JPH0281447A - Flexible pin carrier and semiconductor device employing the same - Google Patents

Abstract

PURPOSE:To avoid adhesion of solder along a conductive elastic fine wire which is soldered to a semiconductor element or a printed board even if the solder adheres to the parts other than the bonding part of the fine wire and avoid the degradation of the elasticity of the fine wire by a method wherein a board which also holds the end parts of the fine wires is provided on the end parts of the fine wires. CONSTITUTION:Two boards 1 and 2 made of different materials are linked with each other by bonding a large number of conductive elastic fine wires 3. Connection pads 5 connected to the fine wires 3 are provided outside both the boards 1 and 2. The board 1 is placed on the side of a semiconductor element or a semiconductor element mounting part and made of material such as ceramics which has a thermal expansion coefficient equivalent to that of the material of the semiconductor element. The board 2 is placed on the side of a multilayer printed board side and made of material such as ceramics or resin which has a thermal expansion coefficient equivalent to that of the material of the multilayer printed board. Further, the fine wire 3 is required to have an elasticity sufficient to absorb the difference in thermal expansion coefficient between the boards 1 and 2 and to have a resistance as small as possible. Kovar, copper, copper alloy or the like may be employed as the material of the fine wire 3. Thermosetting resin is used as the resin 4 fixing the fine wires 3 to the boards 1 and 2. The connection pads 5 are made of copper and connect the boards 1 and 2 to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor device having high-density connection pads, and particularly to a cooling device and thermal stress applied to solder bumps between a semiconductor element and a multilayer printed circuit board. The present invention relates to a flexible pin carrier suitable for alleviating external load forces applied to the element.

[Prior art] A conventional chip carrier mounting method is disclosed in Japanese Patent Application Laid-Open No. 59-21.
As described in 8795, when connecting the connection means such as bumps formed on the outer surface of the chip carrier to the connection means such as pads formed on the chip carrier mounting surface such as a printed circuit board, soldering is performed using the above-mentioned method. Between the connection means of the chip carrier and the connection means on the mounting surface of the board, an intermediate connection plate composed of a connection plate in which intermediate connectors made of an elastic conductor such as metal are implanted is interposed so that they can be connected to each other. The corresponding surface connecting means were electrically connected to each other.

That is, as shown in FIG. 12(a), pads 39,
A connecting plate 37 is interposed to hold an intermediate connector 36 connecting between the bumps 40 at an intermediate portion thereof. Further, as shown in FIG. 12(b), the intermediate connector 36
It is also known that the bumps do not correspond to the bumps 40 and the like, but are arranged at relatively few positions.

[Problems to be Solved by the Invention] In the above-mentioned prior art, as shown in FIG.
The chip carrier and the printed circuit board have been connected through a wire, but in this method, if the connection is made once and then removed, there is a risk that solder may adhere to the intermediate connector 36 and reduce the elasticity of the intermediate connector 36. Furthermore, when the pitch of the intermediate connectors 36 is reduced as shown in FIG. 12(b), no consideration is given to the fact that the solder may be sucked up between the intermediate connectors 36 due to capillary action when the solder melts, and the elastic conductivity There was a problem that it reduced the elasticity of the body.

Furthermore, since the intermediate connector 36 is structured to protrude above and below the connection plate 37, if there is a limit to the mounting height, the intermediate connector 3
It is also conceivable that the amount of protrusion of the intermediate connector 6 from the connecting plate 37 becomes smaller, and the flexibility of the intermediate connector 36 decreases.

The object of the present invention has been made based on the above circumstances, and it is possible to completely prevent solder from adhering to the elastic conductor, thereby preventing deterioration of the elasticity of the elastic conductor, and improving the bond between the board and the board mounted thereon. The present invention provides a flexible pin carrier that can alleviate thermal stress due to differences in thermal expansion coefficients of semiconductor elements and the like as well as outputs applied to the elements.

[Means for Solving the Problems] In order to achieve such an object, one of the present invention provides that one of both ends of a large number of conductive elastic thin wires has a coefficient of thermal expansion equivalent to that of a semiconductor element or a semiconductor element mounting part. The other side is fixed to a board with a coefficient of thermal expansion equivalent to that of a multilayer printed circuit board, thereby alleviating the difference in thermal expansion between the two boards and improving deformability against external forces. It is something to do.

Further, one end of a large number of conductive elastic thin wires is inserted and fixed into a large number of through holes formed in a single board having a coefficient of thermal expansion equivalent to that of a multilayer printed board.

In the latter case, the other end of the thin conductive elastic wire is soldered with the semiconductor element or the semiconductor element mounting portion facing downward.

[Function] In the mounting structure with the above configuration, the substrate placed on the side of the semiconductor element or the semiconductor element mounting part uses a material with a coefficient of thermal expansion close to that of the element or the element mounting part, so thermal expansion due to heat generated during operation is avoided. The difference can be reduced, and therefore the thermal stress applied to the solder bumps that connect the two can be reduced. Similarly, since the substrate disposed on the multilayer printed circuit board side is made of a material with a coefficient of thermal expansion close to that of the multilayer base, the thermal stress applied to the solder bumps connecting the two can be reduced. Furthermore, the lateral displacement caused by the difference in thermal expansion that occurs between the element or element mounting part side substrate and the multilayer substrate side substrate, which have largely different coefficients of thermal expansion, is caused by the conduction between the two substrates. It can be absorbed by the elasticity of thin elastic wire. Further, external load force applied to the element or the element mounting portion can be absorbed by elastically deforming the entirely conductive elastic thin wire in the lateral direction.

Even if the solder adheres to areas other than the solder-fixed parts due to its melting, the substrate can prevent the solder from adhering along the conductive elastic thin wire, so that the trajectory of the thin wire will not deteriorate. That will no longer be the case.

The substrate may not necessarily be provided on the semiconductor element side, but the print may be provided only on the substrate side.
In this case, if the semiconductor element or the like is soldered to the thin wire, the solder will not flow along the thin wire, and the elastic deterioration of the thin wire will not be caused.

[Example] The present invention will be described in detail below with reference to the drawings.

FIG. 1 is a longitudinal sectional view showing a representative embodiment of a flexible pin carrier.

The flexible pin carrier according to the present invention has two types of substrates (A) 1 and (B) 2 made of different materials, and also has two substrates (A) 1 and (B) 2 having conductive elastic thin wires 3. are connected by inserting and fixing a large number of the thin wires 3.

Further, a connection pad 5 connected to the thin wire 3 is provided on the outside of the peripheral substrates (A) 1 and (B) 2.

Here, the substrate (A) 1 is disposed on the side of the semiconductor element or the semiconductor element mounting part, and is made of a material such as ceramics having the same coefficient of thermal expansion as the material constituting it. Further, the substrate (B) 2 is on the side of the multilayer printed circuit board, and is made of a material having a thermal expansion coefficient equivalent to that of the multilayer printed circuit board, such as ceramics or resin. This is because if it is necessary to specify a printed circuit board with a low dielectric constant, there will be a large difference in coefficient of thermal expansion between the printed circuit board and the semiconductor element mounting section. Furthermore, it is necessary that the thin wire 3 has enough elasticity to absorb the difference in thermal expansion between the substrate (A) 1 and the substrate (B) 2, and that the resistance is as small as possible. Use those composite materials. A thermosetting resin is used as the resin 4 for fixing the thin wire to the substrate (A) 1 and the substrate (B) 2. Further, the connection pad 5 is made of copper and is formed after connecting the substrate (A) 1 and the substrate (B) 2 and polishing the surfaces of both substrates.

FIGS. 2(a) and 2(b) are longitudinal sectional views of a structure in which the semiconductor element mounting portion 16 and the semiconductor element 21 are mounted on the multilayer printed circuit board 14 using a flexible pin carrier.

Further, FIGS. 3(a) and 3(b) are cross-sectional views illustrating the function of the flexible pin carrier. In the present invention, both the semiconductor element 21 and the semiconductor element mounting section 16 are considered as the object to be mounted, but in order to make the explanation easier to understand, only the half-half element mounting section 16 will be described below.

With this structure, as shown in FIG. 3(a), the solder bumps (A) 11° connecting between the element mounting part 16 and the flexible pin carrier and the connection between the multilayer board 14 and the flexible pin carrier are formed. The stress due to the difference in thermal expansion applied to the solder bumps (B) 12 to be connected is relaxed,
Also, substrate (A) 1 and substrate (B) 2 with the largest difference in thermal expansion
The thermal stress during this period is absorbed by the elastic deformation of the thin wire 3.

Furthermore, as shown in FIG. 3(b), the load external force 20 applied to the element mounting portion 16 from the cooling structure 19 is also absorbed by the elastic deformation of the thin wires 3, so that a more reliable mounting structure can be achieved. can.

FIG. 4(a) is a longitudinal sectional view showing another embodiment. This carrier has a single substrate 2a and the thin wires 3, and has a structure in which one end of a large number of the thin wires 3 is inserted and fixed to the single substrate 2a using a resin 4.

FIG. 4(b) shows a sectional view of the mounting structure in this case. In this structure, the element mounting portion 16 is connected to the side of the thin wire 3 that is not fixed to the single substrate 2a, and the side of the single substrate 2a is connected to the multilayer substrate 15.

In this case, when connecting the element mounting part 16 and the thin wire 3, by positioning the element mounting part 16 on the lower side, it is possible to prevent the solder from melting down along the thin wire 3. As with the substrate (B) 2 in the first embodiment, the single substrate 2a is made of a material having the same coefficient of thermal expansion as the multilayer substrate 15, such as ceramics or resin. Further, as the resin 4, a thermosetting resin is used. Thereby, the thermal stress applied to the solder bumps (B) 12 connecting the multilayer substrate 15 and the single substrate 2a can be alleviated. Further, the thin wire 3 is the same as in the first embodiment, and the elasticity of the axis m3 allows the element mounting portion to
The solder bump (A) 11 that connects the thin wire 3 to the solder bump 6 is structured to relieve the stress applied thereto.

When mounting the element mounting part 16 on the multilayer board 15 using this carrier, the connection between the element mounting part 16 and this carrier is made by directly soldering the thin wire 3 to the connection pad 13 of the element mounting part 16. Therefore, in terms of strength, it is somewhat inferior to the first embodiment, but since the height of the carrier can be lowered by the absence of the upper substrate (A) 1, it is effective when there is a restriction on the height of the mounting structure. I can say it.

FIG. 5(a) shows a longitudinal sectional view of another embodiment.

This feature is that one end of the thin wire 3 shown in FIG. 4(a) is shaped like a nail, and this thin wire will hereinafter be referred to as a nail-shaped thin wire 6.

FIG. 5(b) shows a longitudinal cross-sectional view of a mounting structure using a carrier using nail-shaped thin wires 6.

In this structure, the head of the nail-shaped thin wire 6 serves as a connection pad to prevent solder from adhering to areas other than the nail-shaped thin wire 6. This method is more suitable for alleviating the stress applied to the solder bumps (A) 11 because the area of the solder connection portion can be increased. Further, by forming the thin wire 6 into such a shape, the soldering operation with the element mounting portion 16 is facilitated.

An explanatory diagram of how to make one end of the thin wire 6 into a nail shape is shown in Figure 6 (
As shown in a) to (c), first, as shown in FIG. 6(a), the thin wire 3 is made to protrude a certain length from the tip of the thin wire holding portion 30, and as shown in FIG. 6(b), the thin wire 3 is A tungsten electrode 31 is placed at a certain distance from the tip, and a current is passed between the tungsten electrode 31 and the holding portion 30 to blow an arc 32 to melt the tip of the thin wire and make it spherical. Immediately after that, the tungsten electrode 31 is removed, pressed against a flat plate 33 to form a nail-shaped tip as shown in FIG. 6(c), and then the thin wire is cut into a predetermined length. This can be easily manufactured.

A longitudinal sectional view of another embodiment is shown in FIG. Two boards (
A)1. Conductors (A) 7 and (B) 8, for example, are embedded in (B) 2 in advance and sintered, and the thin wires 3 are arranged and bonded to connection pads 5a provided on the surface of the substrate. A structure in which substrates (A) 1 and (B) 2 are connected is conceivable.

As conductors (A) 7 and (B) 8, substrates (A) 1 and (B)
If both of the above two are ceramic substrates, they are embedded in through holes drilled in the green sheet in advance and then sintered, so a material that can withstand the temperature during sintering, such as tungsten, is used. Further, when a resin substrate is used as the substrate (B) 2, there is no need for sintering, so a wire is used as the conductor (B) 8 to improve conductivity.

The main functions of each part are the same as in the first embodiment, except for the connection pads 5 on the surfaces of the substrate (A) 1 and the substrate (B) 2.
Since a larger stress will be applied to the connection part between a and the thin wire 3, when connecting the thin wire 3 to the connection pad 5a,
Silver solder 9 is used which has a higher melting point and strength than solder. This can prevent the carrier from decomposing when soldering between the carrier and the element mounting section 16, between the carrier and the multilayer board 15, or when attaching and detaching by heating, and furthermore prevents thermal expansion and load. Connecting pad 5a due to external force
The stress applied to the connecting portion of the thin wire 3 can be supported.

As another embodiment, as shown in FIG. 8, a thermosetting rubber-based resin such as silicone rubber 10 is provided between two substrates (A) 1 and (B) 2 in contact with the substrates. Therefore, when thermal stress and external force are applied, the substrate (A) of the thin wire 3
A structure is conceivable in which the stress concentrated at the contact point with the substrate (B) 1 and the substrate (B) 2 is alleviated by the elasticity of the silicone rubber 10 or the like.

When adopting this structure, it is necessary to apply the silicone rubber 10 thinly and uniformly to the surface of each substrate. As a method, first, silicone rubber 10 in a fluid state before hardening is poured between the substrates in an amount necessary to coat one side, and centrifugal force is used to uniformly coat the silicone rubber 10 on one side and harden it. Then, the carrier is turned over, and the silicone rubber 10 for the other side is injected, uniformly coated and cured using centrifugal force as before. According to this method, there is a possibility that some silicone rubber 10 may adhere to the thin wire 3, but since only a thin film is attached to the surface, the deformation function is not affected.

Further, in this case, two substrates (A) 1. (B) A structure in which the space between the parts 2 and 2 is filled with silicone rubber 10 is also functionally effective. That is, when thermal stress and external force are applied, the substrate (A) 1 and the substrate (A) of the thin wire 3
B) The flexibility of the silicone rubber 10 alleviates the stress concentrated at the contact point with the wire 2, and also improves the corrosion resistance of the thin wire 3.

Furthermore, since the thin wire 3 can be protected, high reliability can be achieved.

FIGS. 9(a) to 9(f) are cross-sectional views illustrating one example of a method for manufacturing a flexible pin carrier. First, as shown in FIG. 9(, ), the pitch of the connection pads of the semiconductor element mounting portion on each of the two substrates (A) 1 and (B) 2 is, for example, 250 to 250.
Through hole 29 for example diameter 12 to match 300μm
Leave a gap of 0 μm. Then, the substrates (A) 1 and (B) 2 are aligned with the through holes 29 and overlapped, and the substrate (B) 2 is fixed to the substrate holding structure 26 as shown in FIG. 9(b). For example, the substrate (A) 1, (B)
When the thickness of 2 is 0.7 mm and the distance between substrates (A) 1° and (B) 2 is 0.6 mm, the diameter of 1 cut to a length of 2 mm is
The thin wire 3 of 00 μm is inserted using the thin wire insertion device 23. And the 9th ri! As shown in I(c), the substrate (A
) 1 with the substrate holding jig 22, apply the thin wire holding jig 24 from above so that the thin wire 3 does not move, and then pull up the substrate (A) 1. The amount of lifting is adjusted to 0.6 mm, which is a distance of 1° for the substrate (A) and 2° for the substrate (B). Thereafter, as shown in FIG. 9(d), the resin 4 is press-fitted into the through-hole 29 and fixed. In this case, for the upper part, remove the thin wire holding jig 24 and align the resin injection nozzle 25, and for the lower part, slide the substrate holding jig plate 26a to align the resin injection nozzle 25, and then inject and fix the resin. Connect the substrates (A)L and (B)2. And substrate (A) 1,
(B) The outer surface of 2 is polished to produce the structure shown in FIG. 9(e). Finally, it can be manufactured by forming connection pads 5 as shown in FIG. 9(f).

Still another manufacturing method is to use ceramics for the substrates (A) 1 and (B) 2 and to use a high melting point metal such as tungsten for the thin wire 3, as shown in FIGS. 10(a) to (d). think. First, through holes 29 are made in the green sheets of substrates (A) 1 and (B) 2 at intervals corresponding to the pitch of the connection pads of the element or the element mounting portion. Next, as shown in FIG. 10(a), after fixing the substrate (B) 2 to the substrate holding structure 26, the thin wire 3 is press-fitted into the through hole 29 using the thin wire insertion device 23.

Then, as shown in FIG. 10(b), the substrate (A) 1 is held by a substrate holding jig 22, and the thin wire 3 inserted into the substrate (B) 2 and the through hole 29 of the substrate (A) 1 are After aligning the positions, lower the board (A) 1 and place both boards (A) 1 and (B).
)2 are combined. At this time, the substrate (A) 1 is held down with a substrate holding jig 24a so that it does not bend. As shown in FIG. 10(c), a tungsten spacer 42 with a thickness Q of 6 mm is inserted so that the spacing between the substrates does not change during sintering, and then the structure is heated and sintered. 42
The flexible pin carrier shown in FIG. 10(d) can be easily manufactured by removing the pin carrier, polishing the outer surface, and then forming connection pads.

FIGS. 11(a) and 11(b) are partial cross-sectional views illustrating the shape of the conductive elastic thin wire 3. FIG. The thin wire 3 is made of a metal thin wire such as Kovar, copper, a copper alloy, a composite thereof, or tungsten.

In order to maximize the elastic function, the wire diameter needs to be smaller than the distance between the substrates (A) 1 and (B) 2, as shown in FIG. 11(a). However, in consideration of the strength of the thin wire, the ratio of the thin wire diameter to the substrate gap size is preferably in the range of, for example, 1:2 to 1=12.

In addition, as shown in FIG. 11(b), the substrate (A) of the thin wire 3
It is also effective to reduce the stiffness of the thin wire 3 by etching the exposed portion between the wires 1 and 2 to reduce the wire diameter.

As a mounting structure of the flexible pin carrier, as shown in FIG. 3(a), there is a structure in which the pin carrier is interposed and connected between the element mounting portion 16 and the multilayer substrate 15 on which it is mounted.

By using this mounting structure, the thermal expansion coefficient of the board (A) 1 is equal to that of the element mounting part 16, so that the element mounting part 16 and the board (A)
) can reduce the difference in thermal expansion that occurs between
Thermal stress applied to the solder bump (A) 11 can be reduced.

Similarly, thermal stress applied to the solder bumps (B) 12 between the multilayer substrate 15 and the substrate (B) 2 can also be reduced. Furthermore, the difference in thermal expansion between the substrate (A) 1 and the substrate (B) 2 can be absorbed by the elasticity of the thin wire 3. Moreover, since the elasticity of the thin wires 3 can absorb the force applied from the outside to the element mounting portion 16, a more reliable semiconductor device can be obtained.

Furthermore, solder bumps (A) 11 connecting between the pin carrier and the element mounting section 16 and solder bumps (B) 12 connecting between the pin carrier and the multilayer board 15 have different melting points. By using solder,
The element mounting portion 16 side or the multilayer substrate 15 side can be selectively attached or detached depending on the heating temperature, and a more practical semiconductor device can be obtained.

Furthermore, as an example of how to use the pin carrier, there is also a method in which the pin carrier is installed between the element mounting part and the cooling structure to alleviate thermal stress and external load force between the element mounting part and the cooling structure. Conceivable.

[Effects of the Invention] As is clear from the above explanation, according to the flexible pin carrier according to the present invention, this portion is attached to the end of the conductive elastic thin wire to be soldered to a semiconductor element or a printed circuit board. Since a substrate is provided that also serves as a holding member, even if the solder adheres to areas other than the solder-fixed areas due to melting, etc., the substrate prevents the solder from adhering along the conductive elastic thin wires. Since this can be prevented, the elasticity of the thin wire will not deteriorate.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a flexible pin carrier according to an embodiment of the present invention, FIGS. 2(a) and 2(b) are sectional views of a mounting structure using the flexible pin carrier, and FIG.
Figures (a) and (b) are cross-sectional views showing modifications of the mounting structure using the flexible pin carrier;
b) and FIGS. 5(a) and 5(b) are cross-sectional views showing other embodiments of the present invention, FIGS. 6(a) to e) are cross-sectional views showing a method for manufacturing a nail-shaped thin wire, and FIG. Figure 8(a). (b) is a sectional view showing other embodiments, and FIG.
) or f) is a sectional view showing the manufacturing method of the flexible pin carrier shown in FIG. 1, and FIGS. 10(a) to d
) are cross-sectional views showing other manufacturing methods, and FIGS. 11(a) and (b)
) is a cross-sectional view illustrating the shape of the conductive elastic thin wire, 12th
Figures (a) and (b) are side views showing an example of a conventional flexible pin carrier. 1...Substrate (A), 2...Substrate (B), 2a...
・Single board, 3... Conductive elastic thin wire, 4... Resin, 5... Connection pad, 5a... Internal connection pad, 6
...Nail-shaped thin wire, 7...Conductor (A), 8...Conductor (
B), 9...Silver solder, 10...Silicone rubber, 11
...Solder bump (A), 12...Solder bump (
B), 13... Semiconductor element mounting part side connection pad, 14
...Multilayer printed board side connection pad, 15...Multilayer printed board, 16...Semiconductor element mounting part, 17...
- Amount of expansion of substrate (A), 18... Amount of expansion of substrate (B), 19... Cooling structure, 20... External force applied from cooling structure, 21... Semiconductor element. 22... Board holding jig, 23... Thin wire insertion device,
24... Thin wire holding jig, 24a... Board holding jig. 25... Resin injection nozzle, 26... Substrate holding structure, 26a... Substrate holding jig plate, 27... Thin wire insertion direction, 28... Substrate (A) lifting direction, 29...・
Through hole, 30... Thin wire holding part, 31... Tungsten electrode, 32... Arc, 33... Flat plate, 3
4... Chip board, 35... Via, 36... Intermediate connector, 37... Connection plate, 38... Intermediate connection plate, 3
9... Pad, 40... Bump, 41... Printed circuit board, 42... Spacer. Agent Tatsuyuki Unuma Figure 2 (a) Figure (C1) (b) Figure 5 (a) (b) Figure (Q) (b) Figure 6 (a) Figure 7 Figure 8 Figure 11 (C) (b) (d) et al.

Claims (13)

[Claims] 1. One of the two ends of a large number of thin conductive elastic wires is fixed to a substrate with a coefficient of thermal expansion equivalent to that of the semiconductor element or the semiconductor element mounting area, and the other is fixed to a substrate with a coefficient of thermal expansion equivalent to that of a printed circuit board. A flexible pin carrier characterized by reducing the difference in thermal expansion between both substrates and improving deformability against external forces. 2. A flexible pin carrier characterized by inserting and fixing one end of a large number of conductive elastic thin wires into a large number of through holes drilled in a single board having a coefficient of thermal expansion equivalent to that of a printed circuit board. 3. A flexible pin carrier characterized by inserting and fixing one end of a large number of nail-shaped conductive elastic thin wires into a large number of through holes drilled in a single board having a coefficient of thermal expansion equivalent to that of a printed circuit board. 4. 4. The method for attaching a flexible pin carrier according to claim 3, wherein the other end of the thin conductive elastic wire is soldered with the semiconductor element or the semiconductor element mounting portion facing downward. 5. Claim 1: The different substrates each have a conductor structure penetrating the front and back sides thereof, and a large number of thin conductive elastic wires are fixedly arranged in accordance with the conductor pitch of both substrates and bonded to both substrates.
Flexible pin carrier as described. 6. The flexible pin carrier according to claim 1, wherein the flexible pin carrier has a structure that relieves stress concentrated on the conductive elastic thin wire by disposing silicone rubber between the two substrates in contact with both substrates. 7. The flexible pin carrier according to claim 1, wherein the space between the two substrates is filled with silicone rubber to improve the corrosion resistance of the conductive elastic thin wire and to protect the thin wire. 8. Drill a large number of through holes in the two substrates according to the pitch of the semiconductor elements or the connection pads of the semiconductor element mounting area, and insert and secure a large number of conductive elastic thin wires into the holes to connect the two substrates. The method for manufacturing a flexible pin carrier according to claim 1, wherein the flexible pin carrier is manufactured by connecting. 9. Any one of claims 1, 2, and 3, which is manufactured by implanting thin conductive elastic wires in advance at the conductor pitch of the connection part in the green sheet of the ceramic substrate before sintering, and then sintering the wires. The method for manufacturing the flexible pin carrier described. 10. The flexible pin carrier according to any one of claims 1, 2, and 3, wherein the conductive elastic thin wire has a wire diameter smaller than a gap between the substrates. 11. The flexible pin carrier according to claim 1, wherein the diameter of the conductive elastic thin wire exposed between the two substrates is reduced to lower the rigidity of the thin wire. 12. 1. A semiconductor device, characterized in that a semiconductor element or a semiconductor element mounting part and a printed circuit board are connected to each other through a flexible pin carrier according to any one of the first, second, and third embodiments. 13. 13. The semiconductor device according to claim 12, wherein the flexible pin carrier and the semiconductor element or the semiconductor element mounting part and the flexible pin carrier and the printed circuit board are connected using solders having different melting points.