JPS5870545A - Pellet positioning jig - Google Patents
Pellet positioning jigInfo
- Publication number
- JPS5870545A JPS5870545A JP16871881A JP16871881A JPS5870545A JP S5870545 A JPS5870545 A JP S5870545A JP 16871881 A JP16871881 A JP 16871881A JP 16871881 A JP16871881 A JP 16871881A JP S5870545 A JPS5870545 A JP S5870545A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- positioning jig
- hole
- guide plate
- pellets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は半導体ベレットを基板にボンディングする工程
においてペレットの位置決めを行うペレット位置決め治
具に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pellet positioning jig for positioning a semiconductor pellet in a step of bonding the semiconductor pellet to a substrate.
従来、半導体装置の製造過＠においてベレットボンディ
ングを行う場合、第１図に示すように、トレーｌの凹部
に別々に収容されたベレット２を円筒コレット３で真空
吸着し、第２図のような凹部４Ａを設けたペレット位置
決め治具４にベレット２を入れ、揚動を力０えて定位電
に修正した後、咳ベレット２を角錐コレット５で真空吸
着し、基板６上に搬送してボンディングしている。Conventionally, when performing pellet bonding in the manufacturing process of semiconductor devices, as shown in FIG. 1, pellets 2 housed separately in the recesses of a tray L are vacuum-adsorbed by a cylindrical collet 3, The pellet 2 is placed in a pellet positioning jig 4 provided with a concave portion 4A, and after reducing the lifting force to zero and correcting the positioning voltage, the cough pellet 2 is vacuum-adsorbed with a pyramidal collet 5, and transferred onto a substrate 6 for bonding. ing.
このような場合に使用されるペレット位置決め治具４は
第３図に示すように凹部４への壁面がテーバ面４Ｂとし
て形成され、ペレット２の位置決めを容易かつ正１１に
行うようになって〜・る。As shown in FIG. 3, the pellet positioning jig 4 used in such cases has a wall surface facing the recess 4 formed as a tapered surface 4B, so that the pellet 2 can be easily and accurately positioned.・Ru.
この凹１ｉ１４Ａのテーバ面４Ｂは通常放電加工により
形成されるが、該テーバ面４Ｂと底面４Ｃとの接合９４
Ｄが丸みを帯びた形状すなわちＲ（アール）のついた形
状となってしまい、ベレットの位置決め精度が悪くなる
おそれがある。The tapered surface 4B of this recess 1i14A is usually formed by electrical discharge machining, but the joining 94 between the tapered surface 4B and the bottom surface 4C
D becomes a rounded shape, that is, a shape with an R (R), which may deteriorate the positioning accuracy of the pellet.
一方、接合部４ＤのＲを少くするためには長い時間にわ
たって放電加工をしなければならず、コストおよび能率
の低下を来たす。また、加工後の寸法測定は１難であり
、高価な測定器が必要となる等の問題もある。On the other hand, in order to reduce the radius of the joint portion 4D, electrical discharge machining must be performed for a long time, resulting in a decrease in cost and efficiency. Further, there are also problems such as the difficulty in measuring dimensions after processing and the need for expensive measuring instruments.
したがって、本発明の目的は、ペレット収容用の孔を容
易かつ迅速に加工でき、しかもベレットの位置決めを正
確に行うことのできるペレット位置決め治具を提供する
ことＫある。Therefore, an object of the present invention is to provide a pellet positioning jig that can easily and quickly form a hole for storing pellets and can accurately position the pellets.
この目的を達成するため、本発明によるベレット位置決
め治具は、ペレット収容用の貫、通孔を持つガイド板と
、ペレット支持用の底板との組合せよりなるものである
。In order to achieve this object, the pellet positioning jig according to the present invention consists of a combination of a guide plate having a through hole for accommodating pellets, and a bottom plate for supporting pellets.
以下、本発明を図面に示す一実施例にしたがって説明す
る。Hereinafter, the present invention will be explained according to an embodiment shown in the drawings.
３１３４図は本発明によるベレット位置決め用治具の一
実施例を示す断面図である。Figure 3134 is a sectional view showing an embodiment of the pellet positioning jig according to the present invention.
本実施例のベレット位置決め用治具は、ガイド板７と底
ｆ２８との２つの部分の組合せよりなるものである。The pellet positioning jig of this embodiment is made up of a combination of two parts: the guide plate 7 and the bottom f28.
ガイド＃７にはペレット収容用の貫通孔７Ａが形成され
、この貫通孔７Ａはペレットの位置決めを容易にするた
め上端開口側から下方向に小さくなったテーパ面７Ｂに
より形成されている。A through hole 7A for storing pellets is formed in guide #7, and this through hole 7A is formed by a tapered surface 7B that becomes smaller downward from the upper end opening side in order to facilitate positioning of the pellets.
前記底板８は、ガイド板フの貫通孔７ＡＫ収春されたペ
レットを支持するためのもので、平板状の構造よりなり
、ペレットを吸着するための孔を持つ。The bottom plate 8 is for supporting the pellets harvested through the through holes 7AK of the guide plate, and has a flat plate-like structure and has holes for adsorbing the pellets.
したがって、本実施例においては、ガイド１／ｆＬ７よ
る加工が極めて簡単かつ容易であり、底を持つ凹部の加
工時のように底面と＠壁面との接合部ＫＲが形成される
こともなく、ペレットの位置決めは非常に正確となる。Therefore, in this example, processing using the guide 1/fL7 is extremely simple and easy, and unlike when processing a recess with a bottom, a joint KR between the bottom surface and @wall surface is not formed, and the pellets are The positioning is very accurate.
また、加工後の貫通孔７人の寸法測定も極めて簡単であ
り、寸法精度も向上させることができる。Ｉ！５図に示
す様に、底１８ｉ８を使用しない場合も、位置決め治具
乗せ台１０の上面をなめらかに仕上げてあれば可能であ
る。Furthermore, it is extremely easy to measure the dimensions of the seven through holes after processing, and the dimensional accuracy can also be improved. I! As shown in FIG. 5, it is possible to not use the bottom 18i8 as long as the top surface of the positioning jig platform 10 is finished smoothly.
以上説明したように、本発明によれば、加工が容易であ
り、コストを低減でき、ペレットの位置渋め精度も向上
する等の利点が得られる。As explained above, according to the present invention, advantages such as ease of processing, reduction in cost, and improved precision in positioning the pellets can be obtained.
第１図はペレットボンディングの一例を示す概略説明図
、第２図は従来のベレット位置決め治具の斜視図、第３
ＦＭはその断面図、第４図、第５図は本発明によるベレ
ット位置決め治具の＊＊施例な示す断面図である。
５．９．１１・・真空用孔、７・・・ガイド板、７Ａ・
・・貫通孔、８・・・底板、１０・・・位置決め治具乗
せ台。Fig. 1 is a schematic explanatory diagram showing an example of pellet bonding, Fig. 2 is a perspective view of a conventional pellet positioning jig, and Fig. 3 is a perspective view of a conventional pellet positioning jig.
FM is a cross-sectional view thereof, and FIGS. 4 and 5 are cross-sectional views showing examples of the pellet positioning jig according to the present invention. 5.9.11...Vacuum hole, 7...Guide plate, 7A...
...Through hole, 8...Bottom plate, 10...Positioning jig mounting stand.
Claims (1)
ガイド板と組み合わされ、前記貫通孔に収容されたペレ
ットを支持する底板とがうなるペレット位置決め治具。 ２、ペレットを収容する貫通孔を持つガイド板からなる
特許請求の範囲第１項妃載のペレット位置決め治具。[Claims] 1. A pellet positioning jig comprising a guide plate having a through hole for accommodating pellets, and a bottom plate that is combined with the guide plate and supports the pellets accommodated in the through hole. 2. The pellet positioning jig as set forth in claim 1, which comprises a guide plate having a through hole for accommodating the pellet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16871881A JPS5870545A (en) | 1981-10-23 | 1981-10-23 | Pellet positioning jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16871881A JPS5870545A (en) | 1981-10-23 | 1981-10-23 | Pellet positioning jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5870545A true JPS5870545A (en) | 1983-04-27 |
Family
ID=15873151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16871881A Pending JPS5870545A (en) | 1981-10-23 | 1981-10-23 | Pellet positioning jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5870545A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2923948A1 (en) * | 2007-11-19 | 2009-05-22 | Centre Nat Etd Spatiales | DEVICE AND METHOD FOR ALIGNING PLATELETS ON A PLANAR SUPPORT. |
-
1981
- 1981-10-23 JP JP16871881A patent/JPS5870545A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2923948A1 (en) * | 2007-11-19 | 2009-05-22 | Centre Nat Etd Spatiales | DEVICE AND METHOD FOR ALIGNING PLATELETS ON A PLANAR SUPPORT. |
| WO2009071790A1 (en) * | 2007-11-19 | 2009-06-11 | Centre National D'etudes Spatiales (C.N.E.S.) | Device and method for aligning wafers on a flat support |
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