JPH0282594A - Manufacture of hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To perform the press process of a printed wiring board with one type of a die and avoid the breakage of a hybrid integrated circuit device caused by a mechanical stress by a method wherein a plastic film is applied to the surface of a printed wiring mother board and the assembly and test of the device are carried out. CONSTITUTION:A board part 5 corresponding to one hybrid integrated circuit device is cut out by the punch 6 of a cutting die. Then the cut board 5 is put back to the original cutting position by the press back punch 8 of the die. A plastic film 10 is applied to the surface, on which elements or components are not mounted, of the printed wiring board which is cut and put back. As the wiring boards 4 and 5 are electrolytic-plated products, in order to avoid the contact between the electrolytic-plated wirings of the mother board 4 and the device board 5, and device board is tested by probing with test probe 15 after it is pushed up by the pushing up punch 13 of the die.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a hybrid integrated circuit device, and more particularly to a method of manufacturing a hybrid integrated circuit device using a printed wiring board as a substrate of the device.

[Conventional technology]

Conventionally, in the manufacturing method of this type of hybrid integrated circuit device, for example, as shown in FIG. After assembly (mounting of elements or parts) and inspection, a method has been used in which the portion to become the device is further separated from the base substrate by press working with a mold.

[Problem to be solved by the invention]

The above-described conventional method for manufacturing a hybrid integrated circuit device includes two steps: a substrate using a mold and a press working step. That is, there is a step of cutting the plating wire 51 before assembling the device, and a step of separating the device portion from the mother printed wiring board 50 after assembling and inspecting the device. Therefore, since it is necessary to prepare two types of molds, there is a drawback that the investment amount for the molds is large. Furthermore, in conventional manufacturing methods, after assembling the device, that is, mounting the device, there is a step of separating the device from the motherboard printed wiring board by press working with a mold, so mechanical stress is applied to the device at the time of cutting. The drawback is that the potential for destroying equipment is quite high.

[Means to solve the problem]

The method for manufacturing a hybrid integrated circuit device of the present invention involves separating a portion to become a substrate of the device from a base body by press working with a mold, and then pressing back the base body and returning it to the cutting position of the base body, and a printed wiring board base body and the device. The step of attaching a plastic film to the surface of the printed wiring board base corresponding to the surface on which no elements or components are mounted is included.

Therefore, in the present invention, since the step of separating the board of the part to become the device from the mother printed wiring board is only the - step, only one type of cutting die for press working is required. Furthermore, the press cutting process using a mold is performed before the device is assembled, that is, before the elements or parts are mounted.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1(A) to 1(H) are a plan view and a sectional view of the main steps of an embodiment of the present invention. FIG. 1(A) is a plan view of the printed wiring board base 4, in which electrolytically plated wires 1, 2
have. FIG. 1(B) is a sectional view of the substrate base. FIG. 1(C) is a cross-sectional view of the printed wiring board 4 in the cutting process, in which the board portion 5 equivalent to one hybrid integrated circuit device is cut off by the punch 6 of the cutting die, and FIG. 1(D)
The cut substrate 5 is returned to its original cutting position by a pressback punch 8. FIG. 1(E) shows that a plastic film of 1° is pasted on the surface of the printed wiring board which has been cut and pressed back, and where no elements or components are mounted. In this example, the substrate thickness was 0.25 mm, and the film was a polyimide base film with a thickness of 75 μm. FIG. 1(F) is a cross-sectional view of the assembled device with the semiconductor element 11 mounted thereon.

FIG. 1(G) is a cross-sectional view of the device characteristic inspection process,
Since the printed wiring boards 4 and 5 of this embodiment are electrolytically plated products, in order to avoid contact between the electrolytically plated wiring on the base board 4 and the device board 5, the device board is punched up by about 100 μm using a punch 13. Inspection is performed by probing with a test probe 15. In FIG. 1(H), the device 5, which has undergone the characteristic test, is held down by the holding jigs 17 and 18, and the device 5 is returned to the mother wiring board.

〔Effect of the invention〕

As explained above, the present invention involves separating the portion that will become the substrate of the hybrid integrated circuit device from the printed wiring board mother body by press working with a mold, pressing it back to return the substrate to the cutting position of the mother substrate, and then By assembling and inspecting the device with a plastic film affixed to the surface of the printed wiring board base corresponding to the surface on which no device elements or components are mounted, only one type of press mold is required for the board. be able to. That is, there is an effect that the investment amount for the mold can be reduced. Furthermore, since the substrate is only cut once before assembling the device, that is, before mounting elements and components, it is possible to prevent destruction of the device due to mechanical stress generated during cutting.

[Brief explanation of the drawing]

1(A) to 1(H) are plan views or longitudinal sectional views showing an embodiment of the present invention in the order of steps, and FIG. 2 is a plan view of a conventional example. Agent Patent Attorney Susumu Uchihara (A) CH) Off-line CD) (F) Taku 1 Figure 2

Claims (1)

[Claims] In a method of manufacturing a hybrid integrated circuit device using a printed wiring board as a substrate, the part that will become the device substrate is cut out from the patterned printed wiring board base using a mold, and then pressed back. After returning the mother body to the cut-out position, the device is assembled and inspected while a plastic film is pasted on the surface of the printed wiring board mother body corresponding to the surface on which no device elements or parts are mounted. A method for manufacturing a hybrid integrated circuit device.