JPH0279441A - Package - Google Patents

Abstract

PURPOSE:To prevent the contact or electrical short-circuit between a bump metal and a device end conductive part by connecting the space between the bump underlying electrode formed with the bump electrode of a package surface and the package end electrode corresponding to the electrode by the metallic wiring having a curved part. CONSTITUTION:A device surface 6 is faced downward, and then mounted on a bump package 7, following this, an electrode 8 of the device and a bump electrode 5 of the package are aligned to each other, and the device is packaged by heat-fixing them. And, in the package, package upper wiring 2 is pulled round from a bump underlying electrode 4 toward the center of the package or the transverse direction, after that, wired toward a package electrode 3. Therefore, even the bump metal spreads, it may spread over the insulating film of a device surface 6, thereby never occurring any electrical short-circuit between a device substrate and the electrode 8.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a package for mounting a device.

[Conventional technology]

A typical structure of a conventional bump package will be explained using the schematic cross-sectional views of FIGS. 2 and 3.

In the package shown in FIG. 2, wiring 2, package end electrodes 3, and bump base electrodes 4 are formed by a thin film pattern of metal, for example, gold, on an insulating substrate 1 made of epoxy glass or sapphire. A bump electrode 5 made of, for example, solder is formed on the bump base electrode 4 . FIG. 3 is a schematic cross-sectional view showing device packaging using this bump package. In the figure, the device is packaged by placing the device with its surface 6 facing downward on the insulating substrate 1 of the bump package 7, aligning the electrodes 8 of the device with the bump electrodes 5 of the package, and bonding them by thermocompression. ing.

[Problem to be solved by the invention]

By the way, in the conventional package, the package end electrode 3
and the bump base electrode 4 were installed facing each other inside and outside, and were connected in a straight line with the wiring 2, so that the bump metal 1, for example, the solder, was bonded to the bump metal 1 during thermocompression bonding when mounting the device, as shown in Figure 4. Then, it flows out along the wiring on the package 7 and comes into contact with the conductive portion 9 at the end of the device, causing an electrical short circuit. The device surface 6 is covered with an insulating film 10, for example silicon oxide. but.

The conductive substrate at the device end is usually exposed, and when the bump metal of the bump electrode 5 spreads over the highly wettable metal of the wiring 2 and comes into contact with the device end conductive portion 9 during thermocompression bonding, the device end A problem arises in which the 8 and the substrate are electrically short-circuited. Furthermore, if the device is left in a high-temperature environment after mounting, the same failure will occur.

An object of the present invention is to provide a package that solves these problems.

[Means to solve the problem]

In order to achieve the above object, the present invention provides a package that is electrically connected to a device via a bump electrode, and includes a bump base electrode on the package surface on which the bump electrode is formed;
The package end electrodes corresponding to the electrodes are connected by a metal wiring having a bent portion at at least one place.

[Effect]

By routing the wiring on the package toward the center of the package or laterally and then disposing it on the package end electrode, contact or electrical short circuit between the bump metal and the device end conductive portion can be prevented.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 1 and 5.

In the package shown in FIG. 1, wiring 2, package end electrodes 3, and bump base electrodes 4 are formed by a thin film pattern of metal, for example, gold, on an insulating substrate 1 made of epoxy glass or sapphire. In this embodiment, in which a bump electrode 5 made of, for example, solder is formed on a bump base electrode 4, the package end electrode 3 and the bump base electrode 4 are connected by a wiring 2, but a part of the wiring 2 has a bent part. 3, and the relative position of the bump base electrode 4 with respect to the package end electrode 3 is shifted in the lateral direction. The bump electrode 5 is connected to the package end electrode 3 by an arrangement a2 that is routed toward the center of the package or laterally.

FIG. 5 is a schematic cross-sectional view showing device packaging using this bump package. Device surface 6
The device is packaged by placing the package facing downward on the bump package 7, aligning the electrode 8 of the device and the bump electrode 5 of the package, and bonding them by thermocompression.

The electrical short circuit between the electrode and the substrate, schematically shown in FIG. 5, occurs when the bump metal spreads toward the device edge along the wiring 2 on the package, which is routed from the bump base electrode 4 to the package edge electrode 3. Occurs when the Zobis edge comes into contact with a conductive part. In the package of the present invention, the package wiring 2 is routed from the bump base electrode 4 toward the center of the package or laterally, and then toward the package end electrode 3, so even if the bump metal spreads, the device surface 6 Since it spreads over the insulating film 10, no electrical short circuit occurs between the device substrate and the electrode 8.

In the above embodiments, an example is shown in which the relative positions of the package end electrode 3 and the bump base electrode 4 are shifted in the horizontal direction and formed on the insulating substrate 1. It is not limited. In short, a bent portion may be formed at at least one location of the wiring 2 that connects the two electrodes, and a detour may be taken for the shortest distance between the two electrodes.

[Effects of the Invention] As described above, the package of the present invention has the effect of effectively preventing electrical short circuit between the electrode and the substrate even if the bump metal flows out.

[Brief explanation of the drawing]

Fig. 1 is a schematic diagram of the package of the present invention, Fig. 2 is a schematic diagram of a conventional package, Fig. 3 is a cross-sectional schematic diagram showing a device mounting state using the conventional package, and Fig. 4 is a schematic diagram of the conventional package. FIG. 5 is a schematic cross-sectional view taken along the line v--V in FIG. 1 showing a state in which a device is mounted using the package of the present invention. 1... Insulating substrate 2... Wiring 3... Package end electrode 4... Bump base electrode 5... Bump electrode 6... Device surface 7... Bump package 8... Device electrode 9...Device end conductive part 10...Insulating film series 3 Figure 6 Device δB I Calculation 4 Figure

Claims (1)

[Claims] (1) In a package that is electrically connected to a device via a bump electrode, a metal wiring having at least one bent portion between a bump base electrode forming the bump electrode on the package surface and a package end electrode corresponding to the electrode. A package characterized by being connected by.