JPH02743U - - Google Patents
Info
- Publication number
- JPH02743U JPH02743U JP7795088U JP7795088U JPH02743U JP H02743 U JPH02743 U JP H02743U JP 7795088 U JP7795088 U JP 7795088U JP 7795088 U JP7795088 U JP 7795088U JP H02743 U JPH02743 U JP H02743U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- lead
- internal
- support bar
- insulating tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7795088U JPH02743U (ru) | 1988-06-13 | 1988-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7795088U JPH02743U (ru) | 1988-06-13 | 1988-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02743U true JPH02743U (ru) | 1990-01-05 |
Family
ID=31302906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7795088U Pending JPH02743U (ru) | 1988-06-13 | 1988-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02743U (ru) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04170059A (ja) * | 1990-11-02 | 1992-06-17 | Nec Kyushu Ltd | リードフレーム |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6236547B2 (ru) * | 1980-01-31 | 1987-08-07 | Matsushita Electric Works Ltd | |
| JPS6373547A (ja) * | 1986-09-16 | 1988-04-04 | Nec Corp | 半導体装置のリ−ドフレ−ム |
| JPH01106461A (ja) * | 1987-10-20 | 1989-04-24 | Fujitsu Ltd | リードフレーム |
-
1988
- 1988-06-13 JP JP7795088U patent/JPH02743U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6236547B2 (ru) * | 1980-01-31 | 1987-08-07 | Matsushita Electric Works Ltd | |
| JPS6373547A (ja) * | 1986-09-16 | 1988-04-04 | Nec Corp | 半導体装置のリ−ドフレ−ム |
| JPH01106461A (ja) * | 1987-10-20 | 1989-04-24 | Fujitsu Ltd | リードフレーム |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04170059A (ja) * | 1990-11-02 | 1992-06-17 | Nec Kyushu Ltd | リードフレーム |