is exposed.
is connected to the terminal electrode 21 by soldering.
なお、実公昭５５−４１１６１号公報には、接続電極端
部に対応するベースフィルム裏面に耐半田付は特性を有
する耐熱性プラスチックフィルムを貼着したＦＰＣが開
示されている。Incidentally, Japanese Utility Model Publication No. 55-41161 discloses an FPC in which a heat-resistant plastic film having soldering resistance is adhered to the back surface of the base film corresponding to the end of the connecting electrode.
［発明が解決しようとする課題］
ところで、かかる半田付けｉ程においては、接続電極端
部１３１間のベースフィルム１１面と接続面２ａとの間
に余剰のフラックスＲ（第７図）等が残るが、これらの
完全な洗浄除去は両側を上記ベースフィルム面と接続面
に挟まれていることにより困難であり、マイグレーショ
ン等の原因となっていた。[Problems to be Solved by the Invention] Incidentally, during the soldering step i, surplus flux R (see FIG. 7) remains between the base film 11 surface between the connection electrode ends 131 and the connection surface 2a. However, it is difficult to completely wash and remove these because both sides are sandwiched between the base film surface and the connecting surface, which causes migration and the like.
本発明はかかる問題点を解決するもので、フラックス等
の除去を容易になし得るフレキシブルプリント基板を提
供することを目的とする。The present invention solves this problem, and aims to provide a flexible printed circuit board from which flux and the like can be easily removed.
［課題を解決するための手段］
本発明の構成を第１図で説明すると、電気機器２に設け
た接続面２ａ上に間隔をおいて形成した複数の端子電極
２１に、可視性を有するベースフィルム１１上に間隔を
おいて形成した複数の接続電極１３の端部１３１をそれ
ぞれ半田接続するフレキシブルプリント基板１において
、上記接続電極１３の端部１３１間には上記ベースフィ
ルム１１を設けていない。[Means for Solving the Problems] The configuration of the present invention will be explained with reference to FIG. In the flexible printed circuit board 1 in which the ends 131 of a plurality of connection electrodes 13 formed at intervals on the film 11 are connected by soldering, the base film 11 is not provided between the ends 131 of the connection electrodes 13.
［作用］
上記構成のプリント基板においては、端部１３１間にベ
ースフィルム１１が無いから、上記端部１３１間にある
接続面２ａは露出しており、半田接続時に上記接続面２
ａ上に残るフラックス等に洗浄液が直接作用して、これ
を完全かつ速やかに除去する。[Function] In the printed circuit board having the above configuration, since there is no base film 11 between the end portions 131, the connection surface 2a between the end portions 131 is exposed, and the connection surface 2a is exposed during soldering.
The cleaning liquid acts directly on the flux etc. remaining on a, completely and quickly removing it.
［第１実施例コ
第１図において、表示面を上に向けた偏平な直方体状の
表示器２は、ガラス板製のケース下半部を側方へ突出せ
しめて接続部２３となし、その上面は接続面２ａとなっ
ている。上記接続面２ａには表示器２の内部回路に導通
する銀薄膜の帯状端子電極２１が多数平行に形成しであ
る。[First Embodiment] In FIG. 1, the flat rectangular parallelepiped-shaped display 2 with the display surface facing upward has a lower half of the case made of a glass plate that protrudes laterally to form a connecting portion 23; The upper surface is a connection surface 2a. On the connection surface 2a, a large number of strip-shaped terminal electrodes 21 made of a thin silver film are formed in parallel and conductive to the internal circuit of the display device 2.
上記表示器２には側方よりフレキシブルプリント基板（
ＦＰＣ）１が至り、その一端が上記接続部２３に接続さ
れている。ＦＰＣＩの構造を第２図および第３図で詳述
すると、１１はベースフィルムで、ポリエステルあるい
はポリイミド等の可撓性のある絶縁性樹脂フィルムより
なり、該ベースフィルム１１上には等間隔で平行に多数
の帯状接続電極１３が形成しである。これら接続電極１
３は、上記ベースフィルム１１上に一面に形成した銅箔
をエツチングすることにより形成される。The above display unit 2 is equipped with a flexible printed circuit board (
FPC) 1 is connected, and one end thereof is connected to the connection portion 23. The structure of FPCI is explained in detail in FIGS. 2 and 3. Reference numeral 11 denotes a base film made of a flexible insulating resin film such as polyester or polyimide. A large number of strip-shaped connection electrodes 13 are formed on the surface. These connection electrodes 1
3 is formed by etching a copper foil formed all over the base film 11.
この接続電極１３を形成したベースフィルム面は、両端
部を除いて絶縁性のカバーフィルム１２で覆っである。The base film surface on which the connection electrode 13 is formed is covered with an insulating cover film 12 except for both ends.
上記ベースフィルム１１は、上記接続電極１３の一方の
端部１３１において、これら端部１３１間をカバーフィ
ルム１２の端縁に至る位置まで切り欠いである（図中１
１１）。The base film 11 has a notch at one end 131 of the connection electrode 13 between these ends 131 to a position reaching the edge of the cover film 12 (see 1 in the figure).
11).
かかる構造のＦＰＣは、ベースフィルム１１を上面側に
して、上記各接続電極１３の端部１３１をそれぞれ上記
端子電極２１に半田付は接続する。In the FPC having such a structure, the end portions 131 of each of the connection electrodes 13 are connected to the terminal electrodes 21 by soldering, with the base film 11 facing upward.
この半田工程において、余剰のフラックスあるいは半田
粒が上記端部１３１間の接続面２ａ上に残留する。In this soldering process, excess flux or solder particles remain on the connecting surface 2a between the ends 131.
ここにおいて、本実施例においては、上記端部１３１間
はベースフィルム１１を切り欠いであることにより、フ
ラックス等が存在する接続面２ａは外部に露出しており
、したがって、洗浄工程において、洗浄液が直接作用し
てこれらを速やかかつ完全に除去する。Here, in this embodiment, the base film 11 is cut out between the ends 131, so that the connection surface 2a where flux etc. is present is exposed to the outside, so that the cleaning liquid is not removed in the cleaning process. Direct action removes them quickly and completely.
［第２実施例］
第４図および第５図には本発明の第２実施例におけるＦ
ＰＣを示す。図において、ベースフィルム１１には、各
接続電極１３の端部１３１間に、電極縁に沿った平行部
を有する長穴１１２が設けである。[Second Embodiment] FIGS. 4 and 5 show F in the second embodiment of the present invention.
Shows a PC. In the figure, the base film 11 is provided with a long hole 112 having a parallel portion along the electrode edge between the ends 131 of each connection electrode 13.
かかる構造によれば、半田工程の余剰フラックス等が残
留する接続面２ａは、上記長穴１１２を介して外部に露
出し、洗浄工程における洗浄液が良好に作用して、速や
かなフラックス除去がなされる。According to this structure, the connecting surface 2a on which surplus flux from the soldering process remains is exposed to the outside through the elongated hole 112, and the cleaning liquid in the cleaning process works well to quickly remove the flux. .
［発明の効果コ
以上の如く、本発明のフレキシブルプリント基板におい
ては、半田付けされる接続電極の端部間にベースフィル
ムを設けていないから、半田付は時の余剰フラックス等
が残留する接続面は外部へ露出し、洗浄液の直接作用に
より上記フラックス等は完全かつ速やかに除去される。[Effects of the Invention] As described above, in the flexible printed circuit board of the present invention, since a base film is not provided between the ends of the connection electrodes to be soldered, the soldering process does not involve the connection surface where excess flux remains. is exposed to the outside, and the above-mentioned flux and the like are completely and quickly removed by the direct action of the cleaning solution.
しかして、マイグレーション等の不具合を生じることな
く、電気機器の端子電極にフレキシブルプリント基板を
半田接続することが可能であり、電気機器の低コスト化
とコンパクト化を図ることができる。Therefore, it is possible to solder connect the flexible printed circuit board to the terminal electrode of an electrical device without causing problems such as migration, and it is possible to reduce the cost and size of the electrical device.
第１図ないし第３図は本発明の第１実施例を示し、第１
図は表示器にフレキシブルプリント基板を接続した斜視
図、第２図はフレキシブルプリント基板の平面図、第３
図は第２図の■−■線に沿う断面図、第４図および第５
図は本発明の第２実施例を示し、第４図はフレキシブル
プリント基板の平面図、第５図はその断面図で、第４図
のＶ−Ｖ線に沿う断面図、第６図ないし第８図は従来例
を示し、第６図は表示器にフレキシブルプリント基板を
接続した斜視図、第７図はその平面図、第８図はその部
分断面側面図で、断面部は第７図の■−■線に沿うもの
、第９図は他の従来例を示す、表示器にフレキシブルプ
リント基板を接続した斜視図である。
１・・・フレキシブルプリント基板
１１・・・ベースフィルム
１１１・・・切欠き
１１２・・・長穴
１２・・・カバーフィルム
１３・・・接続電極
１３１・・・端部
２・・・表示器（電気機器）
２ａ・・・接続面
第１図
第４図
第５図
−■
第７図
第６図
第８図
第９図1 to 3 show a first embodiment of the present invention.
The figure is a perspective view of the flexible printed circuit board connected to the display, the second figure is a plan view of the flexible printed circuit board, and the third figure is a plan view of the flexible printed circuit board.
The figure is a sectional view taken along the line ■-■ of Figure 2, Figures 4 and 5.
The figures show a second embodiment of the present invention, FIG. 4 is a plan view of the flexible printed circuit board, FIG. 5 is a sectional view thereof, and FIGS. FIG. 8 shows a conventional example, FIG. 6 is a perspective view of a flexible printed circuit board connected to a display, FIG. 7 is a plan view thereof, and FIG. FIG. 9, taken along line 1--2, is a perspective view showing another conventional example in which a flexible printed circuit board is connected to a display. 1... Flexible printed circuit board 11... Base film 111... Notch 112... Elongated hole 12... Cover film 13... Connection electrode 131... End 2... Indicator ( Electrical equipment) 2a... Connection surface Fig. 1 Fig. 4 Fig. 5 - ■ Fig. 7 Fig. 6 Fig. 8 Fig. 9
Claims (1)
数の端子電極に、可撓性を有するベースフィルム上に間
隔をおいて形成した複数の接続電極の端部をそれぞれ半
田接続するフレキシブルプリント基板において、上記接
続電極の端部間に上記ベースフィルムを設けないことを
特徴とするフレキシブルプリント基板。A flexible print that connects the ends of a plurality of connection electrodes formed at intervals on a flexible base film by soldering to a plurality of terminal electrodes formed at intervals on a connection surface of an electrical device. A flexible printed circuit board, characterized in that the base film is not provided between the ends of the connection electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24166388A JPH0289388A (en) | 1988-09-27 | 1988-09-27 | Flexible printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24166388A JPH0289388A (en) | 1988-09-27 | 1988-09-27 | Flexible printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289388A true JPH0289388A (en) | 1990-03-29 |
Family
ID=17077669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24166388A Pending JPH0289388A (en) | 1988-09-27 | 1988-09-27 | Flexible printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289388A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5219293A (en) * | 1991-07-03 | 1993-06-15 | Rohm Co., Ltd. | Connection structure of circuit boards having electronic parts thereon and flexible cable for coupling the circuit boards and connection method using the same |
-
1988
- 1988-09-27 JP JP24166388A patent/JPH0289388A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5219293A (en) * | 1991-07-03 | 1993-06-15 | Rohm Co., Ltd. | Connection structure of circuit boards having electronic parts thereon and flexible cable for coupling the circuit boards and connection method using the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR860000188B1 (en) | Process for manufacturing printed circuits | |
| JPH0513913A (en) | Flexible cable connecting device for circuit substrate | |
| JP2001339016A (en) | Surface mounting electronic circuit unit | |
| JPS60111068U (en) | flexible printed circuit board | |
| JPH06216487A (en) | Connecting terminal part of flexible pattern | |
| JPH0289388A (en) | Flexible printed board | |
| JP2512828B2 (en) | Chip component mounting method | |
| JP2570336B2 (en) | Hybrid integrated circuit device | |
| JPH02134890A (en) | Circuit element mounting board | |
| JPS59154778U (en) | Inter-electrode connection device | |
| JPH09318965A (en) | Liquid crystal display device | |
| JPH0419710A (en) | Liquid crystal display device | |
| JPH0378793B2 (en) | ||
| JP2641912B2 (en) | Lattice array type semiconductor device package | |
| JPS609273B2 (en) | display device | |
| JP3409380B2 (en) | Printed circuit board device | |
| JPS62208691A (en) | Double-sided mounting hybrid integrated circuit | |
| JPS6328449Y2 (en) | ||
| JP2000124587A (en) | Fitting method and fitting structure of electronic circuit unit to printed board | |
| JPS6032785Y2 (en) | Electrical component mounting equipment | |
| JPH0815717A (en) | Liquid crystal display device | |
| JPH01251788A (en) | Printed board | |
| JPH02273725A (en) | Connecting structure for liquid crystal display element | |
| JPS5827554Y2 (en) | surface acoustic wave device | |
| JPS6339732Y2 (en) |