JPH0282103A - Gauge base incorporated with reinforcing material for strain gauge and its manufacture - Google Patents
Gauge base incorporated with reinforcing material for strain gauge and its manufactureInfo
- Publication number
- JPH0282103A JPH0282103A JP23435788A JP23435788A JPH0282103A JP H0282103 A JPH0282103 A JP H0282103A JP 23435788 A JP23435788 A JP 23435788A JP 23435788 A JP23435788 A JP 23435788A JP H0282103 A JPH0282103 A JP H0282103A
- Authority
- JP
- Japan
- Prior art keywords
- gauge
- base
- strain
- strain gauge
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012779 reinforcing material Substances 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000000463 material Substances 0.000 claims abstract description 67
- 239000011347 resin Substances 0.000 claims abstract description 31
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 239000011810 insulating material Substances 0.000 claims abstract description 8
- 238000002156 mixing Methods 0.000 claims abstract description 8
- 239000010409 thin film Substances 0.000 claims abstract description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000843 powder Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 238000010298 pulverizing process Methods 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- 239000011888 foil Substances 0.000 abstract description 14
- 239000007788 liquid Substances 0.000 abstract description 13
- 239000005001 laminate film Substances 0.000 abstract description 5
- 238000001259 photo etching Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 18
- 239000010408 film Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- SUDBRAWXUGTELR-HPFNVAMJSA-N 5-[[(2r,3r,4s,5s,6r)-3,4,5-trihydroxy-6-(hydroxymethyl)oxan-2-yl]oxymethyl]-1h-pyrimidine-2,4-dione Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OCC1=CNC(=O)NC1=O SUDBRAWXUGTELR-HPFNVAMJSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000001953 sensory effect Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ひずみゲージの強化材入りゲージベースおよ
びその製造方法に関し、より詳細には。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a reinforcing gauge base for a strain gauge and a method for manufacturing the same, and more particularly to a reinforcing gauge base for a strain gauge and a method for manufacturing the same.
ベース材の一方の面に抵抗材料または半導体材料による
受感部が形成され他方の面が被測定体に添着されて該被
測定体に発生したひずみを検出するひずみゲージの上記
ベース材より成るゲージベースおよびその製造方法に関
するものである。A strain gauge made of the above-mentioned base material, in which a sensing part made of a resistive material or a semiconductor material is formed on one surface of the base material, and the other surface is attached to an object to be measured to detect the strain generated in the object to be measured. The present invention relates to a base and a method for manufacturing the same.
一般に箔ひずみゲージは、ゲージベースと、このゲージ
ベースの表面に抵抗材料または半導体材料によって形成
されるひずみ受感部と、このひずみ受感部を覆うラミネ
ートフィルム等で構成されている。そして、ゲージベー
スには、従来、エポキシ樹脂、フェノールエポキシ樹脂
およびポリイミド樹脂がフィルム状に形成された市販の
、いわゆる絶縁フィルムがベース材として用いられてい
た。In general, a foil strain gauge is composed of a gauge base, a strain sensitive section formed of a resistive material or a semiconductor material on the surface of the gauge base, and a laminate film or the like that covers this strain sensitive section. Conventionally, a commercially available so-called insulating film in which an epoxy resin, a phenol epoxy resin, and a polyimide resin are formed into a film shape has been used as a base material for the gauge base.
また、このような市販品を用いない場合は、基材に樹脂
を含浸させた上で、これをフィルム状に形成して製造し
ていた。つまり、上記基材としては紙、ガラスペーパー
およびアスベスト紙等を用い、上記樹脂としては液状の
エポキシ樹脂、フェノール樹脂、フェノールエポキシ樹
脂およびシリコーン樹脂等を用い、樹脂液の中に基材を
浸漬しくデイツプ法と呼ばれている)、所定時間後、こ
の樹脂液から取り出し、加熱、加圧などの処理によって
フィルム状に形成するという製造方法があった・
〔発明が解決しようとする課題〕
一般に、ひずみゲージのゲージベースに要求される諸条
件(以下「ゲージベースの条件」という)には、次のよ
うなものがある。In addition, when such a commercially available product is not used, the base material is impregnated with a resin and then formed into a film. In other words, paper, glass paper, asbestos paper, etc. are used as the base material, liquid epoxy resin, phenol resin, phenol epoxy resin, silicone resin, etc. are used as the resin, and the base material is immersed in the resin liquid. There is a manufacturing method in which the resin is removed from the resin liquid after a predetermined period of time and formed into a film by heating, pressurizing, etc. [Problems to be solved by the invention] Generally, The conditions required for the gauge base of a strain gauge (hereinafter referred to as "gauge base conditions") include the following.
(イ)硬化時の収縮率が小さいこと。(a) The shrinkage rate during curing is small.
(ロ)硬化係数が大きいこと。(b) It has a large hardening coefficient.
(ハ)硬化後ひび割れ、そり、ねじれなどが生じないこ
と。(c) There should be no cracking, warping, twisting, etc. after curing.
(ニ)強度が温度、湿度、ひずみ値に対して充分である
こと。(d) Strength is sufficient against temperature, humidity, and strain values.
(ホ)吸湿性がないこと。(e) No hygroscopicity.
(へ)痛労限界が高いこと。(f) Having a high pain limit.
(ト)温度、湿度に対して電気絶縁性が高く保たれるこ
と。(g) Maintain high electrical insulation against temperature and humidity.
(チ)耐薬品性があること。(h) Must be chemical resistant.
ゲージベースの条件は1以上であるが、一般の絶縁フィ
ルムに比べて特に電気絶縁とクリープ特性が要求される
。つまり、常温はもとより、使用温度範囲の限界までク
リープがなく、温度限界を越すと急激にクリープが発生
するものがむしろ適している。また硬度が高く、弾性係
数が温度限界まで維持されるものが望ましい。Although the gauge-based conditions are 1 or more, electrical insulation and creep properties are particularly required compared to general insulating films. In other words, it is rather suitable that there is no creep not only at room temperature but also at the limit of the operating temperature range, and that creep occurs rapidly when the temperature limit is exceeded. It is also desirable to have high hardness and maintain the elastic modulus up to the temperature limit.
さて、従来のゲージベースにおいては、上述した市販の
絶縁フィルムを用いる場合、寸法(特に厚み)および上
記ゲージベースの条件を満足するも・のが少ないという
問題があった。つまり、ゲージベースは薄い程プラスチ
ック(樹脂)のレオロジカルな影響がなく、ひずみ伝達
がよいのでクリープも発生しないが、従来は20μm程
度の厚い絶縁フィルムしかなかった。従って、このよう
な絶縁フィルムをゲージベースに用いたひずみゲージは
、硬くて被測定体の形状になじまず、被測定体にひずみ
ゲージを接着する際の取扱いが面倒になり、いわゆるひ
ずみゲージのフレキシビリティが悪いという問題があっ
た。Now, in conventional gauge bases, when using the above-mentioned commercially available insulating films, there has been a problem that there are few that satisfy the dimensions (particularly thickness) and the above-mentioned conditions for the gauge base. In other words, the thinner the gauge base is, the less the rheological influence of the plastic (resin), the better the strain transmission, and the less creep occurs, but conventionally there was only a thick insulating film of about 20 μm. Therefore, strain gauges using such insulating films as gauge bases are hard and do not conform to the shape of the object to be measured, making it difficult to handle when bonding the strain gauge to the object to be measured, and the so-called flexible strain gauges. There was a problem with poor stability.
一方、従来のゲージベースの製造方法には、基材への樹
脂の含浸性が低く、樹脂が基材の中に均一に浸漬しにく
いという問題があるばかりでなく、気泡が混入する場合
もあった。このように含浸気泡があると、ひずみ伝達が
劣化し、ひずみゲージの出力が不安定になったり、クリ
ープが生じるという問題が発生する。また、上記気泡部
分に集中応力や残留ひずみを受けてひずみゲージの耐久
性(例えば疲労限界)が劣化する。さらに、気泡部分に
は空気中の水分が混入するため、耐温性が劣化し、且つ
ひずみゲージの絶縁特性が劣化するという問題があった
。On the other hand, conventional gauge-based manufacturing methods not only have the problem of low impregnation of the resin into the base material, making it difficult for the resin to soak uniformly into the base material, but also air bubbles. Ta. The presence of such impregnated bubbles causes problems such as deterioration of strain transmission, unstable strain gauge output, and creep. In addition, the bubble portion receives concentrated stress and residual strain, which deteriorates the durability (for example, fatigue limit) of the strain gauge. Furthermore, since moisture in the air gets mixed into the bubble portion, there are problems in that the temperature resistance deteriorates and the insulation properties of the strain gauge deteriorate.
さらにゲージベースとひずみ受感部を形成する箔材との
縦弾性係数(ヤング率)、線膨張係数、熱伝達係数など
の物性定数の差異から、上記箔材とゲージベースとを裏
打ち(バッキング)すると、箔材側が凸面、ゲージベー
スの上記箔材を付けていない面側か凹面となるようにひ
ずみゲージがカールしてしまい、微小なゲージ長のひず
みゲージを製作する場合に、グリッド(ひずみ受感部)
のアキュタンス不良や外形不良などが発生して製作歩留
りが低下するという問題があった。Furthermore, due to the difference in physical constants such as longitudinal elastic modulus (Young's modulus), linear expansion coefficient, and heat transfer coefficient between the gauge base and the foil material forming the strain sensing part, the foil material and the gauge base are lined (backing). As a result, the strain gauge curls so that the foil side is convex and the side of the gauge base to which the foil material is not attached is concave. sensory part)
There was a problem in that the manufacturing yield was lowered due to the occurrence of defects in accutance and defective appearance.
また、このようにカールしたひずみゲージは、接着する
際に加圧むらを生じたり、接着材(接着面)に気泡が入
りやすく結果的にひずみゲージの特性劣化、つまり疲労
限界の低下、クリープの発生、機械的ヒステリシスの増
大を招くという問題があり、また電気的な接続不良も生
じやすいという問題があった。In addition, such curled strain gauges may cause uneven pressure when bonded, and air bubbles may easily enter the adhesive (bonding surface), resulting in deterioration of the strain gauge's characteristics, lowering its fatigue limit, and increasing the risk of creep. There is a problem in that this leads to an increase in mechanical hysteresis and electrical connection failure.
本発明は、上述の事情に鑑みてなされたもので。The present invention has been made in view of the above circumstances.
その目的とするところは、極薄のフィルム状に形成した
ことで接着性およびひずみ伝達性が頗る向上するにもか
かわらず耐熱性、耐湿性、疲労寿命の飛躍的な向上が実
現でき、もってひずみゲージの諸特性を向上させ得るひ
ずみゲージの強化材入りゲージベースを提供すると共に
均一で従来のものよりも極薄な上記ゲージベースを容易
に製作加工し得るひずみゲージの強化剤入りゲージベー
スの製造方法を提供することにある。The aim is that by forming it into an ultra-thin film, it will not only significantly improve adhesiveness and strain transmission properties, but also dramatically improve heat resistance, moisture resistance, and fatigue life. Manufacture of a reinforcing material-containing gauge base for a strain gauge, which provides a reinforcing material-containing gauge base for a strain gauge that can improve various properties of the gauge, and also enables easy manufacturing and processing of the gauge base, which is uniform and extremely thinner than conventional gauge bases. The purpose is to provide a method.
〔課題を解決するための手段および方法〕本発明は、上
述の目的を達成するために、ベース材の一方の面に抵抗
材料または半導体材料による受感部が形成され他方の面
が被測定体に添着されて該被測定体に発生したひずみを
検出するひずみゲージの上記ベース材より成るゲージベ
ースにおいて、所定の樹脂材料と、絶縁材料より成る超
微粒子状の絶縁粉末とを具備し、上記絶縁粉体を上記樹
脂材料に混入して上記ベース材を均一で極薄のフィルム
状に形成するように構成したことを特徴としており、
また、本発明に係るひずみゲージの強化材入りゲージベ
ースは、所定の樹脂材料に絶縁材料から成る超微粒子状
の絶縁粉末を混入し攪拌・混合・粉砕を行って調整し、
この調整された上記樹脂材料を離型材に塗布して均一で
極薄なフィルム状の上記ベース材を形成するようにした
ことを特徴としている。[Means and Method for Solving the Problems] In order to achieve the above-mentioned objects, the present invention provides a base material in which a sensing portion made of a resistive material or a semiconductor material is formed on one surface of the base material, and a sensing portion made of a resistive material or a semiconductor material is formed on the other surface of the base material. A gauge base made of the above-mentioned base material of a strain gauge attached to a material to detect strain generated in the object to be measured includes a predetermined resin material and ultrafine insulating powder made of an insulating material, and the above-mentioned insulating The reinforcing material-containing gauge base of the strain gauge according to the present invention is characterized in that the base material is formed into a uniform and extremely thin film by mixing powder into the resin material. Ultrafine insulating powder made of insulating material is mixed into a specified resin material and adjusted by stirring, mixing, and pulverizing.
A feature of the present invention is that the adjusted resin material is applied to a mold release material to form the base material in the form of a uniform and extremely thin film.
上記のように構成された強化材入りゲージベースは、絶
縁粉末により樹脂材料が強化され、ベース材のヤング率
が増大すると共にひずみ伝達効果が高くなり、機械的強
度が増大すると共に疲労寿命が長くなり、耐熱性が高く
なる。そして、極薄に形成されるから被測定対象の形状
によくなじんで接着性が向上する。さらに均一に形成さ
れるから気泡が生じること等なく耐湿性が向上する。In the gauge base with reinforced material constructed as above, the resin material is strengthened by insulating powder, the Young's modulus of the base material is increased, the strain transmission effect is enhanced, the mechanical strength is increased, and the fatigue life is long. This increases heat resistance. Since it is formed extremely thin, it conforms well to the shape of the object to be measured, improving adhesion. Furthermore, since it is formed uniformly, no bubbles are generated, and moisture resistance is improved.
また、絶縁粉末によって強化され且つ極薄であるからカ
ール性が改善され製作の歩留りが向上する。In addition, since it is reinforced by insulating powder and is extremely thin, curling properties are improved and manufacturing yield is improved.
また、製造方法として、絶縁粉末が混入されて調整され
た樹脂そのものをフィルム状に形成するので、容易に極
薄な形状が得られ、攪拌・混合・粉砕を行って調整する
ので均一なベース材が容易に得られる。In addition, as a manufacturing method, the resin itself is mixed with insulating powder and adjusted to form a film, so it is easy to obtain an ultra-thin shape, and because it is adjusted by stirring, mixing, and pulverizing, a uniform base material can be obtained. can be easily obtained.
以下、本発明の実施例を添付図面に基づいて具体的に説
明する。Embodiments of the present invention will be specifically described below with reference to the accompanying drawings.
第1図および第2図は、本発明に係るひずみゲージの強
化材入りゲージベースが接着剤を介して被8111定休
の表面に接着した状態をそれぞれ示す中央縦断面図およ
び平面図である。FIG. 1 and FIG. 2 are a central vertical cross-sectional view and a plan view, respectively, showing a state in which a reinforcing material-containing gauge base of a strain gauge according to the present invention is adhered to the surface of a cover 8111 with an adhesive.
第1図および第2図において、1は1本発明に係るひず
みゲージの強化材入りゲージベース(以下単に「ゲージ
ベースJという)で、1aおよび1bはこのベースゲー
ジ1の一方の面としての上面および他方の面としての下
面である。2は上記ベース1の上面18に、圧延形成さ
れた抵抗箔または蒸着あるいはスパッタリング等の手段
によって形成された抵抗箔、3はこの抵抗箔2をフォト
エツチング法等の手段によって蛇行状に形成されたひず
み受感部としてのグリッド、4はこのグリッド3の両端
部にグリッド3と同時に形成されたゲージタブ、5はこ
のゲージタブ4に一端がスポット溶接または半田付等の
手段により接続されたゲージリード、6は防湿および損
傷防止のためにグリッド3およびゲージタブ4およびこ
れらを添着支持するゲージベース1の上面la側を覆う
ラミネートフィルム、7はひずみゲージ用の接着剤、8
はこの接着剤7によってゲージベース1の下面1bが接
着される被測定体である。In FIGS. 1 and 2, 1 is a reinforcing material-containing gauge base (hereinafter simply referred to as "gauge base J") of the strain gauge according to the present invention, and 1a and 1b are upper surfaces of the base gauge 1. 2 is a resistance foil formed on the upper surface 18 of the base 1 by rolling or by vapor deposition or sputtering, and 3 is a resistance foil formed by photo-etching the resistance foil 2. 4 is a gauge tab formed at both ends of the grid 3 at the same time as the grid 3; 5 is a gauge tab 4 having one end spot welded or soldered, etc.; 6 is a laminate film that covers the grid 3 and gauge tab 4 and the upper surface la side of the gauge base 1 that attaches and supports them for moisture proofing and damage prevention; 7 is an adhesive for strain gauge; 8
is an object to be measured to which the lower surface 1b of the gauge base 1 is adhered by the adhesive 7.
尚、ゲージベース1、グリッド3、ゲージタブ4、ゲー
ジリード5およびラミネートフィルム6をもってひずみ
ゲージ9を構成している。Note that the strain gauge 9 is composed of the gauge base 1, the grid 3, the gauge tab 4, the gauge lead 5, and the laminate film 6.
第3図および第4図は、本発明に係るゲージベースの製
造方法に用いられるホイラーの構成を示す縦断面図およ
び平面図である。3 and 4 are a longitudinal sectional view and a plan view showing the configuration of a wheeler used in the method for manufacturing a gauge base according to the present invention.
第3図および第4図において、10は上端に開口部10
aを、下端に底部10bをそれぞれ有した円筒状のカバ
ー、11はカバー10の略中心部に底部fobから突出
した回動可能な軸11aに支持されて平坦な上面11b
を有する略円板状の回転板、12はこの回転板11の上
面11bにセットされた離型材、13.13a 、13
bは調整済の樹脂材料としての樹脂液で、このうち、1
3は上記離型材12上に滴下された状態、13bは滴下
中の状態、13aは滴下させる容器14に収納された状
態における樹脂液である。尚、軸11aは、図示しない
原動機によって回転駆動されるように構成されている。In FIGS. 3 and 4, 10 is an opening 10 at the upper end.
a is a cylindrical cover having a bottom portion 10b at the lower end, and 11 is a flat upper surface 11b supported by a rotatable shaft 11a protruding from the bottom fob at approximately the center of the cover 10.
12 is a release material set on the upper surface 11b of the rotary plate 11, 13.13a, 13
b is a resin liquid as an adjusted resin material, of which 1
3 is the resin liquid in a state where it has been dropped onto the mold release material 12, 13b is in the state where it is being dropped, and 13a is the resin liquid in the state where it is stored in the container 14 in which it is dropped. Note that the shaft 11a is configured to be rotationally driven by a prime mover (not shown).
第5図は、本実施例のひずみゲージ9と従来のひずみゲ
ージ(図示せず)との特性を比較して示す特性図である
。FIG. 5 is a characteristic diagram comparing and showing the characteristics of the strain gauge 9 of this embodiment and a conventional strain gauge (not shown).
第6図〜第8図は、本実施例の特性試験を示すグラフで
、第6図は疲労寿命試験、第7図はクリープ試験、第8
図は機械的ヒステリシス試験を示している。Figures 6 to 8 are graphs showing the characteristic tests of this example. Figure 6 is the fatigue life test, Figure 7 is the creep test, and Figure 8 is the graph showing the characteristic tests of this example.
The figure shows a mechanical hysteresis test.
まず、第1図および第2図に示す本実施例のゲージベー
ス1の製造方法を説明する。First, a method of manufacturing the gauge base 1 of this embodiment shown in FIGS. 1 and 2 will be described.
樹脂材料としてのエポキシ樹脂液に絶縁材料としての窒
化ケイ素より成る超微粒子状(0,1μm以下)の絶縁
粉末としての強化材を混入し、攪拌・混合・粉砕して化
学的および機械的な処理を行う。A reinforcing material in the form of ultrafine particulate (0.1 μm or less) insulating powder made of silicon nitride as an insulating material is mixed into an epoxy resin liquid as a resin material, and then chemically and mechanically treated by stirring, mixing, and pulverizing. I do.
尚、この処理には混練器およびボールミル等を用いる。Note that a kneader, a ball mill, etc. are used for this treatment.
このように調整された上記樹脂液、つまり調整済みの樹
脂液を例えば厚さ25〜50μrnのポリエステルフィ
ルム等より成る離型材に塗布して乾燥、焼付処理を行い
、上記離型材を取り去ることでゲージベースが製作され
る。この操作(処理)には、例えば第3図および第4に
示したホイラーが用いられる。The resin liquid adjusted in this way, that is, the adjusted resin liquid, is applied to a mold release material made of, for example, a polyester film with a thickness of 25 to 50 μrn, dried and baked, and the mold release material is removed to form a gauge. The base is made. For this operation (processing), for example, the wheeler shown in FIGS. 3 and 4 is used.
つまり、ホイラーの回転板11の上面11bに上記離型
材12をセットし、形成しようとするゲージベースの面
積に対応する量の樹脂液13を離型材12上に滴下させ
た上で、回転板11を所定の回転数を保持した状態で所
定時間回転させる。That is, the mold release material 12 is set on the upper surface 11b of the rotary plate 11 of the wheeler, and an amount of resin liquid 13 corresponding to the area of the gauge base to be formed is dropped onto the mold release material 12, and then the rotary plate 11 is is rotated for a predetermined time while maintaining a predetermined rotation speed.
そして、この回転によって樹脂液13が離型材12上で
膜状に展延されて塗布された状態になる。By this rotation, the resin liquid 13 is spread and coated on the mold release material 12 in the form of a film.
この状態のま、ま離型材12をホイラーから取り出し、
恒温槽等にて乾燥、焼付処理を行う。そして上述のよう
に焼付後、離型材を取り去ることで、ゲージベースが製
作される。In this state, take out the mold release material 12 from the wheeler,
Dry and bake in a constant temperature bath, etc. After baking as described above, the mold release material is removed to produce a gauge base.
次に、第1図および第2図に示すひずみゲージ9の製造
工程を説明する。Next, the manufacturing process of the strain gauge 9 shown in FIGS. 1 and 2 will be explained.
まず、上述のように製作されたゲージベース1を裁断し
て所望の形状に整える。一方、グリッド3を構成する抵
抗箔の箔材を検査した上で所定の形状に裁断して熱処理
を行う。この抵抗箔を整形されたゲージベースで裏打ち
(バッキング)し、その後フォトエツチング法により、
エツチングを行い、次いで形状検査、裁断、抵抗、11
整を順次行い、加工されたゲージリード5をゲージタブ
4に点溶接または半田付等により取付ける。そして。First, the gauge base 1 manufactured as described above is cut into a desired shape. On the other hand, the foil material of the resistance foil constituting the grid 3 is inspected, cut into a predetermined shape, and heat-treated. This resistance foil is lined with a shaped gauge base, and then photo-etched.
Etching, then shape inspection, cutting, resistance, 11
The gauge lead 5 thus processed is attached to the gauge tab 4 by spot welding or soldering. and.
グリッド3の抵抗値を測定して分類を行い、ラミネート
フィルム6を裁断した上でゲージベース1の上面la側
を覆って仕上げとなる。The resistance value of the grid 3 is measured and classified, and the laminate film 6 is cut and then the upper surface la side of the gauge base 1 is covered to finish.
次に、第5図に基づいて本実施例の特性を従来タイプの
ものと比較しながら説明する。Next, the characteristics of this embodiment will be explained based on FIG. 5 while comparing them with those of the conventional type.
まず特性項目1の疲労寿命は、2倍強に向上する。尚、
この疲労寿命の測定条件は、室温にて第6図に示すよう
に、±1500X10−’ひずみを交番的に与え、寿命
に達したか否かの判定は、ひずみゲージ9の出力を監視
しつつひずみを与えない零点、+1500X10−’ひ
ずみに対応するTENおよび一1500xlO−’ひず
みに対応するCOMにおいてそれぞれ100XIO−’
ひずみに対応するA、8以上の変化が現れた場合、およ
びひずみゲージ9の出力にスパイクノイズが現れた場合
のいずれか一方の現象が起こったときを寿命に達したと
判定している。First, the fatigue life of characteristic item 1 is improved by more than twice. still,
The fatigue life measurement conditions are as shown in Fig. 6 at room temperature, where a strain of ±1500 x 10-' is applied alternately, and whether or not the life has been reached is determined by monitoring the output of the strain gauge 9. Zero points without strain, TEN corresponding to a strain of +1500X10-' and COM corresponding to a strain of -1500XIO-', respectively 100XIO-'
It is determined that the life has been reached when either one of the following phenomena occurs: a change of A, 8 or more corresponding to the strain, or a spike noise appears in the output of the strain gauge 9.
特性項目2の歪限界(伸び特性)は、2倍弱向上する。The strain limit (elongation property) of property item 2 is improved by a little less than twice.
このときの測定条件は、室温で抵抗箭2の剥離またはグ
リッド3の断線が発生するまでひずみゲージ9を引張っ
たときのものである。The measurement conditions at this time were such that the strain gauge 9 was pulled at room temperature until the resistance wire 2 peeled off or the grid 3 broke.
特性項目3の耐熱性は、ひずみゲージとしての耐熱性で
、80℃の向上があった。The heat resistance of characteristic item 3 is the heat resistance as a strain gauge, and there was an improvement of 80°C.
特性項目4の接着性は、JISK6851 r接着剤の
引張りせん断接層強さ試験方法」に準拠し、ゲージベー
ス1を接着剤で試験片に取付け、引張りせん断時のせん
断強さで評価した結果、2倍向上した。Adhesiveness of characteristic item 4 was evaluated by attaching gauge base 1 to the test piece with adhesive and evaluating the shear strength during tensile shearing in accordance with JIS K6851 r Adhesive Tensile Shear Bonding Strength Test Method. Improved by 2 times.
特性項目5のクリープは、室温一定で一定負荷(±10
0OXIO”’ひずみ)を与えて時間経過に伴うひずみ
ゲージ9の出力変化を測定した結果。Characteristic item 5, creep, is measured at a constant room temperature and a constant load (±10
The results of measuring the change in the output of the strain gauge 9 over time by applying a strain of 0OXIO''.
第7図に示すようにある測定例では1時間で4.5με
と少ない変化に止まり、最終的な測定(試験)結果では
、2倍向上した。As shown in Figure 7, in one measurement example, 4.5με in one hour.
The final measurement (test) results showed a two-fold improvement.
特性項目6の耐湿性は、試験片に取付けたひずみゲージ
9を、温度20℃、湿度62%RHと温度45℃、湿度
90%RHの雰囲気にサイクリックに暴露し、20サイ
クルだけ繰返した後のひずみゲージ9の零ドリフトを測
定した結果、2倍向上した。The moisture resistance of property item 6 is determined by exposing the strain gauge 9 attached to the test piece to an atmosphere of 20°C and 62% RH and 45°C and 90% RH, and repeating 20 cycles. As a result of measuring the zero drift of the strain gauge 9, it was improved by two times.
特性項目7の絶縁抵抗は、上記特性項目6の試験後に被
測定物(導体)8とゲージリード5との間に直流電圧5
0Vを印加して測定した結果、2X107倍向上した。The insulation resistance of characteristic item 7 is the DC voltage 5 between the measured object (conductor) 8 and the gauge lead 5 after the test of characteristic item 6 above.
As a result of measurement with 0V applied, the improvement was 2X107 times.
特性項目8の最小曲率半径は、いわゆるひずみゲージの
フレキシビリティの有無を試験するもので、被測定物8
に取付可能な最小曲率半径を意味し、ゲージ長1mのひ
ずみゲージで比較測定した結果、1.5倍強向上した。Characteristic item 8, the minimum radius of curvature, is used to test the flexibility of the strain gauge.
This refers to the minimum radius of curvature that can be attached to a strain gauge, and as a result of comparative measurements using a strain gauge with a gauge length of 1 m, it was improved by over 1.5 times.
特性項目9のゲージベース1の厚みは、半分に減少させ
ることができた。The thickness of the gauge base 1 in characteristic item 9 could be reduced by half.
特性項目10のドリフトは、曲面に取付けた場合のドリ
フトの意味で、温度80”C1試験体の曲!1! r
= 10mm、試験時間24h、該試験体に応力が無い
状態で時間経過に伴う零点の変化を測定した結果、3倍
向上した。Drift in characteristic item 10 means the drift when installed on a curved surface, and the temperature of the test specimen at 80" C1 is 1! r
= 10 mm, test time was 24 hours, and the change in the zero point over time was measured with no stress on the test specimen, and the results showed a three-fold improvement.
特性項目11のゲージベース1のヤング率は。The Young's modulus of the gauge base 1 of characteristic item 11 is.
2.5倍向上した。特性項目12の線膨張係数は、4倍
弱〜5倍向上した。It was improved by 2.5 times. The linear expansion coefficient of characteristic item 12 was improved by a little less than 4 times to 5 times.
特性項目13の熱伝達係数(単位: 10−’cal/
5ec−CIIl/°C−all) は2.5倍強向
上した。Heat transfer coefficient of characteristic item 13 (unit: 10-'cal/
5ec-CIIl/°C-all) was improved by a little more than 2.5 times.
特性項目14の機械的ヒステリシスは、広く解釈すれば
ひずみ伝達効果をも意味し、第8図に示すように機械的
ひずみεm=±3000X10−’ひず7みを与えたと
きの負荷の増減サイクルの最大値Ml、M2を測定した
結果、1.4 傍白上した。Broadly interpreted, the mechanical hysteresis in characteristic item 14 also means the strain transfer effect, and as shown in Figure 8, the load increase/decrease cycle when a mechanical strain εm=±3000×10−' strain 7 is applied. As a result of measuring the maximum values Ml and M2, the results were 1.4.
このように本実施例のゲージベースは、従来に比べて半
分の15μmと極薄で且つ均一に形成されているから、
ヤング率が大きく、ひずみ伝達効果が高いという利点が
ある。さらに、均一であることから気泡の混入がなく、
耐湿性に優れ、機械的強度が向上し、疲労寿命が長いと
いう利点がある。In this way, the gauge base of this embodiment is extremely thin at 15 μm, which is half that of the conventional one, and is uniformly formed.
It has the advantage of having a large Young's modulus and a high strain transmission effect. Furthermore, since it is uniform, there are no air bubbles mixed in.
It has the advantages of excellent moisture resistance, improved mechanical strength, and long fatigue life.
また、強化材を混入することによりゲージベース1のみ
ならずひずみゲージ9の耐熱性が向上すると共にぬれ性
が改善され、接着性が向上するという利点がある。Further, by incorporating the reinforcing material, there is an advantage that not only the heat resistance of the gauge base 1 but also the strain gauge 9 is improved, the wettability is improved, and the adhesiveness is improved.
さらに、極薄であり、線膨張係数が小さく、ヤング率が
被測定体8に近づくため、カール性が改善され、製作の
歩留りが向上すると共に接着の作業性も向上するという
利点がある。Furthermore, since it is extremely thin, has a small coefficient of linear expansion, and has a Young's modulus close to that of the object to be measured 8, it has the advantage of improved curling properties, improved manufacturing yield, and improved workability of bonding.
尚、本発明は、上述の実施例に限定されることなく、そ
の要旨を逸脱しない範囲内で種々の変形実施ができるも
のである。It should be noted that the present invention is not limited to the above-described embodiments, and can be modified in various ways without departing from the spirit thereof.
例えば、実施例の樹脂液は、エポキシ樹脂に限ることな
く、他のフェノール樹脂、フェノールエポキシ樹脂およ
びシリコーン樹脂のいずれかを用いてもよい。For example, the resin liquid in the examples is not limited to epoxy resin, and any one of other phenol resins, phenol epoxy resins, and silicone resins may be used.
また、強化材は、窒化ケイ素に限ることなく、アルミナ
、シリカ、ホウ素のいずれかを用いてもよい。Further, the reinforcing material is not limited to silicon nitride, and any one of alumina, silica, and boron may be used.
また、グリッド3は、抵抗箔2で構成されるに限らず、
半導体材料で構成してもよい。Furthermore, the grid 3 is not limited to being composed of the resistance foil 2;
It may also be made of semiconductor material.
以上詳述したように、本発明によれば、ゲージベースを
極薄のフィルム状に形成し得ると共に線膨張係数が小さ
く、熱伝達係数が大きくでき、接着性およびひずみ伝達
性が頗る良好で、耐熱性、耐湿性、疲労寿命を飛躍的に
向上させることができ、もってひずみゲージの諸特性を
大幅に向上させ得るひずみゲージの強化材入りゲージベ
ースを提供することができると共に、均一で極薄な上記
ゲージベースを容易に製作加工し得る製造方法を提供す
ることができる。As detailed above, according to the present invention, the gauge base can be formed into an ultra-thin film shape, the linear expansion coefficient is small, the heat transfer coefficient is large, and the adhesiveness and strain transferability are excellent. It is possible to provide a reinforcing material-containing gauge base for strain gauges that can dramatically improve heat resistance, moisture resistance, and fatigue life, thereby greatly improving various properties of strain gauges, and is also uniform and ultra-thin. It is possible to provide a manufacturing method that allows the above-mentioned gauge base to be easily manufactured and processed.
第1図および第2図は、本発明に係る強化材入りゲージ
ベースが接着剤により被測定体に接着された状態をそれ
ぞれ示す中央縦断面図および平面図、第3図および第4
図は、本発明に係るゲージベースの製造方法に用いられ
るホイラーの構成を示す縦断面図および平面図、第5図
は1本実施例が適用されたひずみゲージと従来のひずみ
ゲージ(図示せず)の特性を比較して示す特性図、第6
図〜第8図は2本実施例が適用されたひずみゲージの特
性試験の結果を示すグラフで、このうち、第6図は疲労
寿命試験、第7図はクリープ試験、第8図は機械的ヒス
テリシス試験をそれぞれ示している。
1・・・・・・強化材入りゲージベース(ゲージベース
)2・・・・・・抵抗箔、
6・・・・・・ラミホー1−フィルム、7・・・・・・
接着剤、
9・・・・・ひずみゲージ、
11・・・・・・回転板、
13・・・・・・樹脂液。
・・グリッド、
8・・・・・・被測定体、
10・・・・・・カバー
12・・・・・・離型材、1 and 2 are a central vertical sectional view and a plan view, respectively, showing a reinforcing material-containing gauge base according to the present invention adhered to a measured object with an adhesive, and FIGS. 3 and 4 are
The figures are a vertical cross-sectional view and a plan view showing the configuration of a wheeler used in the method for manufacturing a gauge base according to the present invention, and FIG. 5 shows a strain gauge to which this embodiment is applied and a conventional strain gauge (not shown). ) characteristic diagram comparing and showing the characteristics of
Figures 8 to 8 are graphs showing the results of characteristic tests of strain gauges to which the two embodiments were applied. Of these, Figure 6 is a fatigue life test, Figure 7 is a creep test, and Figure 8 is a mechanical test. Hysteresis tests are shown respectively. 1... Gauge base with reinforcing material (gauge base) 2... Resistance foil, 6... Lamiho 1-film, 7...
Adhesive, 9...Strain gauge, 11... Rotating plate, 13... Resin liquid. ... Grid, 8 ... Measurement object, 10 ... Cover 12 ... Release material,
Claims (4)
による受感部が形成され他方の面が被測定体に添着され
て該被測定対象に発生したひずみを検出するひずみゲー
ジの上記ベース材より成るゲージベースにおいて、所定
の樹脂材料と、絶縁材料より成る超微粒子状の絶縁粉末
とを具備し、上記絶縁粉末を上記樹脂材料に混入して上
記ベース材を均一で極薄のフィルム状に形成するように
構成したことを特徴とするひずみゲージの強化材入りゲ
ージベース。(1) The above-mentioned base material of a strain gauge in which a sensing part made of a resistive material or a semiconductor material is formed on one surface of the base material, and the other surface is attached to an object to be measured to detect the strain generated in the object to be measured. The gauge base comprises a predetermined resin material and ultrafine insulating powder made of an insulating material, and the insulating powder is mixed into the resin material to form the base material into a uniform and extremely thin film. A gauge base containing a reinforcing material for a strain gauge, characterized in that it is configured to form a strain gauge.
ェノールエポキシ樹脂およびシリコーン樹脂のいずれか
より成る特許請求の範囲第1項記載のひずみゲージの強
化材入りゲージベース。(2) A reinforcing material-containing gauge base for a strain gauge according to claim 1, wherein the resin material is made of any one of epoxy resin, phenol resin, phenol epoxy resin, and silicone resin.
化ケイ素のいずれかより成る特許請求の範囲第1項記載
のひずみゲージの強化材入りゲージベース。(3) A reinforcing material-containing gauge base for a strain gauge according to claim 1, wherein the insulating material is made of any one of alumina, silica, boron, and silicon nitride.
による受感部が形成され他方の面が被測定体に添着され
て該被測定体に発生したひずみを検出するひずみゲージ
の上記ベース材より成るゲージベースの製造方法におい
て、所定の樹脂材料に絶縁材料から成る超微粒子状の絶
縁粉末を混入し攪拌・混合・粉砕を行って調整し、この
調整された上記樹脂材料を離型材に塗布して均一で極薄
なフィルム状の上記ベース材を形成するようにしたこと
を特徴とするひずみゲージの強化材入りゲージベースの
製造方法。(4) The above-mentioned base material of a strain gauge in which a sensing part made of a resistive material or a semiconductor material is formed on one surface of the base material, and the other surface is attached to an object to be measured to detect the strain generated in the object to be measured. In the gauge base manufacturing method, which involves mixing ultrafine insulating powder made of an insulating material into a predetermined resin material and adjusting it by stirring, mixing, and pulverizing, the adjusted resin material is applied to a mold release material. A method for producing a reinforcing material-containing gauge base for a strain gauge, comprising: forming the base material in the form of a uniform and extremely thin film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23435788A JPH0282103A (en) | 1988-09-19 | 1988-09-19 | Gauge base incorporated with reinforcing material for strain gauge and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23435788A JPH0282103A (en) | 1988-09-19 | 1988-09-19 | Gauge base incorporated with reinforcing material for strain gauge and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0282103A true JPH0282103A (en) | 1990-03-22 |
Family
ID=16969737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23435788A Pending JPH0282103A (en) | 1988-09-19 | 1988-09-19 | Gauge base incorporated with reinforcing material for strain gauge and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0282103A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH04233442A (en) * | 1990-12-28 | 1992-08-21 | Yamaha Corp | Bending sensor |
JP2005315819A (en) * | 2004-04-30 | 2005-11-10 | Kyowa Electron Instr Co Ltd | Moisture-proof structure for strain gage, and moisture-proofing method for strain gage |
KR100953666B1 (en) * | 2007-08-23 | 2010-04-20 | 한국기초과학지원연구원 | Apparatus for measuring stress of body for compensation of temperature and magnetic |
KR100956847B1 (en) * | 2007-08-23 | 2010-05-11 | 한국기초과학지원연구원 | Method for measuring stress of body |
CN104359393A (en) * | 2014-11-28 | 2015-02-18 | 中航电测仪器股份有限公司 | Strain gauge and methods for manufacturing and mounting strain gauge |
JP2018515788A (en) * | 2015-03-12 | 2018-06-14 | エステーベーエル メディカル リサーチ アーゲーStbl Medical Research Ag | Method for manufacturing a strain gauge device |
WO2019098072A1 (en) * | 2017-11-15 | 2019-05-23 | ミネベアミツミ株式会社 | Strain gauge |
CN109825809A (en) * | 2019-03-29 | 2019-05-31 | 华南理工大学 | A kind of polyimide-based resistance-type thin film strain sensors and the preparation method and application thereof |
-
1988
- 1988-09-19 JP JP23435788A patent/JPH0282103A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04233442A (en) * | 1990-12-28 | 1992-08-21 | Yamaha Corp | Bending sensor |
JP2005315819A (en) * | 2004-04-30 | 2005-11-10 | Kyowa Electron Instr Co Ltd | Moisture-proof structure for strain gage, and moisture-proofing method for strain gage |
KR100953666B1 (en) * | 2007-08-23 | 2010-04-20 | 한국기초과학지원연구원 | Apparatus for measuring stress of body for compensation of temperature and magnetic |
KR100956847B1 (en) * | 2007-08-23 | 2010-05-11 | 한국기초과학지원연구원 | Method for measuring stress of body |
CN104359393A (en) * | 2014-11-28 | 2015-02-18 | 中航电测仪器股份有限公司 | Strain gauge and methods for manufacturing and mounting strain gauge |
JP2018515788A (en) * | 2015-03-12 | 2018-06-14 | エステーベーエル メディカル リサーチ アーゲーStbl Medical Research Ag | Method for manufacturing a strain gauge device |
WO2019098072A1 (en) * | 2017-11-15 | 2019-05-23 | ミネベアミツミ株式会社 | Strain gauge |
JP2019090721A (en) * | 2017-11-15 | 2019-06-13 | ミネベアミツミ株式会社 | Strain gauge |
CN109825809A (en) * | 2019-03-29 | 2019-05-31 | 华南理工大学 | A kind of polyimide-based resistance-type thin film strain sensors and the preparation method and application thereof |
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