JPH028170U - - Google Patents
Info
- Publication number
- JPH028170U JPH028170U JP8538088U JP8538088U JPH028170U JP H028170 U JPH028170 U JP H028170U JP 8538088 U JP8538088 U JP 8538088U JP 8538088 U JP8538088 U JP 8538088U JP H028170 U JPH028170 U JP H028170U
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- printed circuit
- release layer
- layer provided
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8538088U JPH028170U (de) | 1988-06-28 | 1988-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8538088U JPH028170U (de) | 1988-06-28 | 1988-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028170U true JPH028170U (de) | 1990-01-19 |
Family
ID=31310051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8538088U Pending JPH028170U (de) | 1988-06-28 | 1988-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028170U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5911144B2 (ja) * | 2010-07-02 | 2016-04-27 | 国立研究開発法人産業技術総合研究所 | 微小機械システム |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61288489A (ja) * | 1985-06-17 | 1986-12-18 | キヤノン株式会社 | 成形回路基板の製造方法 |
-
1988
- 1988-06-28 JP JP8538088U patent/JPH028170U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61288489A (ja) * | 1985-06-17 | 1986-12-18 | キヤノン株式会社 | 成形回路基板の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5911144B2 (ja) * | 2010-07-02 | 2016-04-27 | 国立研究開発法人産業技術総合研究所 | 微小機械システム |