JPH0283574A - Mounting method for liquid crystal panel - Google Patents
Mounting method for liquid crystal panelInfo
- Publication number
- JPH0283574A JPH0283574A JP23562488A JP23562488A JPH0283574A JP H0283574 A JPH0283574 A JP H0283574A JP 23562488 A JP23562488 A JP 23562488A JP 23562488 A JP23562488 A JP 23562488A JP H0283574 A JPH0283574 A JP H0283574A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal panel
- circuit board
- flank
- recessed part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims description 11
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 claims abstract description 17
- 230000035882 stress Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はワイヤーボンディングにより外部回路との電気
的接続を行なう液晶パネルの実装方法に［従来の技術］
従来のワイヤーボンディングにより外部回路との電気的
接続を行なう液晶パネルの実装方法は、第５図の様に、
液晶パネル１の底面を回路基板２に接着剤５により接着
固定しζボンディングワイヤー６により液晶パネル１と
回路基板２の電気的接続を取っていた。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a method for mounting a liquid crystal panel that connects electrically to an external circuit by wire bonding [Prior Art] The mounting method of the liquid crystal panel that performs physical connection is as shown in Figure 5.
The bottom surface of the liquid crystal panel 1 was adhesively fixed to the circuit board 2 with an adhesive 5, and the liquid crystal panel 1 and the circuit board 2 were electrically connected by a ζ bonding wire 6.
［発明が解決しようとする課題］
しかし、前述の従来技術では、液晶パネルと回路基板の
熱膨張率が異なるため、使用環境温度によっては液晶パ
ネルに曲げ応力が加わってそりが生じ、セルギャップが
変化し、表示特性の低下を起こしたり、最悪の場合は液
晶パネルのシール部が破断して液晶漏れを起こすという
問題点があった。[Problems to be Solved by the Invention] However, in the above-mentioned conventional technology, since the thermal expansion coefficients of the liquid crystal panel and the circuit board are different, bending stress is applied to the liquid crystal panel depending on the operating environment temperature, causing warping and causing the cell gap to increase. There is a problem in that the liquid crystal changes, causing deterioration of display characteristics, and in the worst case, the seal portion of the liquid crystal panel breaks, causing liquid crystal leakage.
そこで本発明はこのような問題点を解決するもので、そ
の目的とするところは、使用環境温度が変化しても液晶
パネルにそりや応力がほとんど生ずることがなく、表示
特性の低下やシール部の破断の生じ難い液晶パネルの実
装方法を提供するところにある。The present invention is intended to solve these problems.The purpose of the present invention is to prevent warpage or stress from occurring on the liquid crystal panel even when the operating environment temperature changes, and to prevent deterioration of display characteristics and sealing parts. An object of the present invention is to provide a method for mounting a liquid crystal panel that is less likely to break.
［課厘を解決するための手段］
本発明の液晶パネルの実装方法は、液晶パネルを回路基
板に接着し、ワイヤーボンディングにより液晶パネルと
回路基板との電気的接続を取る液晶パネルの実装方法に
おいて、前記回路基板は前記液晶パネルが装着される凹
部を有すると共に前記凹部の側面と前記液晶パネルの側
面とを接着固定したことを特徴とする。[Means for Solving Problems] The method for mounting a liquid crystal panel of the present invention is a method for mounting a liquid crystal panel in which the liquid crystal panel is bonded to a circuit board and the liquid crystal panel and the circuit board are electrically connected by wire bonding. , the circuit board has a recess into which the liquid crystal panel is mounted, and a side surface of the recess and a side surface of the liquid crystal panel are adhesively fixed.
更に接着固定箇所を点状としたことを特徴とする。A further feature is that the adhesive fixing locations are dotted.
［実施例］
第１図及び第２図は本発明の実施例を示す断面図及び平
面図であり、液晶パネル１は回路基板２に設けられた四
部に配置され、液晶パネル１の側面５と回路基板２の凹
部の側面４が接着剤５により接着固定されている。また
液晶パネル１と回路基板２はボンディングワイヤー６に
より電気的に接続され、必要によってはワイヤーはモー
ルドで保護される。ここで通常液晶パネル１にはソーダ
ガラスや石英ガラス等が用いられ、回路基板２にはガラ
エボ基板を座ぐり加工したものが用いられる。液晶パネ
ル１と回路基板２の接着は、回路基板２の四部に液晶パ
ネル１を位置決めして配置し、両者の接触面７に隙間が
生じないよう押しつけた状態で液晶パネル１と側面３と
回路基板２の凹部の側面４との間に接着剤５を流し込み
硬化させ行なう。接着剤は熱硬化型のものでも良いが、
光硬化型のものを用いた方が短時間で硬化するため、接
触面への染み込みが少なく有利である。また同様の理由
から、接着剤の粘度は比較的高い方が良い。このような
構造にすると、液晶パネルと回路基板の熱膨張率の差に
よる熱応力が、液晶パネルの平面方向への引張または圧
縮応力として加わるため、液晶パネルがそることもなく
、シール部にも応力はほとんど加わらない。[Embodiment] FIGS. 1 and 2 are a cross-sectional view and a plan view showing an embodiment of the present invention, in which a liquid crystal panel 1 is arranged on four parts provided on a circuit board 2, and a side surface 5 of the liquid crystal panel 1 A side surface 4 of the recessed portion of the circuit board 2 is adhesively fixed with an adhesive 5. Further, the liquid crystal panel 1 and the circuit board 2 are electrically connected by bonding wires 6, and the wires are protected by molding if necessary. Usually, soda glass, quartz glass, or the like is used for the liquid crystal panel 1, and a counterbore-processed glass evo board is used for the circuit board 2. The liquid crystal panel 1 and the circuit board 2 are bonded together by positioning and arranging the liquid crystal panel 1 on the four parts of the circuit board 2, and pressing the liquid crystal panel 1, side surface 3, and circuit together so that there is no gap between the contact surfaces 7 of the two. An adhesive 5 is poured between the side surface 4 of the concave portion of the substrate 2 and cured. The adhesive may be a thermosetting type, but
It is more advantageous to use a photo-curing type because it cures in a shorter time and less seeps into the contact surface. Also, for the same reason, it is better for the viscosity of the adhesive to be relatively high. With this structure, thermal stress due to the difference in coefficient of thermal expansion between the liquid crystal panel and the circuit board is applied as tensile or compressive stress in the plane direction of the liquid crystal panel, so the liquid crystal panel does not warp and the seal area is also protected. Almost no stress is applied.
第３図は本発明の別の実施例を示す平面図で、液晶パネ
ル１と回路基板２とを接着固定する接着剤５を、液晶パ
ネル１の中央近傍に点状に塗布したものである。こうす
ると、熱応力が接着剤５で吸収されるため、更に液晶パ
ネル１には応力は加わらなくなる。この場合、接着剤に
その硬化後のヤング率が、ワイヤーボンディングに支障
がない範囲で充分小さいものを選べば、更に効果は大き
い。また、接着固定箇所も液晶パネルの全辺とする必要
はなく、それ以下であってもかまわない。FIG. 3 is a plan view showing another embodiment of the present invention, in which an adhesive 5 for adhesively fixing the liquid crystal panel 1 and the circuit board 2 is applied in dots near the center of the liquid crystal panel 1. In this case, since the thermal stress is absorbed by the adhesive 5, no further stress is applied to the liquid crystal panel 1. In this case, the effect will be even greater if the adhesive has a sufficiently small Young's modulus after curing that does not interfere with wire bonding. Further, the adhesive fixing locations do not need to be on all sides of the liquid crystal panel, and may be less than that.
尚、液晶パネルの側面での接着固定をより確実にするた
め、第４図のように、回路基板２の凹部の周囲に溝８を
形成し、接触面７への接着剤５の流れ込みを防止しても
良い。In addition, in order to more securely fix the adhesive on the side surface of the liquid crystal panel, a groove 8 is formed around the recessed part of the circuit board 2, as shown in FIG. 4, to prevent the adhesive 5 from flowing into the contact surface 7. You may do so.
［発明の効果コ
以上述べたように本発明によれば、液晶パネルと回路基
板との接着固定を、回路基板に凹部を設け、その側面同
士で行ない、更に接着固定箇所を点状にしたことにより
、液晶パネルがそることな（、従りて表示特性の低下や
シール部の破断が生じ難いという効果を有する。[Effects of the Invention] As described above, according to the present invention, the liquid crystal panel and the circuit board are adhesively fixed by providing recesses in the circuit board and performing the adhesive fixing between the sides thereof, and furthermore, the adhesive fixing points are dotted. This has the effect that the liquid crystal panel is not warped (therefore, the display characteristics are less likely to deteriorate and the seal portion is less likely to break).
第１図、第２図は本発明の液晶パネルの実装方法の一実
施例を、示す断面図と平面図。
第３図は本発明の別の実施例を示す平面図。
第４図は本発明にかかる回路基板の構造の実施例を示す
断面図。
第５図は従来の液晶パネルの実装方法を示す断面図。
１・・・・・・・・・液晶パネル
２・・・・・・・・・回路基板
３・・・・・・・・・液晶パネルの側面４・・・・・・
・・・回路基板の四部の側面５・・・・・・・・・接着
剤
６・・・・・・・・・ボンディングワイヤー、７□・・
・・・・・・・接触面
８・・・・・・・・・溝
第
図
！
第＋図1 and 2 are a sectional view and a plan view showing an embodiment of the liquid crystal panel mounting method of the present invention. FIG. 3 is a plan view showing another embodiment of the present invention. FIG. 4 is a sectional view showing an embodiment of the structure of a circuit board according to the present invention. FIG. 5 is a cross-sectional view showing a conventional liquid crystal panel mounting method. 1...LCD panel 2...Circuit board 3...Side side of liquid crystal panel 4...
...Sides of the four parts of the circuit board 5...Adhesive 6...Bonding wire, 7□...
・・・・・・Contact surface 8・・・・・・Groove diagram! Figure ＋
Claims (2)
ィングにより液晶パネルと回路基板との電気的接続を取
る液晶パネルの実装方法において、前記回路基板は前記
液晶パネルが装着される凹部を有すると共に前記凹部の
側面と前記液晶パネルの側面とを接着固定したことを特
徴とする液晶パネルの実装方法。(1) In a method for mounting a liquid crystal panel in which a liquid crystal panel is adhered to a circuit board and the liquid crystal panel and the circuit board are electrically connected by wire bonding, the circuit board has a recess into which the liquid crystal panel is mounted, and A method for mounting a liquid crystal panel, characterized in that the side surface of the recess and the side surface of the liquid crystal panel are fixed with adhesive.
項１記載の液晶パネルの実装方法。(2) The method for mounting a liquid crystal panel according to claim 1, wherein the adhesively fixed portions are dotted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23562488A JPH0283574A (en) | 1988-09-20 | 1988-09-20 | Mounting method for liquid crystal panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23562488A JPH0283574A (en) | 1988-09-20 | 1988-09-20 | Mounting method for liquid crystal panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0283574A true JPH0283574A (en) | 1990-03-23 |
Family
ID=16988768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23562488A Pending JPH0283574A (en) | 1988-09-20 | 1988-09-20 | Mounting method for liquid crystal panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0283574A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5235383A (en) * | 1990-08-31 | 1993-08-10 | Canon Kabushiki Kaisha | Process cartridge and image forming apparatus using same |
| US7661830B2 (en) | 2004-03-22 | 2010-02-16 | Seiko Epson Corporation | Lamp device and projector equipped with the same |
| JP2015197573A (en) * | 2014-04-01 | 2015-11-09 | セイコーエプソン株式会社 | Electro-optical module and electronic apparatus |
-
1988
- 1988-09-20 JP JP23562488A patent/JPH0283574A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5235383A (en) * | 1990-08-31 | 1993-08-10 | Canon Kabushiki Kaisha | Process cartridge and image forming apparatus using same |
| US7661830B2 (en) | 2004-03-22 | 2010-02-16 | Seiko Epson Corporation | Lamp device and projector equipped with the same |
| JP2015197573A (en) * | 2014-04-01 | 2015-11-09 | セイコーエプソン株式会社 | Electro-optical module and electronic apparatus |
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