JPH0288282U - - Google Patents
Info
- Publication number
- JPH0288282U JPH0288282U JP16809088U JP16809088U JPH0288282U JP H0288282 U JPH0288282 U JP H0288282U JP 16809088 U JP16809088 U JP 16809088U JP 16809088 U JP16809088 U JP 16809088U JP H0288282 U JPH0288282 U JP H0288282U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- case
- metal board
- board
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案による構造の一実施例を示す分
解斜視図、第２図は第１図のＡ―Ａ断面図、第３
図Ａは該実施例において、半田付け後のケースと
金属基板との組合わせ状態を示す断面図、同Ｂは
同じくケースに設けたボスにより金属基板のそり
を矯正した状態を示す断面図、第４図は該実施例
における寸法関係を説明する図、第５図は本考案
者等が既に開発している樹脂ケースと金属基板と
の組合わせ構造を示す断面図である。
Fig. 1 is an exploded perspective view showing one embodiment of the structure according to the present invention, Fig. 2 is a sectional view taken along line AA in Fig. 1, and Fig.
Figure A is a cross-sectional view showing the combined state of the case and metal board after soldering, Figure B is a cross-sectional view showing the state in which the warp of the metal board has been corrected by the boss provided on the case, and Figure FIG. 4 is a diagram for explaining the dimensional relationship in this embodiment, and FIG. 5 is a sectional view showing a combination structure of a resin case and a metal substrate, which has already been developed by the inventors of the present invention.
Claims (1)
筐体を構成し、金属基板とケースとの対向間隔に
金属基板のそり分以上の長さを加えた長さを有す
るボスを、ケースと金属基板との対向面間に設け
たことを特徴とする金属基板の支持構造。 A metal board and a case are combined to form a housing of an electrical device, and a boss having a length equal to or more than the warpage of the metal board is added to the facing distance between the metal board and the case. A support structure for a metal substrate, characterized in that it is provided between opposing surfaces of the metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16809088U JPH0288282U (en) | 1988-12-26 | 1988-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16809088U JPH0288282U (en) | 1988-12-26 | 1988-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0288282U true JPH0288282U (en) | 1990-07-12 |
Family
ID=31456963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16809088U Pending JPH0288282U (en) | 1988-12-26 | 1988-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0288282U (en) |
-
1988
- 1988-12-26 JP JP16809088U patent/JPH0288282U/ja active Pending