JPH028757A - Probe apparatus - Google Patents

Abstract

PURPOSE:To achieve a higher measuring efficiency with the curtailment of operator's manipulation for the alteration of the type a wafer to be measured by recognizing the type of the wafer to be measured to perform a processing automatically for each wafer with the alteration of types. CONSTITUTION:A controller 3 drives a transfer mechanism 7 to take a semiconductor 2 out of a cassette within a storage section 9. Then, a wafer type code is recognized with a recognizing mechanism 8 and the type of the wafer 2 is judged from the results of recognition. Then, operations such exchange of probe cards 5, positioning of a probe 5a, alteration of a probe parameter and alteration of a test parameter of a tester 20 are performed automatically for all wafers depending on the species of the wafer.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a probe device.

(Prior Art) A probe device is used for testing Al1 of a semiconductor device formed on a semiconductor wafer in a semiconductor manufacturing process.

That is, the probe device adsorbs and holds the semiconductor wafer on a sample stage using a vacuum chuck or the like, drives the sample stage, and attaches the tip of the probe card to the electrode pad of each semiconductor device formed on the semiconductor wafer 1. contact. Then, the electrical characteristics of the semiconductor device are measured according to the test program preset and programmed by the tester.

In such a probe device, when changing the standard product in 4-1 or changing the position of the electrode node or node of the semiconductor device, it is necessary to replace the probe card and align the probe tip of the probe card. In addition, since the drive pattern of the sample stage for bringing the probe of the probe card into contact with the illumination pad of the semiconductor device also changes, the probe parameters for controlling the drive of this sample stage also need to be changed. Furthermore, since the test signals supplied from the tester and the items to be measured by the tester change depending on the type of product to be measured, it is also necessary to change the test parameters of the tester.

In conventional probe devices, the above-mentioned changes such as replacing the probe card, aligning the probe of the probe card, changing the probe parameters, and changing the test parameters of the tester must be performed by an operator.

(Problem to be solved by the invention) However, in recent years, devices (ASIC: application spec
irlcntegratedclrculL), and the manufacturing of semiconductor devices tends to be high-mix, low-volume production. For this reason, with the conventional probe device described above, each time the measurement type changes, the operator must replace the probe card, align the probe card's probe, change the probe parameters, and change the tester's test parameters. There was a problem that the 11p1 constant efficiency deteriorated.

Therefore, the inventor of the present invention has announced an idea to automatically exchange probe cards in accordance with the type of wafer. However, these automatic operations are performed on a wafer cassette and lot basis, and there is no mention of automatic handling on a wafer-by-wafer basis.

The present invention has been made in response to such conventional circumstances, and by automatically recognizing the type of wafer to be measured and automatically exchanging probe cards and test programs according to the type, wafers of various types can be stored. The object of the present invention is to provide a probe device that can be fully automated even in cases where the probe device is used, can improve the n1 constant efficiency compared to the conventional method, and can improve productivity.

[Structure of the Invention] (Means for Solving the Problems) That is, the present invention provides a probe device in which probes of a probe card are brought into contact with electrode pads of a semiconductor device formed on a wafer one after another and an inspection is performed using a tester. means for sequentially loading the wafers housed in a wafer accommodating section onto a sample stage; means for recognizing the type of wafers loaded onto the sample stage by this means; and determining a measurement position based on the wafer type recognized by this means. means for aligning the wafer to be measured by recognizing the position of the tip of the probe of the probe card placed at the measurement position by this means; The present invention is characterized by comprising means for changing test parameters of a tester and probe parameters for controlling drive of the sample stage.

(Function) The probe device of the present invention having the above configuration recognizes the type of wafer to be subjected to all determination, replaces the probe card in response to a change in type, aligns the probe of the probe card, and changes the probe parameters. Automatically change tester test parameters for each wafer.

In addition, operator operations when changing the measurement product can be reduced, iiP + constant rate can be achieved compared to the conventional method, and productivity can be improved.

(Example) Examples of the probe device of the present invention will be described below with reference to the drawings.

The probe device 1 is provided with a sample stage 4 configured to suction and hold a semiconductor wafer 2 using, for example, a vacuum chuck, and to be driven and controlled by a controller 3 so as to be movable in x, y, z, and θ directions. Further, a holding mechanism (not shown) is arranged above the sample stand 4, and this holding mechanism holds a probe card 5 for A11 measurement above the sample stand 4, and this probe card 5 is attached to a measuring ring. It is configured to be electrically connected to a tester 20 via a cable 6.

Further, on the side of the sample stage 4, a wafer transport mechanism 7 comprising, for example, a transport arm and positioning means, and a wafer recognition mechanism 8 comprising, for example, an optical reading device are arranged. A wafer cassette (not shown) accommodated in the wafer accommodating section 9 by the wafer transport mechanism 7
By loading and unloading the semiconductor wafers 2 in the cassette between the cassette and the sample stage 4, and photoelectrically reading the ID code of the semiconductor wafer 2 loaded onto the sample stage 4 by the wafer recognition mechanism 8, for example. semiconductor wafer 2
It is configured so that the variety can be recognized.

The wafer transport mechanism 7 and wafer recognition mechanism 8 are connected to the controller 3, and their operations are controlled. Further, the type of semiconductor wafer 2 recognized by the wafer recognition machine horizontal 8 is input to the controller 3. Depending on the type of semiconductor wafer 2, the controller 3 changes the probe parameters for controlling the drive of the sample stage 4 and exchanges probe cards etc. using the card transport mechanism 10 (described later), and also transmits information regarding this type to the tester. 20, and the tester 20 automatically loads the test parameters (test program) corresponding to the product to be measured.

The probe cards 5 are stored in advance in predetermined slots corresponding to the product types, and the corresponding probe cards 5 are set at predetermined positions according to the product product designation by the controller 3. Alternatively, the code on the probe card 5 is optically read, recognized by the controller 3, and the corresponding probe card 5 is automatically set.

The card transport mechanism 10 includes, for example, a transport arm, positioning means, etc., and is configured to be able to load and unload the probe card 5 stored in the card storage section 11 onto and from the above-mentioned holding mechanism arranged above the sample stage 4. has been done.

Furthermore, an image recognition mechanism 12 is arranged near the sample stage 4. The image recognition mechanism 12 is configured to be able to detect the traces of probes 5a of a probe card or the like formed on electrode pads of semiconductor devices on the semiconductor wafer 2 using, for example, a dummy wafer. And this information is
The data is sent to the controller 3, and the position of the sample stage 4 can be automatically corrected by the controller 3.

The probe device of this embodiment having the above configuration is controlled by the controller 3 as follows.

That is, as shown in the flowchart of FIG. 2, the controller 3 first drives the wafer transport mechanism 7 to take out the semiconductor wafer 2 from the wafer cassette housed in the wafer accommodating section 9. Load it under the ID reader of mechanism 8 (b).

Next, the wafer recognition mechanism 8 detects the I of the semiconductor wafer 2.
Read the D code and recognize the wafer type code (c
).

Then, based on the above recognition result, it is determined whether or not the type of semiconductor wafer 2 is a new type.d) If it is a new type that is not registered in the list in the controller 3, an initial operation is required. (e).

On the other hand, if the result of the above judgment is that the type is already registered, the probe parameters registered in the controller 3 are automatically loaded (f).

After this, it is determined whether or not the probe card 5 needs to be replaced based on the wafer type described aboveg). If replacement is not necessary, proceed to step (k) without performing the next steps (h) to (j). to move to.

On the other hand, if the probe card 5 needs to be replaced as a result of the above judgment, the card transport mechanism 10 moves the probe card 5 placed above the sample stage 4 into the predetermined probe card 5 accommodated in the card accommodating section 11. h), by loading the dummy wafer onto the sample stage 4 and controlling the drive of the sample stage 4 in two directions as described above, a needle mark is written on the surface of the dummy wafer, and then the needle mark is created by the image recognition mechanism 12. The position of the probe card 5 is recognized by detecting the trace (i), and the card θ is automatically corrected (j>).

Next, the semiconductor wafer 2 to be measured is placed on the sample stage 4 by the wafer transport mechanism 7 (k).

Thereafter, by adjusting the position of the sample stage 4, θ of the wafer is automatically corrected ()), and then X-Y of the wafer is automatically corrected according to the registered correction data (m).

Thereafter, the sample stage 4 is driven to bring the electrode pad of the semiconductor device formed on the semiconductor wafer 2 into contact with the probe 5a of the probe card 5, thereby forming a needle mark on the electrode pad. It is determined whether the probe 5a is accurately hitting the electrode pad by detection by the image recognition mechanism 12 (n), and if the probe 5a is not accurately hitting the electrode pad, the steps (β) to (m) are performed. Repeat.

On the other hand, if the probe 5a is accurately touching the electrode pad, send the product code to the tester 20 and change the test parameters of the tester 20 to predetermined test parameters according to the ll-1 standard product. start (p
).

Then, when the probing of - semiconductor wafers 2 is completed (q), the wafer transport mechanism 7 unloads the semiconductor wafers 2 on the sample stage 4 (), and it is determined that the measurement of all wafers has been completed. ), if the measurement is completed, the operation is terminated and the process waits for the start of the wafer test of the next cassette (1).

Furthermore, if the A-1 determination has not been completed for all wafers, the operation from step (a) is repeated to measure the next semiconductor wafer 2.

That is, according to the probe device 1 of this embodiment, the replacement of the probe card 5, the alignment of the probe 5a, the change of probe parameters, and the change of the test parameters of the tester 20, etc., which were conventionally performed with a change in product type, can be avoided. Since this is configured to be performed automatically for all wafers, operator operations can be reduced and the aFI constant efficiency can be greatly improved.

In the above embodiment, the ID code on the semiconductor wafer 2 is read by the wafer recognition mechanism 8, but the controller 3 may be configured to recognize the type of the semiconductor wafer 2 via an IC card or other recording medium, for example. You may.

[Effects of the Invention] As described above, the probe device of the present invention can reduce operator operations when changing the standard 7111 model, improve measurement efficiency compared to the conventional method, and improve productivity. can.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing the configuration of a probe device according to an embodiment of the present invention, and FIG. 2 is a flowchart for explaining the operation of the probe device of FIG. 1. DESCRIPTION OF SYMBOLS 1... Probe device, 2... Semiconductor wafer, 3... Controller, 4... Sample stage, 5... Probe card, 5a・・・・・・
・Probe, 6...Measuring cable, 7...
... Wafer transport mechanism, 8 ... Wafer recognition mechanism, 9 ... Wafer storage section, 10 ... Card transport mechanism, 11 ... Card storage Part, 12・
... Image recognition mechanism. Applicant Tokyo Electron Ltd. Applicant
Chill Yamanashi Co., Ltd.

Claims (1)

[Claims] (1) In a probe device that tests with a tester by bringing the probes of a probe card into contact with the electrode pads of semiconductor devices formed on the wafer one after another, the wafers housed in the wafer housing section are sequentially loaded onto a sample stage. means for recognizing the type of the wafer loaded onto the sample stage by the means; means for placing the probe card at a predetermined measurement position according to the type of wafer recognized by the means; means for aligning the wafer to be measured by recognizing the position of the tip of the probe of the probe card placed at the position; and a probe for controlling the test parameters of the tester corresponding to the type of the wafer and the drive of the sample stage. A probe device comprising means for changing parameters.