JPH0288661A - Aromatic resin composition - Google Patents
Aromatic resin compositionInfo
- Publication number
- JPH0288661A JPH0288661A JP24124688A JP24124688A JPH0288661A JP H0288661 A JPH0288661 A JP H0288661A JP 24124688 A JP24124688 A JP 24124688A JP 24124688 A JP24124688 A JP 24124688A JP H0288661 A JPH0288661 A JP H0288661A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pts
- acid
- aromatic
- elastomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000003118 aryl group Chemical group 0.000 title claims abstract description 38
- 239000011342 resin composition Substances 0.000 title claims abstract description 17
- 229920001971 elastomer Polymers 0.000 claims abstract description 48
- 239000000806 elastomer Substances 0.000 claims abstract description 45
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 239000011347 resin Substances 0.000 claims abstract description 43
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 16
- 239000004721 Polyphenylene oxide Substances 0.000 abstract description 9
- 229920001225 polyester resin Polymers 0.000 abstract description 9
- 239000004645 polyester resin Substances 0.000 abstract description 9
- 238000004898 kneading Methods 0.000 abstract description 8
- 229920006380 polyphenylene oxide Polymers 0.000 abstract description 8
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 abstract description 6
- 239000000203 mixture Substances 0.000 abstract description 6
- 229920002647 polyamide Polymers 0.000 abstract description 6
- 239000004952 Polyamide Substances 0.000 abstract description 5
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- 229920002292 Nylon 6 Polymers 0.000 abstract description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 abstract description 4
- 229920002302 Nylon 6,6 Polymers 0.000 abstract description 3
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- FWMKRQWPQVEBLZ-UHFFFAOYSA-N 1-(benzotriazol-1-yl)prop-2-en-1-one Chemical compound C1=CC=C2N(C(=O)C=C)N=NC2=C1 FWMKRQWPQVEBLZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- -1 P-xylene diol Chemical class 0.000 description 27
- 239000003607 modifier Substances 0.000 description 16
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 15
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 239000002253 acid Substances 0.000 description 12
- 239000000835 fiber Substances 0.000 description 12
- 229920001577 copolymer Polymers 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 229920000728 polyester Polymers 0.000 description 9
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 150000008064 anhydrides Chemical class 0.000 description 5
- 229920001400 block copolymer Polymers 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000012763 reinforcing filler Substances 0.000 description 4
- 239000012779 reinforcing material Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- UFMBOFGKHIXOTA-UHFFFAOYSA-N 2-methylterephthalic acid Chemical compound CC1=CC(C(O)=O)=CC=C1C(O)=O UFMBOFGKHIXOTA-UHFFFAOYSA-N 0.000 description 3
- 229930182556 Polyacetal Natural products 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 229920000554 ionomer Polymers 0.000 description 3
- 150000003951 lactams Chemical class 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 229920002492 poly(sulfone) Polymers 0.000 description 3
- 229920006324 polyoxymethylene Polymers 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 229920006132 styrene block copolymer Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- FQXGHZNSUOHCLO-UHFFFAOYSA-N 2,2,4,4-tetramethyl-1,3-cyclobutanediol Chemical compound CC1(C)C(O)C(C)(C)C1O FQXGHZNSUOHCLO-UHFFFAOYSA-N 0.000 description 2
- MMINFSMURORWKH-UHFFFAOYSA-N 3,6-dioxabicyclo[6.2.2]dodeca-1(10),8,11-triene-2,7-dione Chemical compound O=C1OCCOC(=O)C2=CC=C1C=C2 MMINFSMURORWKH-UHFFFAOYSA-N 0.000 description 2
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 239000004709 Chlorinated polyethylene Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920000571 Nylon 11 Polymers 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001413 amino acids Chemical class 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- ZQLLZRMFLUBGGW-UHFFFAOYSA-N 1-(2h-benzotriazol-4-yl)-2-methylprop-2-en-1-one Chemical compound CC(=C)C(=O)C1=CC=CC2=C1N=NN2 ZQLLZRMFLUBGGW-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- PPWUTZVGSFPZOC-UHFFFAOYSA-N 1-methyl-2,3,3a,4-tetrahydro-1h-indene Chemical compound C1C=CC=C2C(C)CCC21 PPWUTZVGSFPZOC-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- RYPKRALMXUUNKS-UHFFFAOYSA-N 2-Hexene Natural products CCCC=CC RYPKRALMXUUNKS-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- ZPXGNBIFHQKREO-UHFFFAOYSA-N 2-chloroterephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(Cl)=C1 ZPXGNBIFHQKREO-UHFFFAOYSA-N 0.000 description 1
- ZKFOEDSYSPDTEB-UHFFFAOYSA-N 2-prop-2-enoyloxybenzoic acid Chemical compound OC(=O)C1=CC=CC=C1OC(=O)C=C ZKFOEDSYSPDTEB-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- WSQZNZLOZXSBHA-UHFFFAOYSA-N 3,8-dioxabicyclo[8.2.2]tetradeca-1(12),10,13-triene-2,9-dione Chemical compound O=C1OCCCCOC(=O)C2=CC=C1C=C2 WSQZNZLOZXSBHA-UHFFFAOYSA-N 0.000 description 1
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 1
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- KAYAKFYASWYOEB-UHFFFAOYSA-N 3-octadec-1-enyloxolane-2,5-dione Chemical compound CCCCCCCCCCCCCCCCC=CC1CC(=O)OC1=O KAYAKFYASWYOEB-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- VTDMBRAUHKUOON-UHFFFAOYSA-N 4-[(4-carboxyphenyl)methyl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C=C1 VTDMBRAUHKUOON-UHFFFAOYSA-N 0.000 description 1
- SBBQDUFLZGOASY-OWOJBTEDSA-N 4-[(e)-2-(4-carboxyphenyl)ethenyl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1\C=C\C1=CC=C(C(O)=O)C=C1 SBBQDUFLZGOASY-OWOJBTEDSA-N 0.000 description 1
- OIYTYGOUZOARSH-UHFFFAOYSA-N 4-methoxy-2-methylidene-4-oxobutanoic acid Chemical compound COC(=O)CC(=C)C(O)=O OIYTYGOUZOARSH-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- OYPCNAORHLIPPO-UHFFFAOYSA-N 4-phenylcyclohexa-2,4-diene-1,1-dicarboxylic acid Chemical compound C1=CC(C(=O)O)(C(O)=O)CC=C1C1=CC=CC=C1 OYPCNAORHLIPPO-UHFFFAOYSA-N 0.000 description 1
- WTQBISBWKRKLIJ-UHFFFAOYSA-N 5-methylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C)CC1C=C2 WTQBISBWKRKLIJ-UHFFFAOYSA-N 0.000 description 1
- MBRGOFWKNLPACT-UHFFFAOYSA-N 5-methylnonane-1,9-diamine Chemical compound NCCCCC(C)CCCCN MBRGOFWKNLPACT-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- WNZFABUMDSMCMY-UHFFFAOYSA-N 7a-prop-2-enoyl-3ah-isoindole-1,3-dione Chemical compound C1=CC=CC2C(=O)NC(=O)C21C(=O)C=C WNZFABUMDSMCMY-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000005749 Copper compound Substances 0.000 description 1
- 229910021590 Copper(II) bromide Inorganic materials 0.000 description 1
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
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- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229920003182 Surlyn® Polymers 0.000 description 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 1
- 229960003375 aminomethylbenzoic acid Drugs 0.000 description 1
- QCTBMLYLENLHLA-UHFFFAOYSA-N aminomethylbenzoic acid Chemical compound NCC1=CC=C(C(O)=O)C=C1 QCTBMLYLENLHLA-UHFFFAOYSA-N 0.000 description 1
- FNGGVJIEWDRLFV-UHFFFAOYSA-N anthracene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=CC3=C(C(O)=O)C(C(=O)O)=CC=C3C=C21 FNGGVJIEWDRLFV-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- XJHABGPPCLHLLV-UHFFFAOYSA-N benzo[de]isoquinoline-1,3-dione Chemical compound C1=CC(C(=O)NC2=O)=C3C2=CC=CC3=C1 XJHABGPPCLHLLV-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- NBBUYPNTAABDEY-UHFFFAOYSA-N cyclobutane-1,1-diol Chemical compound OC1(O)CCC1 NBBUYPNTAABDEY-UHFFFAOYSA-N 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- YWJUZWOHLHBWQY-UHFFFAOYSA-N decanedioic acid;hexane-1,6-diamine Chemical compound NCCCCCCN.OC(=O)CCCCCCCCC(O)=O YWJUZWOHLHBWQY-UHFFFAOYSA-N 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- ZMUCVNSKULGPQG-UHFFFAOYSA-N dodecanedioic acid;hexane-1,6-diamine Chemical compound NCCCCCCN.OC(=O)CCCCCCCCCCC(O)=O ZMUCVNSKULGPQG-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- BXOUVIIITJXIKB-UHFFFAOYSA-N ethene;styrene Chemical compound C=C.C=CC1=CC=CC=C1 BXOUVIIITJXIKB-UHFFFAOYSA-N 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- DPUXQWOMYBMHRN-UHFFFAOYSA-N hexa-2,3-diene Chemical compound CCC=C=CC DPUXQWOMYBMHRN-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229920002681 hypalon Polymers 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical compound C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N propylene glycol Substances CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 235000011888 snacks Nutrition 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- RPACBEVZENYWOL-XFULWGLBSA-M sodium;(2r)-2-[6-(4-chlorophenoxy)hexyl]oxirane-2-carboxylate Chemical compound [Na+].C=1C=C(Cl)C=CC=1OCCCCCC[C@]1(C(=O)[O-])CO1 RPACBEVZENYWOL-XFULWGLBSA-M 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
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- 150000003739 xylenols Chemical class 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、芳香族系樹脂及び変性エラストマーからなる
機械的強度及び耐衝撃性が共に高い高強度、高弾性率の
芳香族系樹脂組成物に関する。また、本発明は芳香族系
樹脂、ポリアミド樹脂及び変性エラストマーからなる高
強度でかつ高弾性率の芳香族系樹脂組成物に関する。Detailed Description of the Invention [Field of Industrial Application] The present invention provides a high-strength, high-modulus aromatic resin composition that is composed of an aromatic resin and a modified elastomer and has high mechanical strength and impact resistance. Regarding. The present invention also relates to a high-strength and high-modulus aromatic resin composition comprising an aromatic resin, a polyamide resin, and a modified elastomer.
〔従来技術及び発明が解決しようとする課題〕芳香族ポ
リアミドや芳香族ポリエステル等の芳香族系樹脂は、耐
熱性及び機械的強度が優れエンジニアリング、プラスナ
ックとして電機・電子部品、機械部品、自動車部品等の
分野で広く利用されている。しかし、衝撃強度が低く、
用途分野において制約されていた。[Prior art and problems to be solved by the invention] Aromatic resins such as aromatic polyamide and aromatic polyester have excellent heat resistance and mechanical strength and are used in engineering, plastic snacks, electrical and electronic parts, mechanical parts, and automobile parts. It is widely used in fields such as However, the impact strength is low,
It was restricted in its field of application.
従来、−iにポリアミド、ポリエステル等にアイオノマ
ー、エチレンプロピレンゴム等のエラストマーをブレン
ドすると耐衝撃度が増加することは知られていたが、更
に耐衝撃性の要・求される構造材料等のためには未だ十
分な衝撃強度が得られていなかった。Conventionally, it has been known that impact resistance can be increased by blending polyamide, polyester, etc. with ionomer, elastomer such as ethylene propylene rubber, etc. had not yet achieved sufficient impact strength.
また、芳香族系樹脂とポリアミド樹脂をブレンドし、よ
り機械的強度の高いものを得ることも多く提案されてい
るが、機械的強度と耐衝撃性とがいずれも高く、かつそ
のバランスのよい樹脂を得ることは困難であった。In addition, many proposals have been made to blend aromatic resins and polyamide resins to obtain products with higher mechanical strength. It was difficult to obtain.
本発明は、芳香族系樹脂が有する機械的強度を損うこと
なく、耐衝撃性の優れた芳香族系樹脂組成物を提供する
ことを目的とするものである。An object of the present invention is to provide an aromatic resin composition having excellent impact resistance without impairing the mechanical strength of the aromatic resin.
本発明は、前記課題を達成するため、従来衝撃強度の改
良のために用いられているエラストマーの代わりに不飽
和化合物で変性した変性エラストマーを用いることが提
供される。In order to achieve the above object, the present invention provides the use of a modified elastomer modified with an unsaturated compound in place of the elastomer conventionally used to improve impact strength.
即ち、本発明は、芳香族系樹脂50−99重量部及び変
性エクストラマー1〜50重量部とからなる芳香族系樹
脂組成物、または、芳香族系樹脂が5〜95重量部、ポ
リアミド樹脂が5〜95重量部、並びに前記芳香族系樹
脂及び前記ポリアミド樹脂の総量100重量部に対し、
変性エラストマー1−50重量部とからなる芳香族系樹
脂組成物が提供される。That is, the present invention provides an aromatic resin composition comprising 50-99 parts by weight of an aromatic resin and 1-50 parts by weight of a modified extramer, or an aromatic resin composition comprising 5-95 parts by weight of an aromatic resin and a polyamide resin. 5 to 95 parts by weight, and 100 parts by weight of the total amount of the aromatic resin and the polyamide resin,
An aromatic resin composition comprising 1-50 parts by weight of a modified elastomer is provided.
本発明で使用される芳香族系樹脂は、重合体中に少なく
とも複数個の芳香族基を含有するポリマーまたは、ポリ
アセクールであり、例えば、ポリスチレン樹脂、ボリア
リレート及びポリカーボネートを含むポリエステル樹脂
、ポリエステルケ)・ン、ポリエーテルエーテルケトン
、ポリエーテルサルホン、及びポリサルホン等の芳香族
ポリエーテル樹脂、ボリアリレート]・ン樹脂、ポリフ
ェニレンオキサイド樹脂、ポリフェニレンザルファイド
樹脂、並びにABS樹脂等である。さらにまた、ポリマ
ー中芳香族基を含まないが、ポリアセタル樹脂である。The aromatic resin used in the present invention is a polymer containing at least a plurality of aromatic groups in the polymer or polyacecool; for example, polystyrene resin, polyester resin including polyarylate and polycarbonate, polyester resin) These include aromatic polyether resins such as polyether ether ketone, polyether sulfone, and polysulfone, polyarylate resins, polyphenylene oxide resins, polyphenylene sulfide resins, and ABS resins. Furthermore, the polymer does not contain aromatic groups, but is a polyacetal resin.
これ等芳香族系樹脂において、好ましくはポリエステル
樹脂、ポリフェニレンオキサイド樹脂及びABS樹脂が
用いられる。Among these aromatic resins, polyester resins, polyphenylene oxide resins and ABS resins are preferably used.
ポリエステル樹脂は、ジカルボン酸あるいはその誘導体
と、グリコールあるいはその誘導体とから重縮合反応に
より得られる樹脂で、ジカルボン酸またはグリコールの
いずれかが芳香族基を有するものである。A polyester resin is a resin obtained by a polycondensation reaction between a dicarboxylic acid or its derivative and a glycol or its derivative, and either the dicarboxylic acid or the glycol has an aromatic group.
ジカルボン酸としては、テレフタル酸、イソフタル酸、
2−クロロチレフクル酸、2,5−シクロロチレフクル
酸、2−メチルテレフタル酸、44−スチルベンジカル
ボン酸、4,4−ビフェニルジカルボン酸、オルトフタ
ル酸、2,6−ナフタレンジカルボン酸、ビス安息香酸
、ビス(p−カルボキシフェニル)メタン、アントラセ
ンジカルボン酸、4,4−ジフェニルエーテルジカルボ
ン酸、44−ジフェノキシエタンジカルボン酸、アジピ
ン酸、セバシン酸、アゼライン酸、ドデカンニ酸、1.
3−シクロヘキサンジカルボン酸、■、4−シクロヘキ
サンジカルボン酸などを単独でも、2種類以上を混合し
ても用いることができる。これらの化合物の中では、テ
レフタル酸、イソフタル酸、4.4−スチルベンジカル
ボン酸の単独あるいはこれらの混合物が特に好ましい。Examples of dicarboxylic acids include terephthalic acid, isophthalic acid,
2-chlorothyrefucuric acid, 2,5-cyclothyrefucuric acid, 2-methylterephthalic acid, 44-stilbenedicarboxylic acid, 4,4-biphenyldicarboxylic acid, orthophthalic acid, 2,6-naphthalenedicarboxylic acid, bisbenzoic acid, Bis(p-carboxyphenyl)methane, anthracene dicarboxylic acid, 4,4-diphenyl ether dicarboxylic acid, 44-diphenoxyethane dicarboxylic acid, adipic acid, sebacic acid, azelaic acid, dodecandioic acid, 1.
3-cyclohexanedicarboxylic acid, 4-cyclohexanedicarboxylic acid, etc. can be used alone or in combination of two or more. Among these compounds, terephthalic acid, isophthalic acid, and 4,4-stilbenedicarboxylic acid alone or a mixture thereof are particularly preferred.
グリコールとしては、エチレングリコール、1゜2−プ
ロピレングリコール、1.3−プロパンジオール、2,
2−ジメチル−1,3−プロパンジオール、トランス−
またはシス−2,2,4,4−テトラメチル1.3−シ
クロブタンジオール、■、4−ブタンジオール、ネオペ
ンチルグリコール、1,5−ベンタンジオール、1,6
−ヘキサンジオール、1,4−シクロヘキサンジメタツ
ール、1,3−シクロヘキサンジメタツール、デカメチ
レングリコール、シクロブタンジオール、P−キシレン
ジオール、ビスフェノールA、テトラブロモビスフェノ
ールA、テトラブロモビスフェノールA−ビス(2−ヒ
ドロキシエチルエーテル)などが単独でも、2種類以上
を混合しても用いることができる。これらの中ではエチ
レングリコール、1,4−ブタンジオール、■、4−シ
クロヘキサンジメタツールが好ましい。Glycols include ethylene glycol, 1゜2-propylene glycol, 1,3-propanediol, 2,
2-dimethyl-1,3-propanediol, trans-
or cis-2,2,4,4-tetramethyl 1,3-cyclobutanediol, ■, 4-butanediol, neopentyl glycol, 1,5-bentanediol, 1,6
-hexanediol, 1,4-cyclohexane dimetatool, 1,3-cyclohexane dimetatool, decamethylene glycol, cyclobutanediol, P-xylene diol, bisphenol A, tetrabromobisphenol A, tetrabromobisphenol A-bis(2 -hydroxyethyl ether) can be used alone or in combination of two or more. Among these, ethylene glycol, 1,4-butanediol, and (1),4-cyclohexane dimetatool are preferred.
本発明で使用するポリアセタル樹脂の具体例としては、
ポリエチレンテレフタレート、ポリエチレンナフタレー
ト、ポリプロピレンテレフタレート、ポリブチレンテレ
フタレート、ポリへキサメチレンテレフタレート、ポリ
シクロヘキサンジメチレンテレフタレート、ポリ(エチ
レンテレフタレート/シクロヘキサンジメチレンテレフ
タレート)共重合体、ポリ(エチレンテレフタレート/
エモレンイソフタレート)共重合体、ポリ(ブチレンテ
レフタレート/ブチレンドデカジオエート)ポリエステ
ルエーテル共重合体、ポリアクリレート、ポリカーボネ
ート等である。これらのポリエステル樹脂の数平均分子
量は8000以上であればよく、好ましくは10000
〜50000のものである。また、これらのポリエステ
ル樹脂は単独でもよく、また混合して使用してもよい。Specific examples of the polyacetal resin used in the present invention include:
Polyethylene terephthalate, polyethylene naphthalate, polypropylene terephthalate, polybutylene terephthalate, polyhexamethylene terephthalate, polycyclohexane dimethylene terephthalate, poly(ethylene terephthalate/cyclohexane dimethylene terephthalate) copolymer, poly(ethylene terephthalate/
These include emolene isophthalate) copolymer, poly(butylene terephthalate/butylene dodecadiate) polyester ether copolymer, polyacrylate, polycarbonate, and the like. The number average molecular weight of these polyester resins may be at least 8,000, preferably 10,000.
~50,000. Further, these polyester resins may be used alone or in combination.
本発明で用いるポリフェニレンオキサイド樹脂は、26
−キシレノールとオルトクレゾールとを触媒の存在下で
酸化重合反応させて得られる樹脂である。また、スチレ
ン等で変性させた変性ポリフェニレンオキサド樹脂でも
よい。ポリフェニレン樹脂は極限粘度が0.3−0.8
のものでよい。The polyphenylene oxide resin used in the present invention is 26
- It is a resin obtained by subjecting xylenol and orthocresol to an oxidative polymerization reaction in the presence of a catalyst. Alternatively, a modified polyphenylene oxide resin modified with styrene or the like may be used. Polyphenylene resin has an intrinsic viscosity of 0.3-0.8
It's fine to use one.
さらに、本発明で用いるABS樹脂は、ポリブタジェン
にアクリロニトリル−スチレン共重合体をグラフト重合
等した樹脂で、射出あるいは押出成形可能なものであれ
ばよい。Further, the ABS resin used in the present invention may be a resin obtained by graft polymerizing an acrylonitrile-styrene copolymer to polybutadiene, as long as it can be injection molded or extruded.
本発明の芳香族系樹脂は単独又は二辺上混合して使用す
ることができる。The aromatic resins of the present invention can be used alone or in combination on two sides.
本発明で使用するポリアミド樹脂は、公知の射出成形可
能なものであって、アミノ酸、ラクタムまたはジアミン
とジカルボン酸を化ツマ−として重合されたものである
。The polyamide resin used in the present invention is a known injection moldable resin, and is polymerized from an amino acid, a lactam, or a diamine, and a dicarboxylic acid.
モノマーの具体例としては、6−アミノカプロン酸、1
1−アミノウンデカン酸、12−アミノウンデカン酸、
パラアミノメチル安息香酸などのアミノ酸、ε−カブロ
ラククム、ω−ラウロラクタムなどのラクタム、テ1−
ラメチレンジアミン、ヘキサメチレンジアミン、ウンデ
カメチレンジアミン、Fデカメチレンシアミン、2,2
.4−/2,4.4トリメチルへキサメチレンジアミン
、5−メチルノナメチレンジアミン、メタキシリレンジ
アミン、バラキシリレンシアミン、1,3−ビス(アミ
ノメチル)シクロヘキサン、1.4−ビス(アミノメチ
ル)シクロヘキサン、■−アミノー3−アミノメチルー
3.5.5−トリメチルシクロヘキサン、ビス(4−ア
ミノシクロヘキシル)メタン、ビス(3−メチル−4−
アミノシクロヘキシル)メタン、212−ビス(4−ア
ミノシクロヘキシル)プロパン、ビス(アミノプロピル
)ピペラジン、アミノエチルピペラジンなどのジアミン
とアジピン酸、スヘリン酸、アゼライン酸、セバシン酸
、ドデカンニ酸、テレフタル酸、イソフタル酸、2クロ
ロテレフタル酸、2−メチルテレフタル酸、5−メチル
テレフタル酸、5−ナトリウムスルホイソフタル酸、ヘ
キサヒドロイソフタル酸、ヘキサヒドロイソフタル酸、
ジグリコール酸などのジカルボン酸との組合せたものが
ある。Specific examples of monomers include 6-aminocaproic acid, 1
1-aminoundecanoic acid, 12-aminoundecanoic acid,
Amino acids such as para-aminomethylbenzoic acid, lactams such as ε-cabrolactum and ω-laurolactam, Te1-
Ramethylenediamine, hexamethylenediamine, undecamethylenediamine, F decamethylenecyamine, 2,2
.. 4-/2,4.4 trimethylhexamethylenediamine, 5-methylnonamethylenediamine, metaxylylenediamine, baraxylylenecyamine, 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl) ) cyclohexane, ■-amino-3-aminomethyl-3.5.5-trimethylcyclohexane, bis(4-aminocyclohexyl)methane, bis(3-methyl-4-
Diamines such as aminocyclohexyl)methane, 212-bis(4-aminocyclohexyl)propane, bis(aminopropyl)piperazine, and aminoethylpiperazine, and adipic acid, sheric acid, azelaic acid, sebacic acid, dodecaniic acid, terephthalic acid, and isophthalic acid. , 2chloroterephthalic acid, 2-methylterephthalic acid, 5-methylterephthalic acid, 5-sodium sulfoisophthalic acid, hexahydroisophthalic acid, hexahydroisophthalic acid,
Some are in combination with dicarboxylic acids such as diglycolic acid.
これらのモノマーより得るポリアミド樹脂の具体例とし
て、ナイロン6、ナイロン66、ナイロン6・10、ナ
イロン6・11、ナイロン6・12、ナイロン11、ナ
イロン12、ナイロンMχD・6及びこれらの共重合ポ
リアミドなどがある。これらのポリアミド樹脂は単独で
も2種類以上を混合しても用いることができる。本発明
で使用されるポリアミド樹脂としては、これらの中では
ナイロン6やナイロン66が特に好ましい。これらの数
平均分子量は8000以上あればよく、より好ましくは
10000〜50000の範囲のものである。Specific examples of polyamide resins obtained from these monomers include nylon 6, nylon 66, nylon 6/10, nylon 6/11, nylon 6/12, nylon 11, nylon 12, nylon MxD/6, and copolymer polyamides thereof. There is. These polyamide resins can be used alone or in combination of two or more. Among these polyamide resins used in the present invention, nylon 6 and nylon 66 are particularly preferred. The number average molecular weight of these may be at least 8,000, more preferably in the range of 10,000 to 50,000.
本発明で使用される変性エラストマーは、本発明で使用
する芳香族系樹脂またはポリアミド樹脂における引張弾
性率より低い弾性率を有するエラストマーを、不飽和化
合物で変性したものである。The modified elastomer used in the present invention is an elastomer that has a lower modulus of elasticity than the tensile modulus of the aromatic resin or polyamide resin used in the present invention, and is modified with an unsaturated compound.
エラストマーとしては、公知のスチレン系、オレフィン
系、ウレタン系、ポリエステル系、ポリアミド系、塩化
ビニル系、塩素化ポリエチレン系、1.2−ポリブタジ
ェン系、フッ素系、アイオノマー及びエチレン・プロピ
レンゴム、ブチルゴム、スチレン・ブタジェンゴム・ア
クリルニトリルゴム等のゴム類等が用いられる。Examples of elastomers include known styrene-based, olefin-based, urethane-based, polyester-based, polyamide-based, vinyl chloride-based, chlorinated polyethylene-based, 1,2-polybutadiene-based, fluorine-based, ionomer, ethylene/propylene rubber, butyl rubber, and styrene.・Rubbers such as butadiene rubber and acrylonitrile rubber are used.
スチレン系の具体例としては、スチレン・ブタジェン・
スチレンブロックコポリマー、スチレン・イソプレン・
スチレンブロックコポリマー、スチレン・エチレンスチ
レンブロックコポリマー等がある。オレフィン系の具体
例としては、エチレン、プロピレン、ブテン−1、ヘキ
セン−1、デセン−1,4−メチルブテン−1,4−メ
チルペンテン−1等のエチレン系オレフィンの単独重合
体および共重合体、これらエチレン系オレフィンと1,
4−ヘキサジエン、ペンタジェン、ジシクロペンタジェ
ン、メチルテトラヒドロインデン、メチレンノルボルネ
ン、エチリデンノルボルネン等の非共役ジエンとの共重
合体、エチレン・アクリウレタン系の具体例としてはポ
リウレタン−カプロラクトン・ブロックコポリマー、ポ
リウレタンアジピン酸ブロックコポリマー等があり、市
販品としてはエラストラン(日本エラストラン社製)が
ある。ポリエステル系の具体例としては、ブチレンテレ
フタレート−テトラメチレンエーテルグリコールブロッ
クコポリマー等があり、市販品としてはハイトレル(東
し・デュポン社製)、ペルプレン(東洋紡績社製)等が
ある。ポリアミド系の具体例としては、ポリエステルア
ミド、ポリエーテルアミド、ポリエステルエーテルアミ
ド等があり、市販品としてはグリラックス(大日本イン
キ社製)、ツバミツト(三菱化成社製)等がある。塩化
ビニル系の具体例としてはスミフレックス(住友ベーク
ライト社製)、サンブレン(三菱モンサント化成社製)
等がある。塩素化ポリエチレン系の具体例としては、ク
ロロスルフォン化ポリエチレン等がある。1,2−ポリ
ブタジェン系の具体例としては、その水添物の他、例え
ばスチレン、ブタジェンとの共重合体等があり、市販品
としてはJSRRB(日本合成ゴム社製)等がある。フ
ッ素系の具体例としては、フッ化ビニリデンー六フフ化
プロピレン共重合体、三フッ化エチレンーフン化エチレ
ン共重合体等がある。アイオノマーの具体例としては、
エチレン−エチルアクリレート共重合体をすl−リウム
、亜鉛等の金属で架橋したデュポンのサーリン(商品名
)等がある。Specific examples of styrene are styrene, butadiene,
Styrene block copolymer, styrene/isoprene/
There are styrene block copolymers, styrene/ethylene styrene block copolymers, etc. Specific examples of olefins include homopolymers and copolymers of ethylene olefins such as ethylene, propylene, butene-1, hexene-1, decene-1,4-methylbutene-1,4-methylpentene-1, These ethylene olefins and 1,
Copolymers with non-conjugated dienes such as 4-hexadiene, pentadiene, dicyclopentadiene, methyltetrahydroindene, methylenenorbornene, and ethylidene norbornene; specific examples of ethylene-acryurethane systems include polyurethane-caprolactone block copolymers and polyurethane adipine. There are acid block copolymers and the like, and a commercially available product is Elastran (manufactured by Nippon Elastran Co., Ltd.). Specific examples of polyester-based polymers include butylene terephthalate-tetramethylene ether glycol block copolymers, and commercially available products include Hytrel (manufactured by DuPont Toshi) and Pelprene (manufactured by Toyobo Co., Ltd.). Specific examples of polyamides include polyester amide, polyether amide, polyester ether amide, etc., and commercially available products include Glylux (manufactured by Dainippon Ink Co., Ltd.) and Tsubamitsu (manufactured by Mitsubishi Kasei Co., Ltd.). Specific examples of vinyl chloride-based products include Sumiflex (manufactured by Sumitomo Bakelite Co., Ltd.) and Sunbrene (manufactured by Mitsubishi Monsanto Kasei Co., Ltd.).
etc. Specific examples of chlorinated polyethylene include chlorosulfonated polyethylene and the like. Specific examples of the 1,2-polybutadiene type include hydrogenated products thereof, as well as copolymers with styrene and butadiene, and commercially available products include JSRRB (manufactured by Japan Synthetic Rubber Co., Ltd.). Specific examples of fluorine-based materials include vinylidene fluoride-propylene hexafluoride copolymer, ethylene trifluoride-ethylene fluoride copolymer, and the like. Specific examples of ionomers include:
There is DuPont's Surlyn (trade name), which is an ethylene-ethyl acrylate copolymer crosslinked with metals such as sulfur and zinc.
本発明で用いる変性エラストマーは、前記エラストマー
に対し、不飽和化合物を変性剤として用いて、変性した
ものである。The modified elastomer used in the present invention is obtained by modifying the aforementioned elastomer using an unsaturated compound as a modifying agent.
変性剤としては(1)ドデセニルコハク酸無水物、オク
タデセニルコハク酸無水物、4−メタクリロキシエチル
トリノリト酸無水物等のアルケニルカルボン酸無水物及
びその誘導体、並びに前記無水物に対応するジカルボン
酸及びそのモノエステル、金属塩等、の不飽和化合物、
(2)1−アクリロイルヘンシトリアゾール、1アクリ
ロイルフタルイミド、1−アクリロイルスルホンヘンシ
イミド、■−アクリロイルナフタルイミド、メタアクリ
ロイルベンゾトリアゾール等及びこれらの誘導体等の下
記(i)式で表わされる不飽和化合物、及び
CR+ =CR2Co R:+・・・・・・(i)但
し、R,、R2=H又はアリキル基、Rz =1,2.
3−ベンゾトリアゾール、フタルイミド、オルソスルホ
ベンゾイ
ミド、1,8−ナフタルイミド、コハク酸イミド、ラク
タム類等及びその誘導
体からHを除いた残基
(3) アクリル酸、メタクリル酸、マレイン酸、マ
レイン酸モノメチルエステル、無水マレイン酸、イクコ
ン酸、イタコン酸モノメチルエステル、無水イタコン酸
フマル酸、等α、β不飽和カルボン酸、その金属塩その
モノエステル及びその無水物等並びにそれらの誘導体、
エンド−ビシクロ(2゜21)−5−ヘプテン−2,3
−カルボン酸、シス4−シクロヘキセン−1,2−ガル
ポン酸等の脂環式カルボン酸、その金属塩、及びその無
水物並びにそれらの誘導体又は、塩化メタクロイル、ア
クリロイル−オキシ−安息香酸に、オリゴマーを付加し
たオリゴマー付加不飽和化合物を用いることができる。Modifiers include (1) alkenylcarboxylic anhydrides and derivatives thereof, such as dodecenylsuccinic anhydride, octadecenylsuccinic anhydride, and 4-methacryloxyethyl trinolitic anhydride; and dicarboxylic acid corresponding to the above-mentioned anhydrides. Unsaturated compounds of acids and their monoesters, metal salts, etc., (2) 1-acryloylhencytriazole, 1-acryloylphthalimide, 1-acryloylsulfonehenshiimide, ■-acryloylnaphthalimide, methacryloylbenzotriazole, etc., and derivatives thereof unsaturated compounds represented by the following formula (i), and CR+=CR2Co R:+...(i) provided that R,, R2=H or an alkyl group, Rz=1,2.
Residues obtained by removing H from 3-benzotriazole, phthalimide, orthosulfobenzimide, 1,8-naphthalimide, succinimide, lactams, etc. and their derivatives (3) Acrylic acid, methacrylic acid, maleic acid, maleic acid α, β unsaturated carboxylic acids such as monomethyl ester, maleic anhydride, iconic acid, itaconic acid monomethyl ester, itaconic anhydride, fumaric anhydride, metal salts thereof, monoesters thereof, anhydrides thereof, etc., and derivatives thereof,
Endo-bicyclo(2゜21)-5-heptene-2,3
- Carboxylic acids, alicyclic carboxylic acids such as cis-4-cyclohexene-1,2-galponic acid, metal salts thereof, anhydrides thereof, and derivatives thereof, or methacroyl chloride, acryloyl-oxy-benzoic acid, oligomers, etc. Added oligomeric additional unsaturated compounds can be used.
オリゴマー付加不飽和化合物に用いるオリゴマーは、本
発明で使用する前記芳香族系樹脂例えばポリエステル、
ポリエーテルケトン、ポリフェニレンオキシド、ポリザ
ルホン、ポリアセタール等のオリゴマー、前記ポリアミ
ド樹脂のオリゴマー又は、前記芳香族系樹脂及びポリア
ミド樹脂のポリマーを構成する構成成分の一部を含むシ
ラン化合物オリゴマー、例えば、芳香族系樹脂ポリカー
ボネートについてのビスフェノールAを含むシラン化合
物オリゴマー等である。The oligomer used in the oligomer addition unsaturated compound is the aromatic resin used in the present invention, such as polyester,
Oligomers such as polyetherketone, polyphenylene oxide, polysulfone, polyacetal, etc., oligomers of the polyamide resins, or silane compound oligomers containing part of the constituent components of the aromatic resins and polymers of the polyamide resins, such as aromatic These include silane compound oligomers containing bisphenol A for resin polycarbonate.
オリゴマーの重合度は3〜50、好ましくは6〜30で
ある。The degree of polymerization of the oligomer is 3-50, preferably 6-30.
オリゴマー付加不飽和化合物は前記不飽和化合物に前記
オリゴマーを公知の方法により、付加させて得ることが
できる。The oligomer-added unsaturated compound can be obtained by adding the oligomer to the unsaturated compound by a known method.
エラストマーの変性は、前記エラストマーと前記変性剤
とt−ブチルハイドロパーオキサイド等の過酸化物とを
、トライブレンドした後、溶融混練する方法又は、溶媒
中等で前記エラストマーに前記変性剤をグラフトする等
公知の方法によって行うことができる。変性剤は、エラ
ストマー100重量部に対し、0.01〜10重量部、
好ましくは0.1〜5重量部の割合で用いる。Modification of the elastomer can be carried out by tri-blending the elastomer, the modifier, and a peroxide such as t-butyl hydroperoxide, and then melt-kneading the same, or by grafting the modifier onto the elastomer in a solvent or the like. This can be done by a known method. The modifier is 0.01 to 10 parts by weight per 100 parts by weight of the elastomer,
It is preferably used in a proportion of 0.1 to 5 parts by weight.
本発明において変性エラストマーは、単独又は、以上混
合して用いることができる。この場合、前記エラストマ
ーの一種に対し、前記変性剤を二種以上用いたものでも
よいし、前記エラストマーを二基上用い、前記変性剤を
一種としてもよい、又、前記エラストマー及び変性剤の
いずれも二種以上用いたものでもよい。変性剤を2種以
上用いる場合には、前記変性剤(1)又 は(3)に(
2)を併用するのが効果的である。In the present invention, modified elastomers can be used alone or in combination. In this case, two or more of the modifiers may be used for one type of elastomer, two or more of the elastomers may be used and one modifier is used, or any one of the elastomer and modifier may be used. Two or more types may also be used. When using two or more modifiers, (1) or (3) is added to the modifier (1) or (3).
It is effective to use 2) in combination.
変性エラストマーを二辺上混合して用いる場合は、変性
エラストマーをブレンドしてもよいし、エラストマーの
変性の時にエラストマー及び/又は変性剤を混合して用
いることによって、混合変性エラストマーを得てもよい
。When using modified elastomers mixed on two sides, the modified elastomers may be blended, or a mixed modified elastomer may be obtained by mixing and using an elastomer and/or a modifier when modifying the elastomer. .
本発明の樹脂組成物は、前記芳香族系樹脂及び前記変性
エラストマーを混合したもの、又は前記芳香族系樹脂、
前記ポリアミド樹脂及び前記変性エラストマの三者を同
時にあるいはそれぞれ成分ずつ予備混合したものを一軸
混練押出機、二軸混練押出機、バンバリーミキサ−、ニ
ーダ−などの通常の溶融混練加工装置に供給し、使用す
る樹脂の融点以上の温度でかつ350°C以下の温度で
溶融混練することによって容易に製造できる。The resin composition of the present invention is a mixture of the aromatic resin and the modified elastomer, or the aromatic resin,
The polyamide resin and the modified elastomer are premixed simultaneously or individually and supplied to a conventional melt-kneading processing device such as a single-screw kneading extruder, a twin-screw kneading extruder, a Banbury mixer, or a kneader; It can be easily produced by melt-kneading at a temperature above the melting point of the resin used and below 350°C.
さらに、射出成形、圧縮成形、押出成形等によって各種
用途の成形品に加工することができる。Furthermore, it can be processed into molded products for various uses by injection molding, compression molding, extrusion molding, etc.
本発明の樹脂組成物は、その成形性、物性を損なわない
範囲で各種強化材や充填剤の添加が可能である。強化材
、充填剤の具体例としては、ガラス繊維、アスベスト繊
維、カーボン繊維、シリカ繊維、シリカ・アルミナ繊維
、アルミナ繊維、ジルコニア繊維、窒化ホウ素繊維、窒
化ケイ素繊維、ホウ素繊維、ステンレス、アルミニウム
、チタン、銅、しんちゅう、マグネシウム等の金属繊維
、及びポリアミド、フッ素樹脂、ポリエステル、アクリ
ル樹脂等の有機質繊維、銅、鉄、ニッケル、亜鉛、すす
、鉛、ステンレス、アルミニウム、金、銀等の金属粉末
、ヒユームドシリカ、ケイ酸アルミニウム、ガラスピー
ズ、カーボンブラック、石英粉末、タルク、酸化チタン
、酸化鉄、炭酸カルシュラム、ケイソウ土などがある。Various reinforcing materials and fillers can be added to the resin composition of the present invention as long as their moldability and physical properties are not impaired. Specific examples of reinforcing materials and fillers include glass fiber, asbestos fiber, carbon fiber, silica fiber, silica/alumina fiber, alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, stainless steel, aluminum, and titanium. , metal fibers such as copper, brass, and magnesium; organic fibers such as polyamide, fluororesin, polyester, and acrylic resin; and metal powders such as copper, iron, nickel, zinc, soot, lead, stainless steel, aluminum, gold, and silver. , fumed silica, aluminum silicate, glass beads, carbon black, quartz powder, talc, titanium oxide, iron oxide, calcium carbonate, diatomaceous earth, etc.
繊維状物質は平均繊維径が5〜50μm、繊維長が50
μm〜60mmのものが使用できる。これらの強化材、
充填剤は公知のシランカップリング剤やチタネート系カ
ンプリング剤で表面処理したものも使用できる。これら
の強化材、充填剤は単独でも、2種類以上を混合しても
用いることが出来る。これらの強化材、充填剤は、本発
明の樹脂組成物100重量部に対して、5〜100重量
部混入させることにより、機械的強度、耐熱温度を大幅
に改善するのみならず、耐水性についても、更に改良で
き好ましい。The fibrous material has an average fiber diameter of 5 to 50 μm and a fiber length of 50 μm.
Those with a diameter of μm to 60 mm can be used. These reinforcements,
Fillers that have been surface-treated with known silane coupling agents or titanate camping agents can also be used. These reinforcing materials and fillers can be used alone or in combination of two or more. By mixing 5 to 100 parts by weight of these reinforcing materials and fillers with respect to 100 parts by weight of the resin composition of the present invention, they not only significantly improve mechanical strength and heat resistance temperature, but also improve water resistance. It is also preferable because it can be further improved.
本発明の樹脂組成物には、本発明の目的を損なわない範
囲でヒンダードフェノール、ハイドロキノン、チオエー
テル、ホスファイト類及びこれらの置換体など、また、
ヨウ化銅等の銅化合物等の酸化防止剤や熱安定剤、レゾ
ルシノール、サリシレート、ヘンシトリアゾール、ベン
ゾフェノン等の紫外線吸収剤、ステアリン酸およびその
塩、ステアリルアルコールなどの離型剤、ハロゲン系、
メラミンあるいはシアヌル酸系の難燃剤、難燃助剤、ド
デシルヘンゼンスルホン酸ナトリウム、ポリアルキレン
グリコールなどの帯電防止剤、結晶化促進剤、染料、顔
料などの添加剤を一種以上添加することも可能である。The resin composition of the present invention may contain hindered phenol, hydroquinone, thioether, phosphites, substituted products thereof, etc., as long as the object of the present invention is not impaired.
Antioxidants and heat stabilizers such as copper compounds such as copper iodide, ultraviolet absorbers such as resorcinol, salicylate, henctriazole, and benzophenone, mold release agents such as stearic acid and its salts, stearyl alcohol, halogen-based,
It is also possible to add one or more additives such as melamine or cyanuric acid flame retardants, flame retardant aids, sodium dodecylhenzenesulfonate, antistatic agents such as polyalkylene glycol, crystallization accelerators, dyes, and pigments. It is.
また、ポリエチレン、ポリプロピレン、エチレン・酢酸
ビニル共重合体、エチレン・プロピレン共重合体、熱可
塑性ポリウレタン、ポリアセクール、ポリカーボネート
、ポリスルホン、ポリフェニレンエーテル、エチレンプ
ロピレンラバー、スチレンブタジェンブロック共重合体
ポリエステルなどの熱可塑性エラストマー、熱可塑性樹
脂やフェノール樹脂、メラミン樹脂、シリコーン樹脂、
エポキシ樹脂等の熱硬化性樹脂を添加することもできる
。In addition, thermoplastics such as polyethylene, polypropylene, ethylene/vinyl acetate copolymer, ethylene/propylene copolymer, thermoplastic polyurethane, polyacecool, polycarbonate, polysulfone, polyphenylene ether, ethylene propylene rubber, styrene butadiene block copolymer polyester, etc. Elastomers, thermoplastic resins, phenolic resins, melamine resins, silicone resins,
Thermosetting resins such as epoxy resins can also be added.
以下に変性エラストマーの製法、実施例及び比較例によ
って本発明を具体的に説明する。The present invention will be specifically explained below with reference to a method for producing a modified elastomer, Examples, and Comparative Examples.
実施例及び比較例における曲げ弾性率、衝撃強度、吸油
率及び樹脂混合物の相溶性の測定は下記の方法によって
行った。The flexural modulus, impact strength, oil absorption, and compatibility of resin mixtures in Examples and Comparative Examples were measured by the following methods.
1) 曲げ弾性率: ASTM D−790に準じて測
定した。1) Flexural modulus: Measured according to ASTM D-790.
(単位kgf/cイ)
2) ノツチ付アイゾツト衝撃強度:ASTM D−2
56に準じて測定した。測定には厚さ178インチの試
験片を使用した。(単位kg −cm/ cm)3)
吸油率:市販のガソリンに常温で24時間浸漬した曲げ
弾性率測定用のテストピースの浸漬前後の重量変化につ
いてABS樹脂との比で表した。(Unit: kgf/c) 2) Notched Izot impact strength: ASTM D-2
It was measured according to No. 56. A 178 inch thick specimen was used for the measurements. (Unit: kg - cm/cm) 3)
Oil absorption rate: The change in weight of a test piece for measuring flexural modulus that was immersed in commercially available gasoline at room temperature for 24 hours before and after immersion was expressed as a ratio to ABS resin.
4)相溶性:八ST?I D−638の引張り用テスト
ピース(厚さ178インチ)を平均100回屈曲させ、
相分離を肉眼で判定した。4) Compatibility: 8ST? A tensile test piece of ID-638 (178 inches thick) was bent an average of 100 times.
Phase separation was determined visually.
実施例で使用する変性エラストマーは以下の方法で製造
した。The modified elastomer used in the examples was manufactured by the following method.
「変性エラストマー製造例1(変性水添スチレン・ブタ
ジェンブロック共重体)」
水添スチレン・ブタジェンブロック共重合体(旭化成■
製、商品名:タフチックH1041)xoo重M部に対
し、1−アクリロイルヘンシトリアセクール1.0重量
部、t−ブチルハイドロパーオキサイド(日本油脂■製
)0.3重量部を添加し、トライブレンドで均一に混合
した。この混合物をスクリュー式押出機で、シリダ−温
度250°Cで混練しながら反応させ、ペレット化し、
変性エラストマー■を得た。"Modified elastomer production example 1 (modified hydrogenated styrene/butadiene block copolymer)" Hydrogenated styrene/butadiene block copolymer (Asahi Kasei ■
Manufactured by Toughtic H1041) Mixed evenly with a blender. This mixture was reacted with a screw extruder while kneading at a cylinder temperature of 250°C, and pelletized.
A modified elastomer ■ was obtained.
「変性エラストマー製造例2(変性エチレンプロピレン
ラバー)」
変性エラストマー製造例1において、水添スチレン・ブ
タジェンブロック共重合体に代えて、エチレンプロピレ
ンラバー(日本合成ゴム■製筒品名:1EP−02P)
を使用した以外は同様にして変性エラストマー■を得た
。"Modified elastomer production example 2 (modified ethylene propylene rubber)" In modified elastomer production example 1, ethylene propylene rubber (Japan Synthetic Rubber product name: 1EP-02P) was used instead of the hydrogenated styrene-butadiene block copolymer.
A modified elastomer ■ was obtained in the same manner except that .
「変性エラストマー製造例3(オリゴマー変性水添スチ
レン・ブタジェンブロック共重合体)」(オリゴマー付
加変性剤Aの製法)
ポリエチレングリコールテレフタレート/ポリシクロヘ
キサンジメタツールテレフタレートの末端に水酸基を有
する重合度15のオリゴマーを常法により得た。このオ
リゴマーをカセイソーダ水溶液で中和した後、塩化メク
クロイルと反応させてメタクリロイル−オキシ・ポリエ
ステルのNa塩であるオリゴマー付加変性剤Aを得た。"Modified elastomer production example 3 (oligomer-modified hydrogenated styrene-butadiene block copolymer)" (Production method of oligomer addition modifier A) Polyethylene glycol terephthalate/polycyclohexane dimetatool terephthalate with a polymerization degree of 15 having a hydroxyl group at the end Oligomers were obtained by conventional methods. After neutralizing this oligomer with an aqueous solution of caustic soda, it was reacted with mecculoyl chloride to obtain oligomer addition modifier A, which is a Na salt of methacryloyl-oxy polyester.
(オリゴマー付加変性剤Bの製法)
臭化第2銅、ジ−n−ブチルアミンと、トルエンに2,
6ジメチルフエノールを溶解させたものを添加混合し、
均一溶解させた後、酸素を急激に吹き込みながら重合を
行い、重合度18のオリゴマーを得た。これを前記オリ
ゴマー付加変性剤Aの製法と同様にして、メタクリロイ
ル−オキシ−ポリフェニレンオキサイドのオリゴマー付
加変性剤Bを得た。(Production method of oligomer addition modifier B) Cupric bromide, di-n-butylamine, and 2,
Add and mix 6-dimethylphenol dissolved,
After homogeneous dissolution, polymerization was carried out while rapidly blowing oxygen into the solution to obtain an oligomer with a degree of polymerization of 18. This was carried out in the same manner as the method for producing the oligomer addition modifier A, to obtain an oligomer addition modifier B of methacryloyl-oxy-polyphenylene oxide.
(変性エラストマーの製法)
変性エラストマー製造例1において、1−アクリロイル
ヘンシトリアゾールに代えてオリゴマー付加変性剤Aを
5重量部、及びt−ブチルハイドロパーオキサイドを1
.0重量部添加した以外は同様にして変性エラストマー
■を得た。また、オリゴマー付加変性剤Aの代りにオリ
ゴマー付加、変性剤Bを使用し、同様にして変性エラス
トマー■を得た。(Production method of modified elastomer) In modified elastomer production example 1, 5 parts by weight of oligomer addition modifier A and 1 part of t-butyl hydroperoxide were used in place of 1-acryloylhensitriazole.
.. A modified elastomer (2) was obtained in the same manner except that 0 part by weight was added. Furthermore, a modified elastomer (2) was obtained in the same manner using oligomer addition and modification agent B instead of oligomer addition and modification agent A.
〔実施例1〕
ABS樹脂(宇部サイコン味製商晶名: EXIOI)
80重量部に変性エラストマー■を20重量部添加しト
ライブレンドした後、270°Cで溶融混練した。この
混合物をシリンダー温度270°C1金型温度80°C
で各種物性試験片を成形し、物性測定した。その結果を
第1表に示した。[Example 1] ABS resin (Ube Saikon Aji Co., Ltd. commercial name: EXIOI)
20 parts by weight of the modified elastomer (2) was added to 80 parts by weight, triblended, and then melt-kneaded at 270°C. Cylinder temperature: 270°C 1 mold temperature: 80°C
Various physical property test specimens were molded and their physical properties were measured. The results are shown in Table 1.
〔実施例2〜6、及び比較例1〜3]
第1表に示す各配合割合で、実施例1に準じて試験片を
成形した。この場合使用したポリアミド樹脂は宇部興産
■製、商品名: 1013Bであり、ポリエステル樹脂
はイーストマンコダソク製、商品名: KODARPE
T G10179、ポリフェニレンオキシド樹脂(PP
O樹脂)は極限粘度0.50のものを用いた。[Examples 2 to 6 and Comparative Examples 1 to 3] Test pieces were molded according to Example 1 at each blending ratio shown in Table 1. The polyamide resin used in this case was manufactured by Ube Industries, product name: 1013B, and the polyester resin used was manufactured by Eastman Kodasoku, product name: KODARPE.
T G10179, polyphenylene oxide resin (PP
O resin) used had an intrinsic viscosity of 0.50.
各結果を第1表に示した。The results are shown in Table 1.
本発明の樹脂組成物は各成分の分散性が良好で、かつ、
芳香族系樹脂及びポリアミド樹脂の有する高機械的強度
等の物性を損なうことなく耐衝撃性が向上する。さらに
、配合割合を選択することにより、耐油性の付与、成形
性等各種物性を改良することができる。従って、本発明
に係る樹脂組成物は、各種用途に応し、各物性のバラン
スのとれたものを提供することができる。The resin composition of the present invention has good dispersibility of each component, and
Impact resistance is improved without impairing physical properties such as high mechanical strength of aromatic resins and polyamide resins. Furthermore, by selecting the blending ratio, various physical properties such as imparting oil resistance and moldability can be improved. Therefore, the resin composition according to the present invention can be provided with well-balanced physical properties in accordance with various uses.
(以下、余白)(Hereafter, margin)
Claims (2)
重量部に対し、変性エラストマー1−50重量部 とからなることを特徴とする芳香族系樹脂組成物。(2) (a) 5-95 parts by weight of aromatic resin, (b) 5-95 parts by weight of polyamide resin, and (c) 100 parts of the total amount of component (a) and component (b).
An aromatic resin composition comprising 1 to 50 parts by weight of modified elastomer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24124688A JPH0288661A (en) | 1988-09-27 | 1988-09-27 | Aromatic resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24124688A JPH0288661A (en) | 1988-09-27 | 1988-09-27 | Aromatic resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0288661A true JPH0288661A (en) | 1990-03-28 |
Family
ID=17071383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24124688A Pending JPH0288661A (en) | 1988-09-27 | 1988-09-27 | Aromatic resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0288661A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0264148A (en) * | 1988-05-13 | 1990-03-05 | Teijin Chem Ltd | Resin composition |
KR20180016392A (en) * | 2015-06-09 | 2018-02-14 | 신에쓰 가가꾸 고교 가부시끼가이샤 | The addition-curable silicone rubber composition and the cured product |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59197459A (en) * | 1983-04-26 | 1984-11-09 | Ube Ind Ltd | Production of polyamide composition |
JPS6094445A (en) * | 1983-10-01 | 1985-05-27 | デーエスエム ナムローゼ フェンノートシャップ | Plastic molding compound |
JPH01129058A (en) * | 1987-11-12 | 1989-05-22 | Japan Synthetic Rubber Co Ltd | Thermoplastic resin composition |
JPH0253856A (en) * | 1988-08-19 | 1990-02-22 | Ube Ind Ltd | Sulfur-containing aromatic resin composition |
JPH0253861A (en) * | 1988-08-17 | 1990-02-22 | Japan Synthetic Rubber Co Ltd | Thermoplastic resin composition |
-
1988
- 1988-09-27 JP JP24124688A patent/JPH0288661A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59197459A (en) * | 1983-04-26 | 1984-11-09 | Ube Ind Ltd | Production of polyamide composition |
JPS6094445A (en) * | 1983-10-01 | 1985-05-27 | デーエスエム ナムローゼ フェンノートシャップ | Plastic molding compound |
JPH01129058A (en) * | 1987-11-12 | 1989-05-22 | Japan Synthetic Rubber Co Ltd | Thermoplastic resin composition |
JPH0253861A (en) * | 1988-08-17 | 1990-02-22 | Japan Synthetic Rubber Co Ltd | Thermoplastic resin composition |
JPH0253856A (en) * | 1988-08-19 | 1990-02-22 | Ube Ind Ltd | Sulfur-containing aromatic resin composition |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0264148A (en) * | 1988-05-13 | 1990-03-05 | Teijin Chem Ltd | Resin composition |
KR20180016392A (en) * | 2015-06-09 | 2018-02-14 | 신에쓰 가가꾸 고교 가부시끼가이샤 | The addition-curable silicone rubber composition and the cured product |
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