JPH0310572U - - Google Patents
Info
- Publication number
- JPH0310572U JPH0310572U JP7156989U JP7156989U JPH0310572U JP H0310572 U JPH0310572 U JP H0310572U JP 7156989 U JP7156989 U JP 7156989U JP 7156989 U JP7156989 U JP 7156989U JP H0310572 U JPH0310572 U JP H0310572U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- clad laminate
- laminating
- wound
- flexible copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011241 protective layer Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7156989U JPH0310572U (de) | 1989-06-19 | 1989-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7156989U JPH0310572U (de) | 1989-06-19 | 1989-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310572U true JPH0310572U (de) | 1991-01-31 |
Family
ID=31608720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7156989U Pending JPH0310572U (de) | 1989-06-19 | 1989-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310572U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60142687U (ja) * | 1984-03-01 | 1985-09-21 | 富田 文良 | 衣紋掛け |
| JP2017210314A (ja) * | 2016-05-24 | 2017-11-30 | Ｊｘ金属株式会社 | ロール状積層体、ロール状積層体の製造方法、積層体の製造方法、ビルドアップ基板の製造方法、プリント配線板の製造方法、電子機器の製造方法 |
-
1989
- 1989-06-19 JP JP7156989U patent/JPH0310572U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60142687U (ja) * | 1984-03-01 | 1985-09-21 | 富田 文良 | 衣紋掛け |
| JP2017210314A (ja) * | 2016-05-24 | 2017-11-30 | Ｊｘ金属株式会社 | ロール状積層体、ロール状積層体の製造方法、積層体の製造方法、ビルドアップ基板の製造方法、プリント配線板の製造方法、電子機器の製造方法 |