JPH0284294U - - Google Patents

Info

Publication number
JPH0284294U
JPH0284294U JP1988164735U JP16473588U JPH0284294U JP H0284294 U JPH0284294 U JP H0284294U JP 1988164735 U JP1988164735 U JP 1988164735U JP 16473588 U JP16473588 U JP 16473588U JP H0284294 U JPH0284294 U JP H0284294U
Authority
JP
Japan
Prior art keywords
jig
electronic component
lead
large number
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988164735U
Other languages
Japanese (ja)
Other versions
JPH0451471Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988164735U priority Critical patent/JPH0451471Y2/ja
Publication of JPH0284294U publication Critical patent/JPH0284294U/ja
Application granted granted Critical
Publication of JPH0451471Y2 publication Critical patent/JPH0451471Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの考案の一実施例のリード成形装置
の斜視図である。第２図は気密端子の一例の断面
図である。第３図はガラス封着時のグラフアイト
治具と気密端子構成部品の断面図である。第４図
は従来のリード拡開成形装置の断面図である。 １……リード、２……ガラス、３……金属外環
、４……底治具、５……中治具、６……上治具、
１０……押し上げ板、１１……Ｖ溝部、２０……
ワークチヤツク、２１……Ｖ型溝、２２……ワー
クチヤツク、２３……弾性パツド、３０……成形
ピン、３１……先端部、３２……成形ピンホルダ
。 FIG. 1 is a perspective view of a lead forming apparatus according to an embodiment of this invention. FIG. 2 is a sectional view of an example of an airtight terminal. FIG. 3 is a sectional view of the graphite jig and hermetic terminal components during glass sealing. FIG. 4 is a sectional view of a conventional lead expansion forming device. 1...Lead, 2...Glass, 3...Metal outer ring, 4...Bottom jig, 5...Medium jig, 6...Top jig,
10... Push-up plate, 11... V groove, 20...
Work chuck, 21... V-shaped groove, 22... Work chuck, 23... Elastic pad, 30... Molded pin, 31... Tip, 32... Molded pin holder.

Claims (1)

【実用新案登録請求の範囲】 (1) 同一方向に整列した複数本のリードを有す
る多数の電子部品を支持する治具と、 前記治具に支持された電子部品のそれぞれのリ
ードの下端を治具より押し上げるための押し上げ
板と、 前記治具より押し上げられた電子部品をチヤツ
クし、上昇することにより電子部品のリードを治
具から抜き取るワークチヤツクと、 前記ワークチヤツクによりチヤツクされた電子
部品のリード間に挿入して多数の電子部品のリー
ドを一括して拡開成形する先端部がテーパ状の多
数の成形ピンとを有することを特徴とする電子部
品のリード成形装置。 (2) 前記電子部品が気密端子であり、前記治具
がグラフアイト治具である、実用新案登録請求の
範囲第１項記載の電子部品のリード成形装置。[Claims for Utility Model Registration] (1) A jig for supporting a large number of electronic components having a plurality of leads aligned in the same direction, and a jig for supporting the lower end of each lead of the electronic component supported by the jig. a push-up plate for pushing up the electronic component from the jig; a work chuck for chucking the electronic component pushed up from the jig and pulling out the lead of the electronic component from the jig by lifting; and a space between the leads of the electronic component chucked by the work chuck. 1. A lead forming device for electronic components, comprising a large number of forming pins each having a tapered tip for inserting and expanding and forming the leads of a large number of electronic components at once. (2) The electronic component lead forming apparatus according to claim 1, wherein the electronic component is an airtight terminal and the jig is a graphite jig.
JP1988164735U 1988-12-19 1988-12-19 Expired JPH0451471Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988164735U JPH0451471Y2 (en) 1988-12-19 1988-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988164735U JPH0451471Y2 (en) 1988-12-19 1988-12-19

Publications (2)

Publication Number Publication Date
JPH0284294U true JPH0284294U (en) 1990-06-29
JPH0451471Y2 JPH0451471Y2 (en) 1992-12-03

Family

ID=31450592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988164735U Expired JPH0451471Y2 (en) 1988-12-19 1988-12-19

Country Status (1)

Country Link
JP (1) JPH0451471Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009182932A (en) * 2008-02-01 2009-08-13 Nec Schott Components Corp Cylindrical package for electronic element and manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009182932A (en) * 2008-02-01 2009-08-13 Nec Schott Components Corp Cylindrical package for electronic element and manufacturing method

Also Published As

Publication number Publication date
JPH0451471Y2 (en) 1992-12-03

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