JPH0288274U - - Google Patents
Info
- Publication number
- JPH0288274U JPH0288274U JP16880988U JP16880988U JPH0288274U JP H0288274 U JPH0288274 U JP H0288274U JP 16880988 U JP16880988 U JP 16880988U JP 16880988 U JP16880988 U JP 16880988U JP H0288274 U JPH0288274 U JP H0288274U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- wiring board
- printed wiring
- lower conductor
- superposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す印刷配線基板
の要部斜視図、第２図は同上印刷配線基板を上方
向から見たときの要部平面図、第３図は本考案に
よる印刷配線基板を周波数発電機用の配線基板に
適用した場合の配線基板の概略的斜視構成図、第
４図は本考案による印刷配線基板の作成手順の一
例を示す工程図、第５図ａは本考案の別の実施例
を示す印刷配線基板の要部平面図、第５図ｂは同
上印刷配線基板の第５図ａ―線断面図、第６
図ａは従来技術の一例を示す印刷配線基板の要部
平面図、第６図ｂは同上印刷配線基板の第６図ａ
―線断面図、第７図ａは従来技術の別の例を
示す印刷配線基板の要部平面図、第７図ｂは同上
印刷配線基板の第７図ａ―線断面図である。
ａ……絶縁基板、ｂ……レジスト、ｃ……下部
導体パターン、ｄ……上部導体パターン、ｅ……
オーバーコート、ｆ……絶縁層（アンダーコート
）、ｇ，ｈ……オーバーコート除去部。
Fig. 1 is a perspective view of the main parts of a printed wiring board showing an embodiment of the present invention, Fig. 2 is a plan view of the main parts of the same printed wiring board as seen from above, and Fig. 3 is a printed wiring board according to the present invention. A schematic perspective configuration diagram of a wiring board when the wiring board is applied to a wiring board for a frequency generator, FIG. 4 is a process diagram showing an example of the procedure for producing a printed wiring board according to the present invention, and FIG. 5a is a diagram of the present invention. FIG. 5b is a plan view of the main parts of a printed wiring board showing another embodiment of the invention, and FIG.
Figure a is a plan view of essential parts of a printed wiring board showing an example of the conventional technology, and Figure 6b is Figure 6a of the same printed wiring board.
FIG. 7a is a plan view of a main part of a printed wiring board showing another example of the prior art, and FIG. 7b is a sectional view taken along line FIG. 7a of the same printed wiring board. a...Insulating substrate, b...Resist, c...Lower conductor pattern, d...Upper conductor pattern, e...
Overcoat, f... Insulating layer (undercoat), g, h... Overcoat removed portion.
Claims (1)
下部導体パターン上に上部導体パターンを絶縁層
を介在させて重合すると共に、上記上部及び下部
導体パターンに各々形成した電極を重合させて接
続し、さらに上記上部導体パターンの電極の少な
くとも一部を除く部分にオーバーコートを施して
成ることを特徴とする印刷配線基板。 A lower conductor pattern is formed on an insulating substrate, an upper conductor pattern is superposed on the lower conductor pattern with an insulating layer interposed therebetween, and electrodes respectively formed on the upper and lower conductor patterns are superposed and connected, and A printed wiring board characterized in that a portion of the upper conductor pattern excluding at least a portion of the electrode is overcoated.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988168809U JPH06849Y2 (en) | 1988-12-27 | 1988-12-27 | Printed wiring board |
| US07/376,847 US4975607A (en) | 1988-07-11 | 1989-07-07 | Frequency generator with superimposed generation coil |
| EP89307008A EP0351175A3 (en) | 1988-07-11 | 1989-07-11 | A frequency generator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988168809U JPH06849Y2 (en) | 1988-12-27 | 1988-12-27 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0288274U true JPH0288274U (en) | 1990-07-12 |
| JPH06849Y2 JPH06849Y2 (en) | 1994-01-05 |
Family
ID=31458314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988168809U Expired - Lifetime JPH06849Y2 (en) | 1988-07-11 | 1988-12-27 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06849Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6018564U (en) * | 1983-07-15 | 1985-02-07 | 安藤電気株式会社 | Film for flexible printed boards |
-
1988
- 1988-12-27 JP JP1988168809U patent/JPH06849Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6018564U (en) * | 1983-07-15 | 1985-02-07 | 安藤電気株式会社 | Film for flexible printed boards |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06849Y2 (en) | 1994-01-05 |