JPH027480Y2 - - Google Patents

Info

Publication number
JPH027480Y2
JPH027480Y2 JP12836785U JP12836785U JPH027480Y2 JP H027480 Y2 JPH027480 Y2 JP H027480Y2 JP 12836785 U JP12836785 U JP 12836785U JP 12836785 U JP12836785 U JP 12836785U JP H027480 Y2 JPH027480 Y2 JP H027480Y2
Authority
JP
Japan
Prior art keywords
substrate
board
holding piece
temporary assembly
temporarily
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12836785U
Other languages
Japanese (ja)
Other versions
JPS6237983U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12836785U priority Critical patent/JPH027480Y2/ja
Publication of JPS6237983U publication Critical patent/JPS6237983U/ja
Application granted granted Critical
Publication of JPH027480Y2 publication Critical patent/JPH027480Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Mounting Components In General For Electric Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【考案の詳細な説明】 (産業上の利用分野) 本考案は基板への素子取付装置に関する。[Detailed explanation of the idea] (Industrial application field) The present invention relates to an apparatus for attaching elements to a substrate.

(従来の技術) 従来プリント配線その他の手段で配線された基
板に、スイツチング素子その他の素子を仮組し、
これをハンダ槽に浸漬して基板に施された配線を
素子とを接続するものは知られる。
(Prior art) Switching elements and other elements are temporarily assembled on a board that has been wired by conventional printed wiring or other means,
It is known that this is immersed in a solder bath to connect wiring provided on the board to the element.

(考案が解決しようとする問題点) 従来、基板aへの素子bの仮組みは、素子bの
上面に仮組具として重りcを載せ、ハンダ槽浸漬
されるとき素子bがハンダの浮力によつて浮上る
のを防ぐだけであり、従つて該重りcはハンダ付
作業の終了と同時に取外されるを一般とする。
(Problem to be solved by the invention) Conventionally, when temporarily assembling element B onto board A, a weight C is placed on the top surface of element B as a temporary assembly, and when element B is immersed in a solder bath, element B is affected by the buoyancy of the solder. It only serves to prevent the soldering work from floating up, and therefore, the weight c is generally removed at the same time as the soldering work is completed.

そしてかかる基板ではこれを制御ボツクスに組
込んだとき制御ボツクスに施した操作子挿通用の
透窓から侵入する塵等が基板表面に附着し易いの
不都合があつた。
When such a board is assembled into a control box, there is a problem in that dust, etc. that enters through the transparent window provided in the control box for inserting the operator easily adheres to the surface of the board.

(問題点を解決するための手段) 本考案はかかる現状に鑑み該仮組具をそのまま
残して該基板を制御ボツクスに組付けるとき防塵
装置として機能させるようにしたものを提供する
もので、あらかじめプリント配線その他の手段で
配設された基板に、スイツチング素子その他の操
作子を備える素子を仮組し、これをハンダ槽に浸
漬して基板に施された配線と素子とを接続するも
のに於いて、該素子を基板に仮組する仮組具を、
基板に結着する脚部と該素子の操作子を挿通する
透孔を備えた平板状の素子押え片と該素子押え片
の両側から立上る折起片とを備えるものに構成し
て成る。
(Means for Solving the Problems) In view of the current situation, the present invention provides a device in which the temporary assembly remains as it is and functions as a dustproof device when the board is assembled into the control box. In this method, an element including a switching element or other operating element is temporarily assembled on a board arranged by printed wiring or other means, and this is immersed in a solder bath to connect the wiring applied to the board and the element. and a temporary assembly tool for temporarily assembling the element on the substrate,
It is constructed by comprising a flat element holding piece having a leg portion to be attached to the substrate and a through hole through which an operator of the element is inserted, and folding pieces rising from both sides of the element holding piece.

(実施例) 図面で1はあらかじめプリント配線その他の手
段で配線された基板、2は該基板1に組付けられ
るスイツチング素子その他の操作子2aを備える
素子を示し、該基板1に施された透孔3に各素子
2の端子2bを挿通して仮組具4により仮組み
し、ハンダ付を必要とする部分のみにフラツクス
を施した後これをハンダ槽に浸漬する。かくする
ときは、基板1に施された配線と各素子2とが接
続される。
(Example) In the drawings, reference numeral 1 indicates a board that has been wired in advance by printed wiring or other means, and reference numeral 2 indicates an element including a switching element or other operating element 2a that is assembled on the board 1. The terminals 2b of each element 2 are inserted into the holes 3 and temporarily assembled using the temporary assembly tool 4. After applying flux only to the parts that require soldering, this is immersed in a solder bath. In this case, the wiring provided on the substrate 1 and each element 2 are connected.

これまでの構成は従来知られているものと特に
変るところはない。
The configuration up to now is not particularly different from what is conventionally known.

本考案はかかるものに於いて、前記仮組具4
を、基板1に結着する脚部4aと該素子2の操作
子2aを挿通する透孔4bを備えた平板状の素子
押え片4cと該素子押え片4cの両側から立上る
折起片4dとを備えるものに構成したもので、こ
れを詳述すると、図示するものでは長手の素子押
え片4cの長手方向に沿つて多数個の透孔4bを
設けると共に、該素子押え片4cの両側を上方に
折起して折起片4d,4dを構成し、且つ素子押
え片4cの両端を下方に折曲げて脚部4aを構成
し、該脚部4a,4aの両側に切欠き4e,4e
を施し、該切欠き4e,4eに基板1を挟持固定
させるようにした。
In such a case, the present invention provides the temporary assembly 4.
, a flat element holding piece 4c having a leg portion 4a fixed to the substrate 1, a through hole 4b through which the operator 2a of the element 2 is inserted, and folding pieces 4d rising from both sides of the element holding piece 4c. To explain this in detail, in the illustrated one, a large number of through holes 4b are provided along the longitudinal direction of the long element holding piece 4c, and both sides of the element holding piece 4c are provided with a plurality of through holes 4b. It is folded upward to form folded pieces 4d, 4d, and both ends of the element holding piece 4c are bent downward to form leg portions 4a, and notches 4e, 4e are formed on both sides of the leg portions 4a, 4a.
The substrate 1 was clamped and fixed in the notches 4e, 4e.

(作用) かくするときは、基板1の所定位置に素子2を
配設した後脚部4a,4aで基板1にこれを結着
し、素子押え片4cで素子2の上面を押え、基板
1をハンダ槽に浸漬してハンダ付作業を施すと
き、該素子2がハンダによつて浮上るのを阻止出
来る。
(Function) When doing this, the element 2 is placed at a predetermined position on the substrate 1, the rear legs 4a, 4a are used to bind the element 2 to the substrate 1, the element holding piece 4c is used to press the top surface of the element 2, and the element 2 is placed in a predetermined position on the substrate 1. When performing soldering work by immersing the element 2 in a solder bath, it is possible to prevent the element 2 from floating up due to the solder.

そして第4図に示すごとく制御ボツクスAにこ
れを組付けるとき、該折起片4d,4dの前端を
該制御ボツクスAの前板5の裏面に当接するごと
く組付ける。
When this is assembled into the control box A as shown in FIG. 4, the front ends of the folding pieces 4d, 4d are assembled so as to come into contact with the back surface of the front plate 5 of the control box A.

かくするときは前板5に施される操作子2a挿
通用の透孔5aから該制御ボツクスa内に塵等が
侵入するようなことがあつても該素子押え片4c
並びに折起片4d,4dによつて該透孔5aを囲
うことが出来て、基板1まで塵等が侵入するのを
防ぐ。
In this case, even if dust or the like enters into the control box a through the through hole 5a provided in the front plate 5 for inserting the operator 2a, the element holding piece 4c
Furthermore, the through hole 5a can be surrounded by the folding pieces 4d, 4d, thereby preventing dust and the like from entering the substrate 1.

(考案の効果) このように本考案によるときは、素子を基板に
仮組する仮組具を、基板に結着する脚部と該素子
の操作子を挿通する透孔を備えた平板状の素子押
え片と該素子押え片の両側から立上る折起片とを
備えるものに構成したので、該脚部によつて簡単
に仮組具を結着出来ると共に素子押え片で確実に
素子を押え得て、ハンダ槽に浸漬してハンダ付す
るときの素子の浮上を確実に防ぎ得られ、しかも
該仮組具を組付けた状態で制御ボツクスに基板を
組付けるとき、該制御ボツクスに設けた素子挿通
用の透孔を囲うカバとして該仮組具が作用し、こ
れによつて基板の表面まで塵等が侵入するのを確
実に防げる効果がある。
(Effects of the invention) As described above, according to the invention, the temporary assembly for temporarily assembling the element to the substrate is made of a flat plate having legs to be attached to the substrate and a through hole through which the operator of the element is inserted. Since it is configured to include an element holding piece and folding pieces rising from both sides of the element holding piece, the temporary assembly can be easily tied together using the legs, and the element can be held securely with the element holding piece. As a result, it is possible to reliably prevent the floating of the element when soldering it by immersing it in a soldering bath, and when assembling the board to the control box with the temporary assembly assembled, it is possible to The temporary assembly acts as a cover surrounding the through hole for inserting the element, and thereby has the effect of reliably preventing dust and the like from penetrating to the surface of the board.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案実施の1例を示す1部を截除し
た側面図、第2図はその1部の拡大截断面図、第
3図は仮組具の斜面図、第4図は基板を組付けた
制御ボツクスの正面図、第5図はそのV−V線截
断面図、第6図は従来例を示す側面図である。 1……基板、2……素子、2a……操作子、4
……仮組具、4a……脚部、4b……透孔、4c
……素子押え片、4d……折起片。
Fig. 1 is a partially cutaway side view showing an example of the implementation of the present invention, Fig. 2 is an enlarged cross-sectional view of a part thereof, Fig. 3 is a perspective view of the temporary assembly, and Fig. 4 is the board. 5 is a sectional view taken along the line V-V, and FIG. 6 is a side view showing a conventional example. 1... Board, 2... Element, 2a... Operator, 4
...temporary assembly, 4a...leg, 4b...through hole, 4c
...Element holding piece, 4d...Folding piece.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] あらかじめプリント配線その他の手段で配設さ
れた基板に、スイツチング素子その他の操作子を
備える素子を仮組し、これをハンダ槽に浸漬して
基板に施された配線と素子とを接続するものに於
いて、該素子を基板に仮組する仮組具を、基板に
結着する脚部と該素子の操作子を挿通する透孔を
備えた平板状の素子押え片と該素子押え片の両側
から立上る折起片とを備えるものに構成して成る
基板への素子取付装置。
A device that temporarily assembles an element with a switching element or other operating element onto a board that has been arranged in advance by printed wiring or other means, and then immerses it in a solder bath to connect the wiring provided on the board and the element. A temporary assembling tool for temporarily assembling the element onto a substrate is provided with a flat element holding piece having legs for binding to the substrate and a through hole through which an operator of the element is inserted, and both sides of the element holding piece. An apparatus for attaching an element to a substrate, comprising a folding piece rising from the base.
JP12836785U 1985-08-24 1985-08-24 Expired JPH027480Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12836785U JPH027480Y2 (en) 1985-08-24 1985-08-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12836785U JPH027480Y2 (en) 1985-08-24 1985-08-24

Publications (2)

Publication Number Publication Date
JPS6237983U JPS6237983U (en) 1987-03-06
JPH027480Y2 true JPH027480Y2 (en) 1990-02-22

Family

ID=31023971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12836785U Expired JPH027480Y2 (en) 1985-08-24 1985-08-24

Country Status (1)

Country Link
JP (1) JPH027480Y2 (en)

Also Published As

Publication number Publication date
JPS6237983U (en) 1987-03-06

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