JPH0282157A - Ultrasonic flaw detecting device - Google Patents
Ultrasonic flaw detecting deviceInfo
- Publication number
- JPH0282157A JPH0282157A JP63234084A JP23408488A JPH0282157A JP H0282157 A JPH0282157 A JP H0282157A JP 63234084 A JP63234084 A JP 63234084A JP 23408488 A JP23408488 A JP 23408488A JP H0282157 A JPH0282157 A JP H0282157A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- gate
- ultrasonic
- water column
- defect detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims abstract description 42
- 230000007547 defect Effects 0.000 claims abstract description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000000523 sample Substances 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 23
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 claims abstract description 6
- 230000005540 biological transmission Effects 0.000 claims description 11
- 238000012544 monitoring process Methods 0.000 claims 1
- 230000002950 deficient Effects 0.000 abstract description 3
- 230000000644 propagated effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は丸棒鋼、パイプ等の鉄鋼品の内質検査を超音
波を利用して行い、かつ水浸方式又は水柱方式を採用し
た超音波探傷装置に関する。[Detailed Description of the Invention] [Field of Industrial Application] This invention uses ultrasonic waves to inspect the internal quality of steel products such as round bars and pipes, and uses ultrasonic waves that employ a water immersion method or a water column method. Regarding flaw detection equipment.
第3図は従来の超音波探傷装置の1例を示す図である。 FIG. 3 is a diagram showing an example of a conventional ultrasonic flaw detection device.
第3図において(1)は長手方向に搬送される被検査材
、(2)は被検査材(1)に対面して配置され後述する
送信信号を受けて超音波信号を発生する超音波探触子、
(3)は探触子(2)を保持する探触子ホルダ、(4)
は探触子ホルダ+31 K設けられた給水孔(5)より
供給され、探触子(2)から発生した超音波信号を被検
査材f1+に伝播させるための接触媒体の水柱。In Fig. 3, (1) is the material to be inspected that is being conveyed in the longitudinal direction, and (2) is the ultrasonic probe that is placed facing the material to be inspected (1) and generates an ultrasonic signal in response to a transmission signal, which will be described later. tentacle,
(3) is a probe holder that holds the probe (2); (4)
is a water column of a contact medium supplied from the water supply hole (5) provided in the probe holder +31K to propagate the ultrasonic signal generated from the probe (2) to the material to be inspected f1+.
(6)は後述する送信信号発生部と受信部とゲート発生
部と信号処理部の間の同期をとるための同期部。(6) is a synchronization unit for synchronizing the transmission signal generation unit, reception unit, gate generation unit, and signal processing unit, which will be described later.
(71は同期部(6)からの同期信号で制御される送信
信号を発生させる送信信号発生部、侶)は探触子(2)
によって得られる超音波エコー信号を増幅する受信部、
(91は同期部(6)の同期信号で同期された欠陥検出
ゲートを作成するゲート発生部、α0はゲート発生部(
9)で作成された欠陥検出ゲートと受信部(81からの
超音波エコー信号により欠陥の有無を判定する信号処理
部である。上記のように被検査材il+と探触子(2)
の間に形成された水柱(4)によって超音波的音響結合
がなされた状態で、送信信号発生部(7)から発生した
送信信号は探触子(2)に入る。探触子(2)は送信信
号を超音波信号に変換して超音波を水柱(4)を介して
被検査材111に入射させるとともに被検査材(1)か
ら反射した超音波エコー信号を受信して電気信号に変換
する。探触子(2)によって電気信号に変換された超音
波エコー信号は受信部(81に入シ信号処理に必要なレ
ベルまで増幅される。受信部(8)の出力は信号処理部
aOにおいてゲート発生部(9)で作成された欠陥検出
用ゲートによりゲートをかけられて超音波探傷検査範囲
の欠陥の有無が判定される。(71 is a transmission signal generation unit that generates a transmission signal controlled by the synchronization signal from the synchronization unit (6), and mate) is the probe (2)
a receiving unit that amplifies the ultrasonic echo signal obtained by the
(91 is a gate generation unit that creates a defect detection gate synchronized with the synchronization signal of the synchronization unit (6), α0 is a gate generation unit (
This is a signal processing unit that determines the presence or absence of a defect based on the ultrasonic echo signal from the defect detection gate created in step 9) and the receiving unit (81).As described above, the inspection target material il+ and the probe (2)
The transmission signal generated from the transmission signal generator (7) enters the probe (2) while ultrasonic acoustic coupling is performed by the water column (4) formed between the two. The probe (2) converts the transmitted signal into an ultrasonic signal, makes the ultrasonic wave enter the inspected material 111 via the water column (4), and receives the ultrasonic echo signal reflected from the inspected material (1). and convert it into an electrical signal. The ultrasonic echo signal converted into an electrical signal by the probe (2) is amplified to the level required for signal processing at the receiving section (81).The output of the receiving section (8) is gated at the signal processing section aO. A gate is applied by the defect detection gate created in the generation section (9), and the presence or absence of a defect in the ultrasonic flaw detection inspection range is determined.
上記のような従来の超音波探傷装置において。 In conventional ultrasonic flaw detection equipment as mentioned above.
探触子(2)により得られた超音波エコー信号と、ゲー
ト発生部(91で作成された欠陥検出ゲートは第4図に
示すような信号となる。The ultrasonic echo signal obtained by the probe (2) and the defect detection gate created by the gate generator (91) result in a signal as shown in FIG.
第4図において、(()は超音波エコー信号、 6:I
)は欠陥検出用ゲートである。Tは送信信号、Sは被検
査材+11表面からの反射エコー、Bは被検査材(1)
底面からの反射エコーである。欠陥検出ゲート(ロ)は
上記の表面からの反射エコーSと底面からの反射エコー
Bの間に設定して欠陥部からの反射エコーを待機する。In Fig. 4, (() is an ultrasonic echo signal, 6:I
) is a gate for defect detection. T is the transmitted signal, S is the reflected echo from the surface of the inspected material + 11, B is the inspected material (1)
This is a reflected echo from the bottom. The defect detection gate (b) is set between the above-mentioned reflected echo S from the top surface and reflected echo B from the bottom surface, and waits for the reflected echo from the defective portion.
しかしながら、従来例においては、被検査材(りと探触
子(2)の間の水柱(4)の温度変化に基づく超音波伝
播速度の変化に対する補正機能を有していなり為、水温
の変化により超音波伝播速度が変わシ超音波エコー信号
と欠陥検出ゲートの位置関係がずれて第4図のB′及び
B′の如くになシ、欠陥検出ゲート内に被検査材fil
の底面エコーB′が入り欠陥検出能の低下の要因となる
。また2図示してbないが上記とは逆に被検査材(1)
の表面エコーS′が欠陥検出ゲート内に入る場合もある
。従来の装置は以上のような理由により、欠陥検出能が
低すま\使片するか、または欠陥検出能を高める為に被
検査材+11表面の反射エコーSに、これらの位置情報
を得る為のゲートをかけて被検査材(1)表面の反射信
号の位置情報により欠陥検出ゲート←)の位置をコント
ロールする方式が採用されてbる。However, in the conventional example, there is no correction function for changes in ultrasonic propagation velocity based on changes in the temperature of the water column (4) between the material to be inspected and the probe (2). As a result, the ultrasonic propagation speed changes, and the positional relationship between the ultrasonic echo signal and the defect detection gate shifts, as shown in B' and B' in Fig. 4.
The bottom surface echo B' is included and causes a decrease in defect detection ability. In addition, although it is not shown in Figure 2, the material to be inspected (1) is contrary to the above.
The surface echo S' may enter the defect detection gate. Due to the reasons mentioned above, conventional devices have low defect detection ability, or in order to increase the defect detection ability, the reflected echo S of the surface of the inspected material + 11 is used to obtain position information. A method is adopted in which the position of the defect detection gate ←) is controlled by applying a gate and using the position information of the reflected signal on the surface of the material to be inspected (1).
しかしながら、この方式は被検査材(り表面の反射信号
の位置情報を検知する為のゲート機能の追加及びその情
報を基に欠陥検出ゲートをコントロールする部分が複雑
になるなどの問題があった。However, this method has problems such as the addition of a gate function to detect the positional information of the reflected signal on the surface of the inspected material and the complexity of controlling the defect detection gate based on that information.
この発明は上記のような問題点を解決するためになされ
たものでゲート機能の追加及び欠陥検出ゲートのコント
ロール部分を複雑にする事なく、欠陥検出能を高くする
事を目的としてbる。This invention was made to solve the above-mentioned problems, and its purpose is to improve the defect detection ability without adding a gate function or complicating the control part of the defect detection gate.
この発明に係る超音波探傷装置においては、被検査材と
探触子の間に形成されている水柱の中の超音波の伝播速
度を把握して、被検査物から得られる超音波エコー信号
と欠陥検出ゲートのずれを補正するために、その水の温
度を計測する水温計と水温計から得られた信号で欠陥検
出ゲート位置を補正する演算回路を有するものである。In the ultrasonic flaw detection device according to the present invention, the propagation speed of ultrasonic waves in the water column formed between the inspected material and the probe is grasped, and the ultrasonic echo signal obtained from the inspected object is detected. In order to correct the deviation of the defect detection gate, it has a water temperature meter that measures the temperature of the water and an arithmetic circuit that corrects the position of the defect detection gate using the signal obtained from the water temperature meter.
この発明においては探触子と被検査材の間に在存する水
の超音波伝播速度の変化を水温を計測することによって
把握し、その伝播速度の変化分だけ欠陥検出ゲート位置
を補正するようなゲート位置補正演算回路により、欠陥
検田ゲート位置を適正な位置にコントロールするもので
ある。In this invention, changes in the ultrasonic propagation speed of water existing between the probe and the inspected material are ascertained by measuring the water temperature, and the defect detection gate position is corrected by the change in the propagation speed. A gate position correction calculation circuit controls the defect detection gate position to an appropriate position.
〔実施例〕 第1図はこの発明の一実施例を示す図であシ。〔Example〕 FIG. 1 is a diagram showing an embodiment of the present invention.
(1)〜0は上記の従来の装置と全く同一の構成である
。即ち、(1)は長手方向に搬送される被検査材。(1) to 0 have exactly the same configuration as the conventional device described above. That is, (1) is a material to be inspected that is transported in the longitudinal direction.
(2)は被検査材(1)に対面して配置され、送信信号
を受けて超音波を発生する超音波探触子、(3)は探触
子(2)を保持する探触子ホルダー、(4)は探触子(
2)から発生した超音波を被検査材+11に伝播させる
ための水柱、(5)は探触子ホルダー(3)に設けられ
た水柱形成のための給水孔、(6)は後述する送信信号
発生部と受信部とゲート発生部と信号処理部の間の同期
をとるための同期部、(7)は同期部(6)からの同期
信号で制御される送信信号を発生させる送信信号発生部
、IS)は探触子(2)によって得られる超音波エコー
信号を増幅する受信部、(9)は同期部(6)の同期信
号で同期された欠陥検出ゲートを作成するゲート発生部
、 Qlはゲート発生部(9)で作成された欠陥検出ゲ
ートと受信部(81からの超音波エコー信号により、超
音波探傷範囲内の欠陥の有無を判定する信号処理部、α
9は被検査材(1)と探触子(21の間に充満して水柱
を形成している水の温度を計測するための温度センサー
α2は温度センサー03で計測された温度情報を基に
超音波伝播速度の変化を算出して欠陥検出ゲートの位置
ずれを補正するためのゲート位置補正演算回路で第2図
に示す特性を有したものである。(2) is an ultrasonic probe that is placed facing the material to be inspected (1) and generates ultrasonic waves in response to transmitted signals; (3) is a probe holder that holds the probe (2); , (4) is the probe (
2) is a water column for propagating the ultrasonic waves generated to the inspected material +11, (5) is a water supply hole provided in the probe holder (3) to form a water column, and (6) is a transmission signal to be described later. A synchronization section for synchronizing the generation section, reception section, gate generation section, and signal processing section; (7) is a transmission signal generation section that generates a transmission signal controlled by the synchronization signal from the synchronization section (6); , IS) is a reception unit that amplifies the ultrasonic echo signal obtained by the probe (2), (9) is a gate generation unit that creates a defect detection gate synchronized with the synchronization signal of the synchronization unit (6), Ql α is a signal processing unit that determines the presence or absence of a defect within the ultrasonic flaw detection range based on the ultrasonic echo signal from the defect detection gate created by the gate generator (9) and the receiver (81).
9 is a temperature sensor for measuring the temperature of the water that fills between the material to be inspected (1) and the probe (21 and forms a water column). α2 is based on the temperature information measured by temperature sensor 03. This is a gate position correction calculation circuit for calculating the change in the ultrasonic propagation velocity and correcting the positional deviation of the defect detection gate, and has the characteristics shown in FIG.
このゲート位置補正演算回路は第2図に示す如く、水温
が高くなるとゲートの開始位置は早く。As shown in FIG. 2, this gate position correction calculation circuit starts the gate earlier as the water temperature increases.
水温が低くなるとゲートの開始位置は遅くなるように動
作して、超音波反射信号と欠陥検出ゲートの位置ずれを
補正していつも適正ゲートになるようにしたものである
。As the water temperature decreases, the gate starts at a later position, correcting the positional deviation between the ultrasonic reflection signal and the defect detection gate, so that the gate is always properly positioned.
この発明は以上1明した通シ、被検査材と探触子の間に
充満して水柱を形成している水の温度を計測し、その温
度情報を基に超音波伝播速度の変化を演算回路により欠
陥検出ゲートの位置補正を適正位置にコントロール出来
るため、装置を複雑にすることなく、欠陥検出能を高く
する事が可能である。The present invention is based on the above-mentioned principle.The present invention measures the temperature of the water that fills between the inspected material and the probe and forms a water column, and calculates changes in the ultrasonic propagation velocity based on the temperature information. Since the circuit can control the position correction of the defect detection gate to an appropriate position, it is possible to improve the defect detection ability without complicating the device.
第1図はこの発明の構成を示す図、第2図はこの発明の
ゲート位置補正演算回路の特性図、第3図は従来の装置
の構成を示す図、第4図は従来の装置の探触子から得ら
れる超音波信号を示す図である。
図において、(l)は被検査材、(2)は探触子、(3
)は探触子ホルダー、(4)は被検査材fi+と探触子
(2)の間に形成する水柱j(5)は水柱形成の為に探
触子ホルダー(3)に設けられた給水孔、(6)は同期
部、(71は送信信号発生部、(8)は受信部、(9)
はゲート発生部。
a・は信号処理部、αυは水温センサー、α3はゲート
位置補正演算回路。
なお、各図中同一符号は同−又は相当部分を示す。
第 1 図FIG. 1 is a diagram showing the configuration of the present invention, FIG. 2 is a characteristic diagram of the gate position correction calculation circuit of the present invention, FIG. 3 is a diagram showing the configuration of a conventional device, and FIG. 4 is a diagram showing the configuration of a conventional device. It is a figure which shows the ultrasonic signal obtained from a feeler. In the figure, (l) is the material to be inspected, (2) is the probe, and (3
) is the probe holder, (4) is the water column j formed between the inspected material fi+ and the probe (2) (5) is the water supply provided in the probe holder (3) to form the water column. hole, (6) is a synchronization section, (71 is a transmission signal generation section, (8) is a reception section, (9)
is the gate generation part. a. is a signal processing unit, αυ is a water temperature sensor, and α3 is a gate position correction calculation circuit. Note that the same reference numerals in each figure indicate the same or corresponding parts. Figure 1
Claims (1)
傷装置において、超音波を発生させるための送信信号発
生部と、超音波を授受する探触子と、超音波を被検査材
まで伝播させるための水柱と、探触子を保持する探触子
ホルダと、探触子より得られた超音波受信信号を増幅す
る受信部と、超音波探傷範囲を規定して、その範囲を監
視するための欠陥検出ゲート発生部と、欠陥の有無を判
定するための信号処理部と、前述の送信信号発生部と受
信部と欠陥検出ゲート発生部と信号処理部の間の同期を
とるための同期部と、前述の超音波伝播媒体の水柱の温
度を計測する水温計と、水温計から得られた情報を基に
前述の欠陥検出ゲートを最適位置にするために欠陥検出
ゲート位置の演算を行なう回路を有し、水柱の温度変化
にも自動的に追従するゲートを有する超音波探傷装置。In an ultrasonic flaw detection device that detects internal defects in the inspected object using ultrasonic waves, it includes a transmitting signal generator for generating ultrasonic waves, a probe that sends and receives ultrasonic waves, and a probe that propagates the ultrasonic waves to the inspected material. a water column for the detection, a probe holder for holding the probe, a receiver for amplifying the ultrasonic reception signal obtained from the probe, and for defining the ultrasonic flaw detection range and monitoring the range. a defect detection gate generation section, a signal processing section for determining the presence or absence of a defect, and a synchronization section for synchronizing the aforementioned transmission signal generation section, reception section, defect detection gate generation section, and signal processing section. , a water thermometer that measures the temperature of the water column of the ultrasonic propagation medium, and a circuit that calculates the position of the defect detection gate to optimize the position of the defect detection gate based on the information obtained from the water thermometer. Ultrasonic flaw detection equipment with a gate that automatically follows temperature changes in the water column.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63234084A JPH0282157A (en) | 1988-09-19 | 1988-09-19 | Ultrasonic flaw detecting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63234084A JPH0282157A (en) | 1988-09-19 | 1988-09-19 | Ultrasonic flaw detecting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0282157A true JPH0282157A (en) | 1990-03-22 |
Family
ID=16965359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63234084A Pending JPH0282157A (en) | 1988-09-19 | 1988-09-19 | Ultrasonic flaw detecting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0282157A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5251892A (en) * | 1991-01-19 | 1993-10-12 | Samsung Electronics Co., Ltd. | Method of and apparatus for ejecting paper in a printing system |
-
1988
- 1988-09-19 JP JP63234084A patent/JPH0282157A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5251892A (en) * | 1991-01-19 | 1993-10-12 | Samsung Electronics Co., Ltd. | Method of and apparatus for ejecting paper in a printing system |
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