JPH06209160A - Soldering substrate transfer device - Google Patents

Abstract

PURPOSE:To prevent the warpage of a substrate due to heat and the load of components by the rigidity of warpage preventive jigs, which are moved along with transfer pawls, by a method wherein the device is provided with the warpage preventive jigs supported pivotally in an invertible manner by the transfer pawls, a jig set, a set mechanism and the like. CONSTITUTION:When a substrate P is detected by a sensor 22, jig pushers 36 are made to advance as shown by arrows by actuators 35 to push warpage preventive jigs 15 and the jigs 15 are rotated to a fall state and are engaged horizontally by a stopper. Then, after a substrate pusher 24 is rotated upward, it pushes the substrate P, pushes the substrate P in between transfer pawls 14 on both sides of the substrate P and at the same time, the front end part of the substrate P is engaged with the jigs 15 which are in the fall state. The substrate P is transferred along with the pawls 14 and the jigs 15. The jigs 15 are in the fall state until the substrate P is released from the pawls 14 at a point (a), but the jigs 15 are rotated to a rise state as the pawls 14 are moved to a point (b) and a point (c) and are moved to a substrate carrying-in side part 21 as they are in this rise state.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering board transfer device provided with a so-called holderless conveyor and a retractable warp preventing jig.

[0002]

2. Description of the Related Art In an automatic soldering line using a so-called holderless conveyor, in which a substrate is clamped and conveyed by endlessly moving conveying claws on both sides of the substrate, the substrate is heated by the heat applied to the substrate and the weight of mounted components. There is a possibility that warpage may occur, soldering may occur on the jet solder bath, the substrate may drop from between the transfer claws on both sides, or the solderability may deteriorate.

Therefore, in order to prevent the warp of the substrate, for example, JP-A-62-50867 and JP-A-62-5086 are used.
There is also an example in which a warp prevention member as shown in No. 8 and the like is arranged on the jet solder bath, but such a warp prevention member is limited in installation location, and it is difficult to provide it over the entire length of the automatic soldering line. is there.

On the other hand, a warp preventing jig is manually fitted to the board before being supplied to the soldering line, and then manually removed after soldering.

[0005]

Although this method of manually attaching and detaching the warp prevention jig to the substrate is excellent in terms of preventing warpage, it imposes a heavy burden on the operator and automation is desired.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to mount a warp prevention jig on a so-called holderless conveyor itself so as to achieve labor saving in warp prevention.

[0007]

SUMMARY OF THE INVENTION The present invention is a soldering substrate transfer device for sandwiching and transferring a substrate by endlessly arrayed transfer claws on both sides of the substrate. A warp prevention jig that is pivotally supported and locks the end of the board in a tilted state, and a warp prevention jig that is provided on the board loading side that carries the board between the transfer claws A soldering board having a jig setting mechanism for tilting the board and a jig resetting mechanism provided on the board unloading side for carrying the board out between the transfer claws and returning the warp prevention jig from the tilted state to the awake state. It is a carrier device.

[0008]

According to the present invention, when the substrate is clamped by the transfer claw, the warp prevention jig is tilted from the raised state to the collapsed state by the jig setting mechanism, and the warp prevention jig prevents the warp of the substrate clamped by the transfer claw. To do. Further, when the transfer claw releases the substrate from being pinched, the warp prevention jig is returned to the raised state and moved by the jig reset mechanism.

[0009]

The present invention will be described in detail below with reference to an embodiment shown in the drawings.

As shown in FIG. 1, a pair of transport rails
11 are provided in parallel, and a sprocket 12 that is synchronously driven is provided at both ends of each transport rail 11, and a pair of endless chains 13 are provided by each transport rail 11 and sprocket 12.
Are provided so as to be freely movable, and the conveying claws 14 are attached at a constant pitch over the entire length of each of the endless chains 13.

The transfer claws 14 on both sides convey the substrate P while sandwiching it from both sides, and a warp prevention jig 15 is pivotally supported on all the transfer claws 14 on one side thereof as described later. ing. The warp prevention jig 15 is provided on each of the conveying claws 14.

Further, in the substrate transfer apparatus shown in FIG. 1, the substrate loading side portion 21 for loading the substrate P between the transfer claws 14 has a sensor 22 for detecting the substrate P, and the sensor 22 operates to detect the substrate. An actuator 23 is provided, and a substrate pusher 24 that pushes the substrate P between the transfer claws 14 on both sides is provided at the tip of the operating rod of the actuator 23.
At the end opposite to the substrate loading side 21, the substrate P is conveyed.
A board unloading side portion 25 is carried out from between 14 positions.

FIG. 2 shows the substrate loading side 21, and the warp prevention jig 15 is rotatable with respect to the bearing portion 31 of each transfer claw 14 so as to be freely rotatable between a raised state and a tilted state. An angle member having a support shaft 32 fitted in. This warp prevention jig 15
A pressed portion 33 that protrudes to the opposite side from the support shaft 32 is provided on the.

Further, a jig setting mechanism for tilting the warp prevention jig 15 from the raised state to the collapsed state on the board loading side 21.
34 are provided. This jig setting mechanism 34 moves the actuator (air cylinder) to a fixed position on the sprocket 12.
35 is arranged, and a jig pusher 36 is attached to the tip of the operating rod of this actuator 35. The jig pusher 36 only reciprocates.

On the other hand, the actuator 23 of the substrate pusher 24 has both reciprocating and rotating functions, and the substrate pusher 24 is made to stand by in the downward state shown by the two-dot chain line in FIG. After passing over the substrate pusher 24, the substrate pusher 24 is rotated 180 ° and pushed out to press the rear end of the substrate P.

FIG. 3 shows a jig resetting mechanism 40 provided on the board unloading side portion 25. The warp preventing jig 15 locked by a stopper 41 fixed to the lower surface of the carrying claw 14 is in a tilted state. As the jig reset mechanism 40 for returning to the upright state, a jig return rail 42 that contacts the pressed portion 33 of the warp prevention jig 15 and pushes it down is provided. This jig return rail
42 is a conveying claw as shown in FIGS. 3 (A) (B) (C).
It is provided so that the relative level to the support shaft 32 changes along the 14 movement paths.

In such a structure, first, the warp prevention jig 15 moves in the raised state shown by the two-dot chain line in FIG. 2 until the transfer claw 14 reaches the substrate loading side 21. The substrate pusher 24 stands by in the downward direction shown by the chain double-dashed line in FIG.

Then, the substrate P that has been carried in is detected by the sensor 22.
Actuator detects the jig pusher 36
Moves forward as indicated by the arrow and pushes the warp prevention jig 15, the warp prevention jig 15 rotates to a tilted state, and is horizontally locked by the stopper 41 as shown in FIG. 3 (A).

Further, as shown in FIG. 2, after the substrate pusher 24 rotates upward, the substrate P is pushed to push the substrate P between the transfer claws 14 on both sides, and at the same time, the warp prevention jig 15 in the collapsed state is pushed. The front end of the substrate P is engaged with. The substrate P is transported together with the transport claw 14 and the warp prevention jig 15.

Then, the transfer claw 14 moves the substrate P at the point a in FIG.
Until the release of the warp, the warp prevention jig 15 is shown in FIG.
Although it is in a tilted state as shown in ′), as the transport claw 14 moves to point b in FIG. 1 and point c in FIG.
The warp prevention jig 15 is shown in FIGS. 3 (B), (B ') and FIG. 3 (C).
As shown in (C '), the pressed portion 33 is fixed to the jig return rail.
It is pushed down by 42 and rotated to the upright state, and moves to the substrate loading side 21 as it is.

The jig return rail 42 is provided with the jig pusher 36.
3 (C) (C ') until just before the operating position, the jig pusher 36 is in the operating position shown in FIGS. 3 (A) (A'). ing.

The above operation is selectively performed for each warp preventing jig 15 pivotally supported by each conveying claw 14 depending on the size of the substrate and the like.

The warp prevention jig 15, the jig setting mechanism 34, and the jig resetting mechanism 40 may be provided on the transfer claws 14 on both sides of the substrate, respectively.

[0024]

According to the present invention, since the warp prevention jig tiltably supported on the conveying claw, the jig setting mechanism and the jig resetting mechanism are provided, the warp preventing jig that moves together with the conveying claw is provided. The rigidity prevents the board from warping due to heat or component load without requiring manpower, and can prevent the board from dropping or the solder cover when jet soldering. Further, when the carrying claws release the substrate from being clamped, the jig resetting mechanism returns the warp preventing jig to the raised state and moves the jig, thereby saving the space of the apparatus.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a soldering board transfer device of the present invention.

FIG. 2 is a perspective view showing a substrate loading side portion of the above carrier device.

FIG. 3 is an explanatory diagram showing a jig resetting mechanism of the above-described transporting device and its operation.

[Explanation of symbols]

 P board 14 transfer claw 15 warp prevention jig 21 board loading side 25 board unloading side 34 jig setting mechanism 40 jig resetting mechanism

Claims (1)

[Claims] 1. A soldering board transfer device for holding and carrying a board by endlessly arranged transfer claws arranged on both sides of the board, and at least one transfer claw is pivotally supported and tilted. A warp prevention jig that locks the end portion of the board in a state, and a jig setting mechanism that is provided on the board loading side that carries the board between the transfer claws and that tilts the warp prevention jig from the raised state to the collapsed state, A soldering board transfer device, comprising: a jig reset mechanism which is provided at a board unloading side part for unloading a board from between transfer claws and which returns the warp prevention jig from a tilted state to a raised state.