JPH0280170A - Jet type soldering device - Google Patents

Abstract

PURPOSE:To prevent a camber of a printed board, and also, the upper face of the board from being covered with molten solder by pinching the printed board between a front hanger and a rear hanger, giving carrying force to a rear hanger carriage and attaching a protecting plate to the hanger. CONSTITUTION:A printed board 7 is pinched between the front hanger 9 and the rear hanger 10, and also, by carrying force of a carrying conveyor 6 applied to a rear hanger carriage 12, the whole body is carried in a docking state with a front hanger carriage 11 and the printed board 7. At the time of passing through a spot of a stepped cam part of a set rail 15 on the way of carrying, the hangers 9, 10 ascend a little, and the front and the rear edges of the board 7 are adjusted correctly to a hanger hook part 20, and supported by a fixed claw 21. Therefore, a camber is straightened, and also, it is possible to cope with the prevention of generation of the camber. Also, a protective plate 50 attached to the front hanger 9 prevents the upper face of the board 7 from being covered with molten solder.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a jet soldering device for soldering the solder joints of a reprinted circuit board by supplying molten solder to the printed circuit board in a IIIjt flow manner. In particular, the present invention relates to a jet soldering apparatus that can prevent warping of a printed circuit board and prevent molten solder from covering the top surface of the printed circuit board.

[Conventional technology]

First, the general structure of a conventional carrierless jet soldering device will be outlined with reference to FIGS. 9 to 11. In the figure, 1 is the main body of the jet soldering device,
Inside it is a flux application section 2 for pre-processing for soldering. Preheating section 3° Jet solder bath 4. A cooling unit 5 and the like are built in side by side, and above this, a conveyor 6 is installed along the transfer path of the printed circuit board. Here, as shown in FIG. 10, the conveyor 6 has hook shapes arranged at regular intervals around a pair of endless chain mechanisms 6a laid on both left and right sides along the movement path of the printed circuit board 7. The printed circuit board 7 is mounted so as to straddle between the left and right transport claws 6b and is transported in the direction of arrow A KF&. Further, a front view of the conveyance state of the printed circuit board 7 is shown in FIG. In the figure, 7a indicates a bottle insertion type chip mounted on the upper surface of the printed circuit board #i7, and 7b indicates a surface mount type chip such as a flat package mounted on the lower surface side.

The soldering operation of such a jet soldering device is carried out in a manner similar to a soldering process. That is, the bottle insertion type tip 7a,
Alternatively, the printed circuit boards 7 on which surface-mounted chips, etc., such as the flat package 7b are mounted, are fed one by one to the soldering machine, and then loaded onto the conveyor 6 and conveyed. In section 2, 7 lux is uniformly applied on the board, and in the primary preheating section 3, the solvent of the liquid flux applied to the board is evaporated to promote activation of the flux to the soldered joint. Subsequently, when the printed circuit board 7 is transferred to the soldering bath 4, first, the pump pumps the flow through the first jet nozzle 4a, the direction of the nozzle tip of which changes slightly in the front and back and left and right directions by a drive mechanism (not shown). /JS of the jet width
The first wave molten solder 4A is then pumped through the second jet nozzle 4b whose nozzle tip is fixed, and the second wave molten solder 4B, which has a large spout width, is directed downward to the bottom surface of the reprinted board 7. The solder joints of the printed circuit board 7 are soldered together by being supplied in a jet manner. As is well known, the surface tension of molten solder is large, and the flux that has become gaseous due to the heat during soldering tends to accumulate around chip components, making it difficult to solder connections between adjacent chip components. It is difficult to supply molten solder to the parts, and as a result, it is easy to cause soldering defects, but in this way, the molten solder can be applied to the first wave of molten solder 4A with a small spouting width and the second wave of molten solder with a large spouting width. The soldering yield is improved by dividing and supplying the molten solder 4B into two jets.In other words, the jet width of the first wave molten solder 4A is made small (by which the solder connections between the chip components 7b are formed). In addition to making sure that #molten solder reaches such areas, the jetting width of the second wave molten solder 4B is increased to achieve a finish without uneven soldering amount.

Finally, the printed circuit board 7 is rapidly cooled in the cooling section 5, where the residual heat immediately after soldering is removed and the mechanical strength of the soldered joint is increased.
taken out from the end of the

[Invention tries to solve! ! Title]

By the way, in the above-mentioned conventional jet soldering apparatus, since the printed circuit board is locally heated by the jet of molten solder, large warpage occurs in the printed circuit board due to thermal distortion etc. during the soldering process. There are many. In this case, the left and right edges of the printed circuit board are supported by the conveyor claws 6b of the conveyor 6 as described above, and since the soldering heat is applied from the back side of the circuit board, the front side of the circuit board is exposed.

Due to the temperature difference between the strings, the printed circuit board 7 warps in a downwardly concave direction as shown in FIG.

This may cause the chip components to lift up from the printed circuit board, resulting in poor soldering. Furthermore, in this case, if a surface-mounted chip 7b, especially a fragile chip such as a ceramic chip, is mounted on the printed circuit board f27, there is a risk that the chip will crack due to warpage of the printed circuit board 7σ). Moreover, in recent years, chips have become more highly integrated and printed circuit boards have become larger, and there is a growing concern that this trend will increase. In addition, the conventional device does not have any measures to prevent molten solder from being covered, and if the spout height of molten solder 4A, 4B is set too high, molten solder will flow onto the top surface of printed circuit board 7. Not only does this lower the yield rate, but also there is a risk that the electronic components mounted on the top surface of the printed circuit board 7 will be covered with high-temperature (approximately 250°C) molten solder, degrading the performance of electronic components with low heat resistance. Therefore, the upper limit of the spouting height of the molten solder 4A, 4B is the height position of the top surface of the printed circuit board a7, and since a sufficient amount of molten solder cannot be supplied to the bottom surface of the printed circuit board 7, Sometimes soldered parts remained. Furthermore, a first jet nozzle 4 is provided so that molten solder can be effectively supplied to the soldered joints between the chip components 7b.
Mechanically move the nozzle tip of a to melt the first wave bath 4
Since the first wave molten solder 4A is moved, it is difficult to adjust the ejection height of the first wave molten solder 4A to a constant level, and if this adjustment is not successful, there is a problem that the top surface of the printed circuit board 7 is covered with molten solder. there were.

This invention was made in view of the above-mentioned problems, and its purpose is to reliably solder the solder joints of a printed circuit board, prevent the printed circuit board from warping, and to To provide a jet soldering device which prevents molten solder from covering the surface of the printed circuit board and thereby does not adversely affect components mounted on a printed circuit board.

[Means for solving problems]

The above purpose is to load printed circuit boards onto a pair of left and right transport conveyors, and while the printed circuit boards are being transported, the A1. '
1* A flow-type soldering device that jets molten solder toward a printed circuit board to solder connections. A pair of front hangers and rear hangers that support the substrate in the direction of warping, a front hanger carriage and a rear hanger carriage that individually support each hanger, and an outgoing set that guides each of the carriages to move parallel to the conveyor. rail.

a circulating guide rail mechanism consisting of a collection rail on the return side; a clutch mechanism mounted on the rear hanger carriage to connect the carriage to the transport conveyor or a separately provided carriage transport conveyor; It is equipped with a protective plate attached to the front hanger so that it rises upward from the front edge of the printed circuit board when the board is engaged, and is carried on a conveyor during the soldering process. The printed circuit board that has arrived is sandwiched between the cutting hanger and the rear hanger that are supplied to the seven-rail side of the guide rail mechanism, and a conveying force is applied to the rear hanger carriage via the clutch mechanism to prevent the printed circuit board from warping. The jet soldering method is configured to transport the printed circuit board in synchronization with the conveyor while preventing the occurrence of molten solder, and to prevent molten solder from covering the top surface of the printed circuit board when supplying the molten solder using the protection plate. This is accomplished by a device.

[For production]

With the above configuration, in the standby state, the front hanger and the rear hanger are waiting in line at the end of the collection rail of the guide rail mechanism. Here, when the printed circuit board is loaded on the conveyor on the soldering equipment side and transported to a position in front of the warpage prevention device, the front board is first supplied to the set rail, and then the hanger carriage is moved for a certain distance. The carrier,
The carriage is connected to the conveyor on the soldering equipment side via a friction clutch mechanism mounted on the carriage, and after receiving power from the conveyor and moving it forward on the set rail to a predetermined position, it is disconnected from the conveyor and applies braking force to the carriage. , then stop and wait for the printed circuit board to come later. During this time, the printed circuit board is conveyed to the conveyor, its leading edge is docked on the front hanger, and the printed circuit board is stopped together with the front hanger carriage.

Note that at this time, a protection plate rising upward is in contact with the front line of the printed circuit board.

On the other hand, after the printed circuit board has passed, the rear hanger carriage is supplied from the collection rail side to the starting end position of the set rail.

As a result, the carriage is connected to the conveyor via the clutch mechanism, and moves forward by receiving the conveying force from the conveyor. At this point, when the rear hanger is docked forward to the rear edge of the printed circuit board that is stationary while still being docked to the front hanger, the printed circuit board is sandwiched between the front hanger and the rear hanger, and the hook part of the hanger While supporting the printed circuit board in the warping direction, the rear hanger carriage starts moving forward together with the conveyor on the soldering device side, and during this transportation, molten solder is jetted onto the printed circuit board to perform soldering.

At this time, even if the height of the molten solder spout is set higher than the height of the top surface of the printed circuit board, the protection plate placed on the front hanger will not cause soldering defects such as the occurrence of unsoldered parts. Since this prevents the molten solder from sloshing onto the top surface of the printed circuit board, it will not adversely affect the electronic components mounted on the top surface of the printed circuit board. When the front hanger carriage reaches near the end of the set rail, the front hanger is cut off from the printed circuit board and only the carriage is sent forward to the end position of the busy rail, where the front hanger carriage is collected from the set rail. It is pulled up to the rail and collected.

Next, when the rear hanger carriage reaches the end of the set rail, the clutch mechanism is released by an external operation.
After disconnecting from the conveyor, it is pulled up to the collection rail and collected in the same way as the front hanger. During this time, the soldered printed circuit board is loaded onto a conveyor and transported to a later stage. Note that the front hanger carriage and the rear hanger carriage collected by the collection rail of the kite rail mechanism are transported again to the initial standby position by the conveyor mechanism installed in the rail m structure, thereby completing a series of cycles. During transportation in this soldering process, the leading and trailing edges of the printed circuit board are held down by the hooks of the front hanger and the rear hanger, so that no warpage occurs due to thermal distortion caused by soldering heat. In the above description, the means for applying a conveying force to the rear hanger carriage via the clutch mechanism may be other than the conveyor that conveys the substrate. For example, a conveyor for conveying a carriage that moves at a higher speed than the conveyor for conveying printed circuit boards is provided separately along the guide rail mechanism, and this conveyor for conveying the carriage and the rear hanger carriage are connected by a friction clutch machine sK. With configuration 5, the rear hanger always presses the printed circuit board with a constant force, and the engagement between the rear hanger and the printed circuit board becomes more reliable.

〔Example〕

Hereinafter, the configuration and operation of an embodiment of the present invention will be explained based on the drawings.

FIG. 1 is a perspective view showing the main parts of a jet soldering apparatus according to the present invention. In the figure, 6 is a transport conveyor that transports the printed circuit board 7 and applies transport force to the hanger carriage via a clutch mechanism. IO is a front hanger that locks onto the front and rear edges of the printed circuit board 7 and supports the board in the direction of warping.

Rear hangers 11 and 12 are front hanger carriages and rear hanger carriages that individually support the front hanger 9 and rear hanger 10, and a blade is attached to the front hanger 9 to prevent molten solder from covering the top surface of the board. The fixed protection plate 13 is a guide rail mechanism that guides the front hanger carriage 11 and the rear hanger carriage 12 in parallel with the conveyor 6.

Next, the detailed structure of each mechanism described above will be described individually.

First, as clearly shown in FIG. 2, the guide rail mechanism 13 is a circulation system consisting of a recovery rail 14 on the return side and a set rail 15 on the outbound side, which are arranged in two stages, upper and lower, so that they communicate with each other at both ends. The above-mentioned hanger carriages 11 and 12 are installed along this rail.
Guide the movement.

On the other hand, this guide rail mechanism 13 has an upstream side (m14 on the left in the figure) with respect to the moving direction A of the conveyor 6 shown in FIG. A carriage set mechanism 16 that transfers the hanger carriage to supply it is also located on the downstream side (
A carriage recovery mechanism 17 is provided on the right side of the figure (@) for transferring the hanger carriage I7 from the terminal end of the set rail 15 to the starting end side of the recovery rail 14. Note that these mechanisms consist of an elevating stage on which a carriage is mounted, and a cylinder that drives and operates the stage. Furthermore, a chain-type conveyor mechanism 18 is installed along the path along the upper collection rail 14 for conveying the carriage collected at the starting end of the collection rail toward the terminal position.

Next, the detailed structure of the hanger and hanger carriage will be explained with reference to FIGS. 3 to 5. First of all, Maeno Nga 9. The upper ends of the rear hanger IO are fitted and supported by the support arms 19 that protrude forward from the front hanger carriage If and the rear hanger carriage 12, respectively, and the mounting position on the arms can be adjusted in the direction of arrow C. Fixed with screws. This allows the engagement position of the hanger to be adjusted according to the size of the reprinted board. Furthermore, by simultaneously installing a plurality of hangers on the support arm 19, it is possible to support the reprinted board from one point to multiple points, and in this embodiment, it is supported at two points.

Furthermore, four hooks are attached to the lower ends of the hangers 9 and 10. Note that a protective grate 50, which will be described later, is attached to the front hanger 9.

On the other hand, the front carriage 11. which supported the hangers 9, 10. The carriage body of the rear hanger carriage 12 is equipped with two traveling roller blades and a tin rocket, and the rollers move along the guide rail mechanism 130 described above on the set rail and collection rail. In addition, the Suzu Rocket Sae is conveyed by meshing with the chain of the conveyor mechanism 18 mentioned above laid on the collection rail 14 side of the guide rail mechanism, and on the set rail 15 side, the fixed chain laid along the rail (as shown in Fig. 3) is conveyed. 25).

In addition, especially on the front hanger carriage 11 side, a sprocket 24 is attached to the support shaft on the carriage main body side with a rubber piece interposed so as to constantly apply a light brake, and the carriage 11 is attached to the set rail 15. Braking is applied when moving above.

The front hanger carriage 11 is equipped with a swinging lever that projects forward, and a sliding pad n that comes into contact with the conveyor claw 6b of the conveyor 6 on the soldering device side is provided at the tip of the lever. It constitutes a clutch machine. Note that the swing lever is always biased by a spring into the oblique position shown by the solid line in FIG. On the other hand, in the rear carriage 12, a rocking lever which is spring-biased to the solid line position shown in FIG. An engaging pin 4 is installed which is inserted into the gap between the conveyance claws 6b and engages with the conveyance claws 6b, and a notching type pin is provided between the top of the swing lever and the carriage body by a spring bias. An operating stopper mechanism is provided, and these parts move the carriage 12 onto the conveyor 6.
A pin-coupled clutch mechanism 31 is configured. The clutch mechanism 31 is released by a clutch release mechanism disposed at the end position of the set rail in the guide rail mechanism 13, as will be described later.

Here, the protective plate 50 attached to the front hanger 9 described above will be explained based on FIG. 6 and FIG. 8. In actual use, in addition to the protection plate of l fn class, as shown in Figure 6, two protection gray) 50,
51 are prepared, and one of them is selected and attached to the front hanger 9 after considering the shape of the electronic components mounted on the printed circuit board. In other words, a flat protective plate is normally attached to the rear side of the front hanger 9, and a part of the electronic components protrudes from the front edge of the printed circuit board (protection brake). 50, if there is a risk of interference with electronic components), a protective plate 51 with an angular cross section is attached to the front side of the front hanger 9. Note that the protective plates 50 and 51 are provided with a plurality of long holes, and by passing the fixing screw 52 through the long holes and screwing it into the screw hole 9a of the front hanger 9, the front hanger 9 can be secured. Shin plate blade.

Alternatively, 51 can be securely attached and fixed. Fig. 7 is a diagram showing a state in which a flat plate-shaped protective plate) 50 is attached to the front hanger 9, and Fig. 7 (a), Fig. 7 fb), and Fig. 7 TC
) are its plan view, front view, and side view, respectively. Moreover, FIG. 8 is a diagram showing a state in which the protective plate 51 having a cross-sectional shape is attached to the front hanger 9, and FIG. 8(a), W,
FIG. 8f) and FIG. 8(c) are a plan view, a front view, and a side view, respectively. As shown in FIG. 8, one surface 51a of the protective plate 51 parallel to the horizontal surface is provided with a notch 51b that fits into the hook portion of the front hanger 9. As shown in FIG.

On the other hand, the above-mentioned guide rail mechanism 13 is equipped with various missing mechanisms in addition to the above-mentioned mechanisms, and these mechanisms will be explained with reference to FIG. First, the front hanger carriage 11 is placed on the set rail 15 side between a certain distance section from the starting end.
The friction type clutch mechanism installed on the sliding pad n is the fourth
As shown from the solid line position to the broken line position in the figure, a set lever 32 is provided to suppress and guide the transfer conveyor claw 6b on the soldering apparatus side. This set lever 32 is protruded and retracted into the printed circuit board passage 9t11 by cylinder operation, and when the front hanger carriage 11 is supplied to the set rail 15 with the lever protruded and operated, it is mounted on the carriage 11. The swinging lever of the friction type clutch mechanism is forcibly swung to the position shown in the dotted line in FIG. Claw 6
The carriage 11 is suppressed by the surface b and receives a conveyance force from the conveyor side. Note that when the carriage 11 moves forward and disengages from the set lever 32, the friction type clutch mechanism automatically returns to its original position due to spring bias and is released, and as described in FIG. The braking force applied to will cause it to stop at that position. Further, near the end position of the set rail 15, there is an eject cylinder 33 for forcibly forwarding the front hanger carriage 11, and furthermore, at the end position, there is a clutch release cylinder 34 for releasing the clutch mechanism 31 mounted on the rear hanger carriage 12, etc. is equipped with. Naori latch release cylinder opening Clutch shown in Figure 5 @
The swing lever 26 of @31 is removed from the stopper mark (9) and is operated to swing from the solid line position to the broken line position.

In addition, at each important point in the guide rail mechanism 13, there are set detection sensors for the carriage facing the set mechanism 16, front hanger carriage 11. Back Ha/Gakiyari Tsuji 12
Type identification sensor A, operation confirmation sensor 37 for set lever 32, operation confirmation sensor 37 for eject cylinder 33,
Operation of the carriage recovery standby position detection sensor 39, the carriage recovery detection sensor 40, the sensor 41 that detects the approach of a printed circuit board to the warpage prevention device, the printed circuit board passage detection sensor 42 that is powered downstream of the sensor 41, etc. Various sensors necessary for control are installed. Note that 43 is a stopper cylinder that temporarily stops and holds the reprinted circuit board 7 at that position in response to a signal from the printed circuit board approach detection sensor 41. Furthermore, as shown in FIG. 8, a stepped cam section designated by reference numeral 15a is formed at a midway point of the set rail 15 in the guide rail mechanism. The cam portion 15a serves to correctly adjust the claw 21 of the hook portion W of the hanger 9#10(1) to the printed circuit board during the process of conveying the printed circuit board.

Next, the operation of the RGT soldering apparatus having the above configuration will be explained. First, in the standby state, the front hanger 9. The rear hanger lO is lined up and waiting at the end of the guide rail mechanism 13 on the recovery rail 14. When the printed circuit board 7 is carried on the conveyor 6, the stopper cylinder 7 is activated to temporarily stop the printed circuit board 7 at that position, and the carriage setting mechanism 16
operates to transfer the front hanger carriage 11 from the recovery rail 14 to the set rail 15. Subsequently, by the operation of the set lever 32 described above, the hanger carriage 11 is connected to the conveyor 6 via the friction type clutch mechanism mounted on the carriage, and the hanger carriage 11 is moved forward a certain conveyance distance by obtaining a conveying force from the conveyor side. . Also, when the carriage 11 reaches a point where it is released from the set lever 32, the latching mechanism returns to its original position and is separated from the conveyor 6, and at the same time works between the carriage 11 (clip lock) 24 and the fixed chain δ. The carriage 11 is stopped at that position by the braking force and waits for the printed circuit board that comes later. Further, the set lever 32 is operated to return to the retracted position so as to avoid interference with the rear hanger carriage 12 coming later. Meanwhile, the stopper cylinder 43 that had stopped and held the printed circuit board 7 operates to release the printed circuit board 7, and the printed circuit board 7 is conveyed to the conveyor 6, its leading edge docks on the stopped front hanger 9, and then the front hanger carriage 11 and stop at that position. At this time, the left and right edges of the printed circuit board 7 are sliding on the claws 6b of the conveyor 6.

Then, the front edge of the printed circuit board 7 is brought into contact with a protective plate that rises upward.

On the other hand, when the passage of the printed circuit board 7 is detected by the sensor 37, the rear hanger carriage I2 is moved from the recovery rail 14 side to the starting end position of the set rail 15 by the carriage setting machine 'a16. At the same time, the pin 4 of the clutch mechanism 31 mounted on the carriage 12 enters between the conveyor claws 6b of the soldering device [#] and engages with the claws 6b, as shown in FIGS. 3 and 5. As a result, the carriage 12 becomes connected to the transport conveyor 6 via the clutch mechanism 31, receives transport force from the conveyor 6, and moves forward together with the transport conveyor. At this point, when the rear hanger 11 catches up with the printed circuit board 7 which is stopped forward while being docked to the front hanger 9 and comes to be docked at its rear edge, the printed circuit board 7 is placed between the front hanger 9 and the rear hanger 10.
The front hanger carriage 11. is sandwiched between the front hanger carriage 11. The whole is transported forward while remaining docked with the printed circuit board 7. Also, when the set rail 15 passes through the stepped cam portion 15a of the set rail 15 shown in FIG. 2 during transportation, the hanger 9. ” 0 rises slightly, and in this process the printed circuit board 7
leading edge of.

The rear edge is properly adjusted to the hanger hook portion and is supported by the fixing claw 21 thereof. In this way, by supporting the front and rear edges of the printed circuit board 7 with the fixing claws 21, warping in the vertical directions that occurred on the printed circuit board before the soldering process can be corrected, and the jet soldering that is performed next can be corrected. It becomes possible to prevent the occurrence of warping due to local heating applied to the attached glands. When the printed circuit board 7 reaches the jet soldering position in the solder bath, molten solder is supplied from below to the solder base 7 in a jet manner to perform soldering. At this time, the height of the spouting of the bath melted solder should be adjusted to the height of the printed circuit board so as not to cause soldering defects such as the generation of unsoldered parts.
Although the height is set higher than the height of the top surface, the protective grate 50 sprayed on the front hanger 9 prevents molten solder from covering the top surface of the printed circuit board 7, so that it can be mounted on the top surface of the printed circuit board 7. It will not have any adverse effect on the electronic components in it.

9 has been soldered, and the front hanger carriage 11
When it reaches near the end of the set rail 15, the eject cylinder described in FIG. The front hanger carriage 11 is then moved forward, and the front hanger carriage 11 is pulled up from the set rail 15 to the recovery rail 14 and recovered by the operation of the carriage recovery machine $17. During this time, the conveyance of the printed circuit board continues, and then the rear hanger carriage 12 moves to the set rail 15.
When the clutch mechanism 31 mounted on the carriage 12 is released by the operation of the clutch release cylinder, the connection with the transport conveyor 6 is released.
By this operation, it is pulled up to the collection rail 14 and collected. During this time, the soldered printed circuit board 7 is loaded onto the conveyor 6 and transported to the exit side. Further, the front hanger carriage 11 and the rear hanger carriage 12 collected on the collection rail 14 of the guide rail mechanism 13 are transferred again to the initial standby position by the conveyor mechanism 18 equipped on the rail mechanism 13, and stopped so as to overlap at this position. The series of operation cycles then ends. In addition, by loading multiple sets of hangers, including a front hanger 9 and a rear hanger LO, on the Augajiri guide rail @ structure 13, printing can be performed continuously at a fixed interval on the soldering device. Even when a board is supplied, it can be handled without impairing the processing capacity of the soldering device. Moreover, the front hanger 9 and the rear hanger 10 are the hanger carriage 11,
12 and are separately and independently loaded on the guide rail mechanism 13, multiple sets of hangers can be accommodated within a limited dimension, and since the front hanger 9 and the rear hanger 10 are separated, The conveyance operation of the printed circuit board is not affected by the board size, and can be reliably adapted to various sizes of printed circuit boards.

〔Effect of the invention〕

As is clear from the above description, the jet soldering apparatus according to the present invention includes a pair of front hangers that engage the front and rear edges of the printed circuit board to support the printed circuit board in the direction of warping; a rear hanger, a front hanger carriage that individually supports each hanger, and a rear hanger carriage;
A circulating guide rail mechanism includes a set rail on the outbound side and a collection rail on the return side for guiding each carriage in parallel with the conveyor, and a circulating guide rail mechanism that is mounted on the rear hanger carriage to move the carriage on the conveyor or separately. a clutch mechanism connected to a provided conveyor for conveying a carriage; and a protection plate attached to the front hanger so as to rise upward from the front line of the printed circuit board when the front hanger and the printed circuit board are engaged. Therefore, it is possible to prevent warping of the printed circuit board due to soldering heat and perform reliable soldering without fear of interference with the mounted chip on the printed circuit board side. Furthermore, since the protective plate prevents molten solder from covering the top surface of the reprinted board, the height of the molten solder spout can be set higher than in conventional devices. Therefore, soldering defects such as the occurrence of unsoldered parts are eliminated, and an improvement in yield can be expected.

[Brief explanation of the drawing]

FIG. 1 shows all! of the jet soldering apparatus according to the present invention.
A perspective view of the main parts showing the configuration, FIG. 2 shows the guide rail mechanism in FIG. 1, and various mechanisms equipped on the rail mechanism,
A side view showing the arrangement of the sensor, FIG. 3 is an enlarged view of the hanger holding the printed circuit board and the hanger carriage, and FIGS. 4 and 5 are the front I/NG carriage in FIG. 3, respectively. and a front view of the rear hanger carriage. Figure 6 is a perspective view to explain how to attach the protection plate to the front hanger. Figure 7 is a flat securing plate attached to the front hanger. A diagram showing the state,
Figures 7(a), 7(b), and 7(c) are a plan view, a front view, and a side view, respectively. FIG. 8(a) and FIG. 8(b) are diagrams showing the installed state. FIG. 8(c) is a plan view, a front view, and a side view thereof, FIG. 9 is a configuration diagram showing the entire conventional jet soldering apparatus, FIG. 1O is a conveyor mechanism in FIG. 9,
111 is a front view of the conveyed state of the printed circuit board in FIG. 1O, and FIG. 12 is a perspective view showing the solder tank K. FIG. l: Spray 6-type soldering device main body, 6: Transfer conhair,
7: Printed circuit board, 9: Front hanger, lo: Rear hanger, 1
1: Front hanger carriage, 12: Rear hanger carriage,
13 Ni guide rail machine barrel, 14: Collection rail, 15: Sect rail, 16: Carriage set mechanism, 17: Carriage collection mechanism, 19: Support arm, 20 Two hook parts,
28: Friction type clutch mechanism, 31: Pin engagement type clutch mechanism, 50, 51: Mining plate.

Claims (1)

[Claims] 1) Load the printed circuit board onto a pair of left and right conveyors,
This is a jet soldering device that solders the connections by flowing molten solder in a jet style downwards toward the reprinted circuit board while it is being transported, and hooks engage the leading and trailing edges of the printed circuit board. a pair of front hangers and rear hangers that support the printed circuit board in the direction of warping; a front hanger carriage and a rear hanger carriage that individually support each hanger;
A circulating guide rail mechanism includes a set rail on the outbound side and a collection rail on the return side for guiding each carriage in parallel with the conveyor, and a circulating guide rail mechanism that is mounted on the rear hanger carriage to move the carriage on the conveyor or separately. a clutch mechanism connected to a provided conveyor for conveying a carriage; and a protection plate attached to the front hanger so as to rise upward from the front edge of the printed circuit board when the front hanger and the printed circuit board are engaged. The printed circuit board mounted on the conveyor during the soldering process is sandwiched between the front hanger and the rear hanger that are supplied to the set rail side of the guide rail mechanism.
A conveying force is applied to the rear hanger carriage via the clutch mechanism to prevent the printed circuit board from warping and convey the printed circuit board in synchronization with the conveyor, and the protective plate supplies molten solder. A jet soldering device characterized in that it prevents molten solder from covering the top surface of a printed circuit board during soldering.