JPH0282047U - - Google Patents
Info
- Publication number
- JPH0282047U JPH0282047U JP16271488U JP16271488U JPH0282047U JP H0282047 U JPH0282047 U JP H0282047U JP 16271488 U JP16271488 U JP 16271488U JP 16271488 U JP16271488 U JP 16271488U JP H0282047 U JPH0282047 U JP H0282047U
- Authority
- JP
- Japan
- Prior art keywords
- grid array
- array package
- pin grid
- lead pins
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 5
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16271488U JPH0282047U (enExample) | 1988-12-15 | 1988-12-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16271488U JPH0282047U (enExample) | 1988-12-15 | 1988-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282047U true JPH0282047U (enExample) | 1990-06-25 |
Family
ID=31446791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16271488U Pending JPH0282047U (enExample) | 1988-12-15 | 1988-12-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282047U (enExample) |
-
1988
- 1988-12-15 JP JP16271488U patent/JPH0282047U/ja active Pending