JPH0282033U

JPH0282033U -

Info

Publication number: JPH0282033U
Application number: JP16129388U
Authority: JP
Priority date: 1988-12-14
Filing date: 1988-12-14
Publication date: 1990-06-25

Description

[Brief explanation of drawings]

第１図は考案の実施例に係る研磨装置を示す概
略断面図、第２図は従来技術に係る研磨装置を示
す概略断面図である。１：研磨布、２：定盤、２ａ：回転軸、３：ウ
エーハ、４０：プレート。 FIG. 1 is a schematic sectional view showing a polishing apparatus according to an embodiment of the invention, and FIG. 2 is a schematic sectional view showing a polishing apparatus according to the prior art. 1: Polishing cloth, 2: Surface plate, 2a: Rotating shaft, 3: Wafer, 40: Plate.

Claims

[Scope of Claim for Utility Model Registration] 1. A semiconductor wafer fixedly held on the lower surface of a plate and an abrasive cloth attached to a surface plate are subjected to a sliding movement under pressure while an abrasive is flowing down. A wafer polishing apparatus capable of polishing the wafer surface, wherein the wafer holding surface of the plate is set to have a slightly convex curved surface. 2. The wafer polishing apparatus according to claim 1, wherein the wafer holding surface of the plate has a difference between a central area of the wafer holding part and a peripheral area of the wafer holding part in a range of 1 to 10 μm. 3. The radius of curvature of the wafer holding surface of the plate is gradually made smaller as it moves from the central area of the wafer holding part to the peripheral area of the wafer holding part, and the cross-sectional shape is set to consist of a curved line approximating an approximately elliptical shape. The wafer polishing apparatus according to claim 1.