JPH0287580A - Cap for infrared sensor and manufacture thereof - Google Patents
Cap for infrared sensor and manufacture thereofInfo
- Publication number
- JPH0287580A JPH0287580A JP63239359A JP23935988A JPH0287580A JP H0287580 A JPH0287580 A JP H0287580A JP 63239359 A JP63239359 A JP 63239359A JP 23935988 A JP23935988 A JP 23935988A JP H0287580 A JPH0287580 A JP H0287580A
- Authority
- JP
- Japan
- Prior art keywords
- window member
- cap
- infrared sensor
- window
- cap body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000011521 glass Substances 0.000 claims abstract description 25
- 238000002844 melting Methods 0.000 claims abstract description 22
- 238000007789 sealing Methods 0.000 abstract description 5
- 230000008018 melting Effects 0.000 description 11
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、赤外線センサ用キャップ及びその製造方法に
関し、詳しくは、窓孔を穿設したキップと、内側にフィ
ルタを形成した窓部材とを気密的に封着した赤外線セン
サ用キャップ及び両者を気密的に封止する製造方法に関
する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a cap for an infrared sensor and a method for manufacturing the same. The present invention relates to an hermetically sealed infrared sensor cap and a manufacturing method for hermetically sealing both.
赤外線センサ用キャップを有する赤外線センサを第３図
に示して説明する。An infrared sensor having an infrared sensor cap is shown in FIG. 3 and will be described.
図において、（１）は、円盤状をしたＦｅ製のステム基
板で、例えば、２箇所に貫通孔（ｌａ）を穿設しである
。（２）は、前記貫通孔（１ａ）に挿通したリードで、
ガラス（３）によって気密絶縁的に封止される。（４）
は、上記ステム基板（１）上に載置し、リード（２）と
電気的に接続されたベース部で、インピーダンス変換用
のＦＥＴやソース抵抗の回路部品等から構成される。（
５）は、前記ベース（４）の上側に配置する円盤状の焦
電体で、広い波長領域の赤外線に感応するものである。In the figure, (1) is a disk-shaped stem substrate made of Fe, and has two through holes (la), for example. (2) is a lead inserted into the through hole (1a),
It is hermetically and insulatively sealed by glass (3). (4)
is a base portion placed on the stem substrate (1) and electrically connected to the leads (2), and is composed of circuit components such as an FET for impedance conversion and a source resistance. (
5) is a disk-shaped pyroelectric material placed above the base (4), which is sensitive to infrared rays in a wide wavelength range.
（６）は、上記ステム基板（１）の外周縁部上に固着す
るハツト形状のキャップ本体で、天板部に窓孔（６ａ）
を形成しである。（７）は、前記窓孔（６ａ）の内面に
封着する窓部材で、キャップ（６）と窓部材（７）とは
樹脂（８）によって固着する。窓部材（７）は、赤外線
の透過性に優れるＳ！又はＧｅによって形成し、また、
キャップ本体（６）に封着する以前に、特定の波長の赤
外線のみを透過するフィルタ（９）を、窓部材（７）の
内側に、予め塗布形成しておく。(6) is a hat-shaped cap body that is fixed on the outer peripheral edge of the stem board (1), and has a window hole (6a) in the top plate.
It is formed. (7) is a window member that is sealed to the inner surface of the window hole (6a), and the cap (6) and the window member (7) are fixed by resin (8). The window member (7) is made of S!, which has excellent infrared transmittance. or formed by Ge, and
Before sealing to the cap body (6), a filter (9) that transmits only infrared rays of a specific wavelength is coated on the inside of the window member (7) in advance.
赤外線センサは以上のように構成され、焦電体（５）が
感応する赤外線量が変化したときに、リード（２）に焦
電電流が流れるようにされている。The infrared sensor is configured as described above, and when the amount of infrared rays to which the pyroelectric body (5) is sensitive changes, a pyroelectric current flows through the lead (2).
例えば、フィルタ（９）が、人体の出す赤外線のみを通
過するものであるときに、赤外線センサは、自動ドアや
侵入警報器として利用される。For example, when the filter (9) passes only infrared rays emitted by the human body, the infrared sensor is used as an automatic door or an intruder alarm.
赤外線センサは、絶縁抵抗の低下や経時変化の防止乃至
雰囲気からの汚染保護のため、気密性が要求される。Infrared sensors are required to be airtight in order to prevent a decrease in insulation resistance and change over time, and to protect against contamination from the atmosphere.
ステム基板（１）の貫通孔（１ａ）とリード（２）とは
、ガラス（３）によって気密絶縁的に封止しであるから
、この部分から湿気が侵入することはない。Since the through hole (1a) of the stem substrate (1) and the lead (2) are hermetically and insulatively sealed with the glass (3), moisture does not enter from this part.
しかし、窓部材（７）とキャップ本体（６）とは樹脂（
８）によって封着しているから、この部分での気密性が
低く、樹脂（８）を通して、赤外線センサ内に湿気が侵
入してくることがある。However, the window member (7) and the cap body (6) are made of resin (
8), the airtightness of this part is low, and moisture may enter the infrared sensor through the resin (8).
ところが、窓部材（７）の裏面には、フィルタ（９）を
、予め、塗布形成してあり、このフィルタ（９）は有機
物質であることから、耐熱性に弱く、窓部材（７）とキ
ャップ本体（６）とを高温によりガラス封着することが
できない。However, a filter (9) is coated on the back side of the window member (7) in advance, and since this filter (9) is made of an organic material, it has poor heat resistance and is not compatible with the window member (7). It is not possible to seal the cap body (6) with the glass at high temperature.
そこで、本発明は、窓部材とキャップ本体との気密性を
向上させた赤外センサ用キャップ及びその製造方法を提
供することを目的とする。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an infrared sensor cap that improves the airtightness between the window member and the cap body, and a method for manufacturing the same.
本発明は、上記目的を達成するため、赤外線センサ用キ
ャップは、天板部に窓孔を形成したハント形状のキャッ
プ本体の前記窓孔に窓部材が低融点ガラスにて封着され
、かつ、この窓部材の内側にフィルタが形成されたもの
で、また、赤外線センサ用キャップの製造方法は、ハン
ト形状のキャップの天板部に形成した窓孔に窓部材を低
融点ガラスにて封着した後、前記窓部材の内側にフィル
タを形成するものである。In order to achieve the above object, the present invention provides a cap for an infrared sensor, in which a window member is sealed to the window hole of a hunt-shaped cap body with a window hole formed in the top plate using low-melting glass, and A filter is formed inside this window member, and the manufacturing method for the infrared sensor cap is to seal the window member with low-melting glass into the window hole formed in the top plate of the hunt-shaped cap. After that, a filter is formed inside the window member.
キャップ本体と窓部材とを低融点ガラスにて封着したこ
とにより、両者の気密性が向上する。By sealing the cap body and the window member with low melting point glass, the airtightness of both is improved.
窓部材に形成するフィルタは、窓部材をキャップ本体に
封着した後に形成するため、フィルタが低融点ガラスを
封着する際の高熱によって損傷することはない。Since the filter formed on the window member is formed after the window member is sealed to the cap body, the filter will not be damaged by the high heat generated when sealing the low melting point glass.
本発明に係る実施例を第１図を参照して説明する。但し
、従来と同一部品は同一符号を付して、その説明は省略
する。An embodiment according to the present invention will be described with reference to FIG. However, parts that are the same as those in the prior art are given the same reference numerals, and their explanations will be omitted.
本発明においては、窓部材（７）には、当初フィルタ（
９）を形成しておかない。そして、第１図（ａ）に示す
ように、キャップ本体（６）に形成した窓部（６ａ）を
下側にし、窓部（６ａ）の周辺に、円環状に低融点ガラ
ス（１０）を被着して宜く。そして、低融点ガラス（１
０）上に、フィルタ（９）を形成していない窓部材（７
）を載せ、６００℃ぐらいに加熱する。すると、低融点
ガラス（１０）が熔融し、再び室温に戻したときに、低
融点ガラス（１１）が、キャップ本体（６）と窓部材（
７）とを、気密性高く封着する。あるいは、予め窓部材
（７）の方に低融点ガラス（１０）を被着しておくか、
キャップ本体（６）と窓部材（７）の両方に低融点ガラ
ス（１０）を被着しておいて、両者を気密に封着しても
よい。In the present invention, the window member (7) initially includes a filter (
9) should not be formed. Then, as shown in FIG. 1(a), with the window (6a) formed in the cap body (6) facing downward, a low melting point glass (10) is placed in an annular shape around the window (6a). It's good to be covered. And low melting point glass (1
0) A window member (7) on which a filter (9) is not formed.
) and heat to about 600℃. Then, the low melting point glass (10) is melted and when the temperature is returned to room temperature, the low melting point glass (11) is melted and the cap body (6) and the window member (
7) and are sealed with high airtightness. Alternatively, the window member (7) may be covered with low melting point glass (10) in advance, or
The cap body (6) and the window member (7) may both be covered with low melting point glass (10), and both may be hermetically sealed.
場合によっては、低融点ガラスタブレットを用いて両者
を気密に封着してもよい。In some cases, both may be hermetically sealed using a low melting point glass tablet.
その後、第１図（ｂ）に示すように、窓部材（７）の内
側に、フィルタ（９）を形成する。Thereafter, as shown in FIG. 1(b), a filter (9) is formed inside the window member (7).
フィルタ（９）は、スプレーにより塗布するか、シート
状のものを接着するかは特定するものではない。It is not specified whether the filter (9) is applied by spraying or glued in the form of a sheet.
このようにして、赤外線センサ用キャップが製造される
と、従来と同様、ベース部（４）や焦電体（５）を載置
したステム基板（１）の外周縁部上に、この赤外線セン
サ用キャップを固着する。When the infrared sensor cap is manufactured in this way, the infrared sensor is placed on the outer periphery of the stem substrate (1) on which the base part (4) and the pyroelectric body (5) are mounted, as in the conventional case. Fix the cap.
次に、第２図に変形例を示して説明する。変形例におい
ては、窓部材（７）の周辺部には、フィルタ（９）を形
成せず、このフィルタ（９）のない窓部材（７）の周辺
部とキャップ本体（６）の内壁部とを導電性接着剤（１
２）によって接続する。すると、窓部材（７）とキャッ
プ本体（６）とが同電位になり、外来ノイズに対するシ
ールド効果を高めることができる。尚、導電性接着剤（
１２）で接続する場合であっても、第１の実施例と同様
、キャップ本体（６）と窓部材（７）とは低融点ガラス
によって封着した後、窓部材（７）の内側にフィルタ（
９）を形成する。Next, a modification will be described with reference to FIG. 2. In the modified example, the filter (9) is not formed in the peripheral part of the window member (7), and the peripheral part of the window member (7) without this filter (9) and the inner wall part of the cap body (6) are connected. conductive adhesive (1
2) Connect. Then, the window member (7) and the cap body (6) have the same potential, and the shielding effect against external noise can be enhanced. In addition, conductive adhesive (
12), as in the first embodiment, the cap body (6) and the window member (7) are sealed with low-melting glass, and then a filter is placed inside the window member (7). (
9).
本発明の赤外線センサ用キャップは、キャップ本体と窓
部材とを低融点ガラスにて封着したことにより気密性が
高く、この赤外線センサ用キャップを用いた赤外線セン
サは気密性が高く維持され、製品の品質を長年に亘って
良好に保つことができる。The infrared sensor cap of the present invention has high airtightness because the cap body and the window member are sealed with low-melting glass, and the infrared sensor using this infrared sensor cap maintains high airtightness, and the product can maintain good quality for many years.
また、窓部材に形成するフィルタは、低融点ガラスによ
って、窓部材を封着した後に形成するため、フィルタが
高温に晒されることがなく、フィルタの性能は維持され
る。。Further, since the filter formed on the window member is formed after the window member is sealed with low melting point glass, the filter is not exposed to high temperatures and the performance of the filter is maintained. .
第１図は本発明に係る第１の実施例を示す縦断面図、第
２図は同じく第２の実施例を示す縦断面図である。
第３図は従来の赤外線センサ用キャップを含む赤外線セ
ンサの縦断面図である。
（６）−・キャップ本体、（６ａ）−窓孔、（７）−・
窓部材、 （９）・・・フィルタ、（１１）−・
−低融点ガラス。
特 許 出 願 人 関西日本電気株式会社代
理 人 江 原 省 吾ｉ１図
第３図
６ａた札
第２図FIG. 1 is a longitudinal sectional view showing a first embodiment of the present invention, and FIG. 2 is a longitudinal sectional view showing the second embodiment. FIG. 3 is a longitudinal sectional view of an infrared sensor including a conventional infrared sensor cap. (6)--Cap body, (6a)-Window hole, (7)--
window member, (9)...filter, (11)-...
-Low melting glass. Patent applicant: Kansai NEC Co., Ltd.
Rijin Gangwon Province I1 Figure 3 Figure 6a Tag Figure 2
Claims (2)
体の前記窓孔に窓部材が低融点ガラスにて封着され、か
つ、この窓部材の内側にフィルタが形成されていること
を特徴とする赤外線センサ用キャップ(1) A window member is sealed with low-melting glass to the window hole of the hunt-shaped cap body with a window hole formed in the top plate, and a filter is formed inside the window member. Features of infrared sensor cap
窓部材を低融点ガラスにて封着した後、前記窓部材の内
側にフィルタを形成することを特徴とする赤外線センサ
用キャップの製造方法。(2) An infrared sensor cap characterized in that a window member is sealed with low-melting glass into a window hole formed in the top plate of the hunt-shaped cap, and then a filter is formed inside the window member. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63239359A JPH0287580A (en) | 1988-09-24 | 1988-09-24 | Cap for infrared sensor and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63239359A JPH0287580A (en) | 1988-09-24 | 1988-09-24 | Cap for infrared sensor and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0287580A true JPH0287580A (en) | 1990-03-28 |
Family
ID=17043585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63239359A Pending JPH0287580A (en) | 1988-09-24 | 1988-09-24 | Cap for infrared sensor and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0287580A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003258272A (en) * | 2002-02-27 | 2003-09-12 | Sumitomo Electric Ind Ltd | Optical signal receiving module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59213189A (en) * | 1983-05-18 | 1984-12-03 | Hitachi Ltd | Semiconductor device |
| JPS62204581A (en) * | 1986-03-05 | 1987-09-09 | Shinko Electric Ind Co Ltd | Window cap |
-
1988
- 1988-09-24 JP JP63239359A patent/JPH0287580A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59213189A (en) * | 1983-05-18 | 1984-12-03 | Hitachi Ltd | Semiconductor device |
| JPS62204581A (en) * | 1986-03-05 | 1987-09-09 | Shinko Electric Ind Co Ltd | Window cap |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003258272A (en) * | 2002-02-27 | 2003-09-12 | Sumitomo Electric Ind Ltd | Optical signal receiving module |
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